Sector News

New ultra-compact wireless SoC from Nordic Semi for miniaturised applications

Fri, Dec 12, 2025

With the recently launched nRF54LV10A, Rutronik is expanding Nordic Semiconductor’s ultra-low-power wireless portfolio with a new, particularly energy-efficient system-on-chip (SoC) for miniaturised applications in the medical and wearable segment. The SoC combines an extremely compact chip-scale package with high computing power, advanced security features and a radio architecture that supports Bluetooth LE, proprietary 2.4 GHz protocols and Bluetooth channel sounding in low-voltage operation for the first time. Samples and development kits of the nRF54LV10A are available through an early access program.

The nRF54LV10A sets a new benchmark in the field of low-voltage wireless SoCs. Developed for battery-powered medical devices such as continuous glucose monitors (CGMs) and wearable biosensors, its supply voltage of only 1.2 to 1.7 volts allows it to be powered directly by silver oxide button cells – without additional voltage regulators.

At its core is a 128 MHz Arm Cortex-M33 processor combined with a 128 MHz RISC-V coprocessor, which provides accelerated calculations and energy-efficient processing. In addition, the SoC has 1 MB NVM and 192 KB RAM, enabling demanding real-time applications and wireless protocols to run simultaneously.

The integrated 2.4 GHz transceiver supports Bluetooth LE, Bluetooth Channel Sounding for accurate distance measurements, and proprietary protocols with data rates up to 4 Mbps – ideal for latency-critical sensor applications.

For safety-critical healthcare products, the nRF54LV10A offers comprehensive protection mechanisms, including secure boot, secure firmware update, trusted execution environment via Arm TrustZone, cryptographic accelerators and integrated tamper detection.

Nordic’s architecture – including low-leakage RAM, multi-protocol radio and global RTC in system-OFF state – facilitates the development of long-lasting wearables with minimal system complexity. Low-voltage GPIOs allow sensors and MCUs to be connected without level shifters, further reducing space requirements.

Application examples:
Continuous glucose monitors (CGMs)
Wearable biosensors & medical monitoring devices
Connected-health solutions
Fitness & wellness trackers
Low-voltage sensor nodes and compact IoT devices

www.rutronik24.de

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Innodisk unveils camera module and adapter board for Edge AI vision

Wed, Dec 10, 2025

Innodisk has announced its latest GMSL2TM camera module and adapter board series, designed to deliver long-distance, low-latency, and robust image transmission for demanding edge AI applications. Built for streamlined integration, the solution enables precise real-time analysis across mobility, robotics, and industrial surveillance applications.

The Innodisk GMSL2TM series supports cable lengths up to 15 meters with FAKRA cable, delivering up to 13MP high-resolution imaging. Powered by the Sony ISX031 sensor, featuring integrated ISP with High Dynamic Range (HDR) and LED Flicker Mitigation (LFM), the module captures clear, stable images in challenging lighting conditions from bright sunlight to dark tunnels, and removes visual artefacts caused by pulsed LED lighting. It ensures precise brightness control and consistent imaging performance.

With IP67/IP69K ruggedised housing, the GMSL2TM camera withstands high-pressure washing, dust, water, and vibration, which is ideal for mines, ports, construction vehicles, logistics facilities, and outdoor robotic systems.

To accelerate time-to-market and reduce integration complexity, Innodisk provides customisable adapter boards optimised for the NVIDIA Jetson Orin platform. This approach enables rapid development and validation for system integrators. The solution supports multi-camera, synchronised streaming. Customers can quickly implement multi-view AI perception and sensor fusion capabilities. This enhances AI accuracy and autonomous decision-making in real-world applications.

Innodisk, together with its subsidiary Aetina, offers edge AI heterogeneous platform solutions with comprehensive visual sensing capabilities, and also collaborates with partners including Advantech, ASUS, and ASRock Industrial to deploy GMSL2TM camera modules across multiple platforms, reaching a wider range of vertical markets.

www.innodisk.com

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Advantech and Axelera AI partnership to accelerate Edge AI innovation

Wed, Dec 10, 2025

Advantech has announced a new strategic collaboration with Axelera AI, a pioneering AIPU solution provider, to jointly develop a new generation of Edge AI acceleration modules powered by the Europa AIPU.

These joint solutions will complement Advantech’s existing suite of products that support Metis and target low-power, high-performance edge use cases. The partnership furthers Advantech’s commitment to integrating advanced AI acceleration technology, delivering high-performance solutions to market ahead of the industry curve and supporting customers across industrial automation, robotics, smart cities, and medical imaging to accelerate the adoption of edge AI applications.

“This collaboration with Axelera AI marks an important milestone in Advantech’s AI acceleration roadmap,” said Joey Hsu, Director of Advantech’s Embedded Sector. “By combining Axelera AI’s cutting-edge neural processing technology with Advantech’s system design expertise and global deployment capabilities, we are enabling customers to deploy cutting-edge AI solutions with greater speed and scalability.”

