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e-con Systems expands camera support for Renesas’ new RZ/G3E

Fri, Sep 19, 2025

e-con Systems has announced camera support for Renesas’ latest RZ/G3E microprocessor, strengthening its partnership with Renesas in powering next-generation embedded vision applications such as industrial automation, smart city, automotive and more. Building on their integration with Renesas’ RZ/V2N and RZ/V2H processors, e-con Systems now brings its production-ready camera modules to the newly launched RZ/G3E microprocessor.

The RZ/G3E microprocessor, part of Renesas’ scalable MPU portfolio, is engineered for low-power edge computing and advanced graphics-rich and vision-based applications, offering dual-display support, secure connectivity, and a high-performance Arm Cortex-A55 processor.

As part of its RZ/G3E-compatible offerings, e-con Systems provides:
• e-CAM22_CURZH – Full HD ultra-low light colour camera with Sony STARVIS IMX462 sensor. This camera excels in capturing high-quality images in challenging lighting conditions.
• e-CAM25_CURZH – Full HD Global Shutter camera with onsemi AR0234 sensor. Its global shutter capability, combined with a 120 fps frame rate, minimises frame-to-frame distortion, ensures distortion-free imaging for fast-moving objects.

Both cameras are equipped with a built-in ISP (Image Signal Processor), fully aligned with Renesas’ integration requirements for RZ/G3E. These modules are compatible with the RZ/G3E evaluation kit, and they are available for immediate evaluation.

“The Renesas RZ/G3E MPU’s advanced edge computing and low-power features align perfectly with our camera technology, enabling developers to build reliable and high-quality AI vision systems that operate efficiently even in demanding scenarios. Our collaboration with Renesas continues to drive innovation across industrial automation, robotics, and smart surveillance markets.” said Suresh Madhu, Head of Industrial Business Unit at e-con Systems.

“The Renesas RZ/GE is developed to target intelligent edge computing integrated with full graphics and high-speed capabilities including an Arm Ethos-U55 neural processing unit,” said Daryl Khoo, Vice President, Embedded Processing Product Group at Renesas. “We expected this collaboration with e-Con will help customers in the Vision AI market to simplify their design in order to realize faster time to market.”

www.e-consystems.com

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Melexis enhances smart IVT hall and shunt sensors with external NTC input

Thu, Sep 18, 2025

Melexis enhances its smart IVT (current, voltage & temperature) sensing platform by adding a negative temperature coefficient (NTC) resistor input capability to the MLX91230 (Hall-effect) and MLX91231 (shunt interface). This upgrade enables more precise external temperature measurement alongside existing junction readings, helping engineers to address the need for comprehensive monitoring in safety-critical applications.

The integration of the NTC input into the MLX91230 and MLX91231 sensors improves the detection of variations in system temperatures. For the MLX91231 (shunt interface) in particular, it offers an additional use case of compensating the shunt resistor’s residual variability over temperature, leading to a further increase of current sensing accuracy. Furthermore, the new NTC input is ASIL C compliant, allowing for deployment in safety-critical automotive applications, including automotive batteries, DC fast charging, smart pyro-fuses, and power distribution modules.

The new NTC input pin enables engineers to monitor and apply post-processing to the temperature of an external component using the same integrated circuit (IC) that performs current sensing. With this expanded functionality, current, voltage, and both junction and external NTC-based temperature are all measured through a single device, streamlining development and improving system reliability. Moreover, the ASIL C functional safety compliance to ISO 26262 applies to the current, voltage, and external NTC measurement, as well as the diagnosable overcurrent detection (OCD). The OCD also permits direct input to the pyro-fuse driver, enabling the simple deployment of smart pyro-fuses with fewer components.

These new features complement the already extensive functionality of the MLX91230 and MLX91231 sensors. Each device is equipped with a microcontroller unit (MCU) complete with onboard flash memory, facilitating the deployment of custom software and allowing for robust compensation of any system discrepancies. Furthermore, the LIN output option allows for simple integration with 12V battery applications and power distribution modules, while UART permits direct communication with the Battery Monitoring System (BMS) that is starting to find its way into the Battery Disconnect Unit (BDU). For remote BMS systems, UART-over-CAN can leverage a more robust physical layer while maintaining lower overhead layers above that characterise the point-to-point communication of the current sensor module to the BMS.