At the core of the partnership is Advantech’s new Edge AI Acceleration Module (EAI-3841 series), featuring the Europa AIPU, which delivers up to 629 TOPS of performance and supports up to 164GB of LPDDR5 memory. With eight AI cores, integrated RAM per compute unit, and a built-in video decoder, the module enables real-time, complex model analysis, including VLM, and VITs. Additionally, it is designed for companies seeking multi-camera analysis—ideal for robotic vision, intelligent surveillance, in-vehicle systems, and precision medical diagnostics.

“We are excited to further our collaboration with Advantech, a recognised leader in industrial edge computing,” said Nicolas Silvestre, Director of Sales, APAC – Axelera AI. “The integration of our Europa AIPU into Advantech’s platforms will empower customers with unprecedented AI performance and efficiency, enabling smarter, faster, and more sustainable edge applications.”

www.advantech.com

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Renesas releases Wi-Fi 6 and Wi-Fi/Bluetooth LE combo MCUs for IoT

Wed, Dec 10, 2025

Renesas Electronics has introduced the RA6W1 dual-band Wi-Fi 6 wireless microcontroller (MCU), along with the RA6W2 MCU that integrates both Wi-Fi 6 and Bluetooth Low Energy (LE) technologies. These connectivity devices address the growing demand for always-connected, ultra-low-power IoT devices across smart home, industrial, medical and consumer applications. Renesas also launched fully integrated modules that accelerate development with built-in antennas, wireless protocol stacks, and pre-validated RF connectivity.

Today’s IoT devices must stay always connected to improve application usability and response time, while maintaining the lowest possible power consumption to extend battery life or to meet eco-friendly regulations. Renesas’ Wi-Fi 6 MCUs offer features such as Target Wake Time (TWT), which enables extended sleep times without compromising cloud connectivity and power consumption. This is critical for applications such as environmental sensors, smart locks, thermostats, surveillance cameras, and medical monitors, where real-time control, remote diagnostics and over-the-air (OTA) updates are critical.

Additionally, both MCU groups are optimised for ultra-low power consumption, consuming as little as 200nA to 4µA in sleep mode and under 50µA in Delivery Traffic Indication Message (DTIM10). With the “sleepy connected” Wi-Fi functionality, these devices stay connected with minimal power draw, meeting the growing requirements of modern energy efficiency standards.

Built on the Arm Cortex-M33 CPU core running at 160 MHz with 704 KB of SRAM, the MCUs enable engineers to develop cost-effective, standalone IoT applications using integrated communication interfaces and analog peripherals, without the need for an external MCU. Customers also have the option to design with a host MCU that can be selected from Renesas’ broad RA MCU offerings and attach the RA6W1 and RA6W2 as connectivity and networking add-ons. Both RA6W1 and RA6W2 are designed to work with Renesas’ Flexible Software Package (FSP) and e² studio integrated development environment. As the first Wi-Fi MCUs in the RA portfolio, they offer a scalable platform that supports seamless software reuse across the RA family.

With support for both 2.4 and 5 GHz bands, both MCUs deliver superior throughput, low latency, and reduced power consumption. The dual-band capability dynamically selects the most suitable band based on real-time conditions, ensuring a stable and high-speed connection even in environments with many connected devices. Advanced features such as Orthogonal Frequency Division Multiple Access (OFDMA) and TWT boost performance and energy efficiency, making these solutions well suited for dense urban environments and battery-powered devices.

The RA6W1 and RA6W2 devices offer advanced built-in security including AES-256 encryption, secure boot, key storage, TRNG, and XiP with on-the-fly decryption to keep data safe from unauthorised access. The RA6W1 is RED certified (Radio Equipment Directive), which makes it easier for developers to future-proof their design. Additionally, the device is Matter ready and certified with Matter 1.4, and is compatible across smart home platforms. Renesas supports both MCUs and modules through the Renesas Product Longevity Program, offering 15-year support for MCUs and 10 years for modules.

Two types of modules, Wi-Fi 6 (RRQ61001) and Wi-Fi/Bluetooth LE combo (RRQ61051) simplify design by integrating certified RF components and wireless connectivity stacks that comply with global network standards. Supported RF certification standards include the U.S. (FCC), Canada (IC), Brazil (ANATEL), Europe (CE/RED), UK (UKCA), Japan (TELEC), South Korea (KCC), China (SRRC) and Taiwan (NCC). By integrating connectivity at the system level, the modules significantly reduce design effort and accelerate time to market.

The RA6W1 MCU is now available in FCQFN and WLCSP packages, along with the RRQ61001 and RRQ61051 modules. The RA6W2 MCU (BGA package) will be available in Q1/2026. The devices are supported by the FSP, e² studio, evaluation kit and software development kit (SDK) that include flash memory, PCB trace antennas, connectors and embedded power profiler for power consumption analysis. Renesas also offers comprehensive software tools to aid system application development, as well as the Production Line Tool (PLT) for production testing of wireless MCUs.

https://www.renesas.com/

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