As well as vehicular deployments, the expanded capabilities of the new MLX91230 and MLX91231 will also benefit other high and low-voltage battery solutions, including Battery Energy Storage Systems (BESS), solar panel installations, and e-bikes, providing precise temperature monitoring for improved system management.

https://www.melexis.com/

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Fisego and Panasonic collaborate for smart power strips with integrated safety technology

Wed, Sep 17, 2025

Panasonic has announced a strategic collaboration with Fisego Holding GmbH. The start-up based in Hesse, Germany, is setting new standards in fire prevention with its advanced fire protection systems and smart power strips featuring integrated safety technology. A key component of these next-generation devices is Panasonic Industry’s polarised DW-YL relay.

The already available Fisego EINS automatically cuts off the power supply in the event of technical faults or imminent fire hazards and sends a real-time alert to the user via the associated app. This not only protects property but, more importantly, safeguards human life. The 20A relay stands out for its high inrush current capability of up to a 320A, making the power strip suitable for almost any load scenario. The latest iteration of the DW relay has been structurally optimised: enhancements, including improvements to the contact materials, ensure the contacts do not weld – even when switching capacitive loads with high inrush currents. The smart sockets are VDE-certified and offer a wide range of applications, from protecting large appliances to integration in smart home environments and industrial settings. Notably, Fisego’s sockets are the only smart sockets worldwide to hold a VDE certification.

Fisego’s products are distinguished by the use of sustainable materials that offer excellent energy efficiency, reduce environmental impact and lower operating costs. Panasonic Industry’s relays contribute significantly to these benefits. Their polarised drive system optimises energy consumption, reduces the overall system power demand of the power strip and extends the product’s lifespan. This also results in reduced heat generation within the housing, which, combined with the compact footprint of the DW-YL relay, supports stringent space-saving design requirements.

https://www.fisego.de

http://industry.panasonic.eu

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Ambient Scientific announces new AI-native processor for edge applications

Wed, Sep 17, 2025

Ambient Scientific has launched the GPX10 Pro, a system-on-chip (SoC) which uses innovative AI-native silicon technology to enable high-performance AI inference on battery-powered edge devices.

The GPX10 Pro’s AI engine supports all important neural networking model types, including CNNs, RNNs, LSTMs and GRUs, locally at the edge. Offering up to 100x improvements in power, performance and area compared to conventional 32-bit microcontrollers, the GPX10 Pro is based on Ambient Scientific’s proprietary DigAn silicon architecture.

This technology enables a neural network model’s matrix-multiply operations and activation flows to be mapped directly to in-memory analog compute blocks, a structure which eliminates the wasted cycles and overheads of a conventional processor’s general-purpose instruction set.

As a result, the GPX10 Pro performs common edge AI functions such as voice recognition, keyword spotting, low-frequency computer vision and intelligent sensing much faster and at much lower power than today’s MCUs, NPUs or GPUs can.

The GPX10 Pro is a highly integrated SoC which enables local AI inference in edge and endpoint devices, even those powered by just a single coin cell battery.

AI processing is performed in two sets of five MX8 AI cores in two separate power domains. One set is in an always-on block which supports ultra-lower power sensor interfacing and fusion – for instance, when performing always-on keyword spotting, the chip consumes less than 100µW. The 10 MX8 cores perform up to 2,560 multiply-accumulate (MAC) operations per cycle, producing total peak AI throughput of 512 GOPs.

The GPX10 Pro’s compute function is supported by 2MB of on-chip SRAM – ten times more than in the existing GPX10 – to enable implementation of larger and more complex AI models.

The GPX10 Pro also features an Arm Cortex-M4F CPU core for classic control functions. Integrated analog functionality includes an ultra-low power ADC, enhanced I2S logic, and interfaces for up to eight simultaneous analog and 20 digital sensors.

Ambient Scientific provides the Nebula AI enablement toolchain to accelerate the training, development and deployment of AI models to the GPX10 and GPX10 Pro. It is compatible with leading model training frameworks including TensorFlow, Keras and ONNX. The chip’s AI cores, which are programmable in the Nebula toolchain, give designers the flexibility to adapt to evolving AI model types and topologies.

Ambient Scientific also provides the SenseMesh hardware sensor fusion layer, which enables low-latency sensor fusion by connecting multiple sensors to a core via a tightly-coupled mesh. This produces instant responses to trigger events, and ultra-low Idle mode power, as it offloads sensor polling from the CPU.

https://www.ambientscientific.ai/

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e-con Systems expands camera support for Renesas’ new RZ/G3E

Melexis enhances smart IVT hall and shunt sensors with external NTC input

Fisego and Panasonic collaborate for smart power strips with integrated safety technology

Ambient Scientific announces new AI-native processor for edge applications

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