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New EnOcean bluetooth module with doubled radio transmission power

Tue, Jan 23, 2024

With the new EnOcean PTM 216B module, customers can now address even more applications thanks to the use of the latest generation kinetic harvester ECO 260. The combination of the new harvester with the latest generation system design, allows for more than double the radio transmission power compared to its highly successful predecessor, the PTM 215B. This significantly increases the usable communication distance. This enhancement enables control of high-bay lighting, expanding the application areas to include warehouses and architectural projects with high ceilings. PTM 216B brings great flexibility in terms of installation locations and repositioning capabilities. In modern offices with adaptable layouts and flexible walls, the elimination of wiring significantly streamlines the installation process.

EnOcean devices such as PTM 216B can be quickly configured using Near Field Communication (NFC) technology. NFC is a short-range wireless technology that enables communication between devices in close proximity, typically within a few centimetres. It allows two devices equipped with NFC capabilities to establish a connection by bringing them close together, triggering the exchange of data. A common use is for making contactless payments.

The integration of EnOcean devices into networks via NFC provides a simple, quick and reliable way of setting up lighting installations.

Energy-harvesting switches based on the PTM 216B and other EnOcean switch modules are available in a wide range of designs from multiple switch manufacturers around the world, all of which blend well into any environment. The unique combination of these features makes PTM 216B an ideal for lighting control and building automation use cases. Official switch OEM partners make use of the “Battery-free by EnOcean” brand to make sure it contains genuine technology from EnOcean for real maintenance-free operation in the field.

This new module will be featured at the EnOcean booth at Light + Building in Frankfurt from March 3-8, 2024. At the show, EnOcean will focus on sustainable IoT for green and healthy buildings. New energy harvesting products as well as IoT solutions and smart servers that help analyse the collected data and make informed decisions to optimise building performance will be at the heart of the EnOcean show presence.

https://www.enocean.com

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Renesas debuts its lowest power consumption, dual-core bluetooth low energy SoC with integrated flash

Fri, Jan 19, 2024

Renesas has introduced the DA14592 Bluetooth Low Energy (LE) System-on-Chip (SoC) representing Renesas’ lowest power consumption and smallest, multi-core (Cortex-M33, Cortex-M0+), Bluetooth LE device. By carefully balancing tradeoffs between on-chip memory (RAM/ROM/Flash) and SoC die size (for cost), the DA14592 is very well suited to a broad range of applications including connected medical, asset tracking, human interface devices, metering, PoS readers and ‘crowd-sourced location’ (CSL) tracking.

The DA14592 utilises a new low-power mode to offer 2.3mA radio transmit current at 0dBm and 1.2mA radio receive current. Additionally, it supports an ultra-low hibernation current of only 90nA, extending shelf-life for end-products shipped with ‘battery connected’, and ultra-low active current at 34µA/MHz for products requiring significant application processing.

Operating from only a system clock and its accurate on-chip RCX, this device removes the need for a sleep mode crystal in the majority of applications. Its reduced eBOM, coupled with the DA14592’s small package (offered in WLCSP: 3.32mm x 2.48mm and FCQFN: 5.1mm x 4.3mm) also presents designers with an small solution footprint. The DA14592 also includes a high-precision, sigma-delta ADC, up to 32 GPIOs and unlike other SoCs in its class, it offers a QSPI supporting external memory (Flash or RAM) expansion for applications requiring extra memory.

Renesas has integrated all external components required to implement a Bluetooth LE solution into the DA14592MOD module. It offers customers the fastest time-to-market and reduced overall project cost. Emphasis has been placed in the design of this module to ensure maximum design flexibility by comprehensively routing the DA14592’s functions to the outside of the module and using castellated pins for easy/low-cost module attachment during development.

“The DA14592 and DA14592MOD extend our leadership in Bluetooth LE SoCs with our trademark low power consumption and best-in-class eBOMs,” said Davin Lee, Sr. Vice President and General Manager of the Analog and Connectivity Product Group for Renesas. “In addition, we have listened to our customers and continue to expand our product support by offering reference designs for applications such as crowd-sourced locationing, helping our customers to more easily differentiate their products, delivering premium value while maintaining lowest costs.”

https://www.renesas.com/DA14592.

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Rohm announces industry’s first speech synthesis ICs dedicated for acoustic vehicle alerting systems in xEVs

Thu, Jan 18, 2024

The ROHM group company LAPIS Technology has developed the industry’s first speech synthesis ICs – the ML22120xx series (ML22120TB, ML22120GP) – designed for AVAS in xEVs (electric vehicles).

In order to achieve a carbon neutral (decarbonised) society, the number of hybrid and electric vehicles that silently operate on motor power continues to increase – prompting AVAS regulations to be enacted that require a warning sound to alert pedestrians of their approach. However, when generating a warning sound using an MCU, the pitch and volume must be smoothly controlled and characteristics adjusted to match the vehicle geometry. This increases MCU software development load requiring verification with other software processes inside the MCU. In response, LAPIS Technology released new products that contribute to reducing the burden of AVAS development by leveraging experience and technology with speech synthesis ICs. The aim: achieving a high-fidelity sound using a novel hardware-based configuration.

The ML22120TB and the ML22120GP integrate hardware functions that include a warning sound generator, fader, and equaliser. Unlike MCU-based designs, the hardware configuration eliminates the need for software validation – significantly reducing development time. At the same time, dedicated GUI software makes it easy to comply with regulations for volume and frequency characteristics required for AVAS.

The system of new ICs can be controlled by simple commands, allowing warning sound to be started in less than one-tenth the time of conventional MCU-generated systems. An included fault detection function detects both erroneous communication with the main controller and erroneous oscillation caused by external components – contributing to vehicle reliability.

An evaluation board along with a Sound Device Control Kit [SDCK3] that includes dedicated GUI software are available, enabling easy evaluation of everything from sound generation to correction and trial listening of alert sounds.

https://www.rohm.com/lapis-tech/product/speech/ml221

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Novosense announces quad-channel digital isolators for industrial and automotive applications

Thu, Jan 18, 2024

Novosense Microelectronics has expanded its family of digital isolators with quad-channel devices that provide the performance and protection demanded by the latest industrial and automotive applications. The new NSI824xWx high-reliability digital isolators provide compact and efficient protection and level shifting in applications ranging from solar inverters and energy storage to industrial automation and electric vehicles.

UL1577-qualified for safety, the ultra-wide body NSI824xWx industrial and automotive grade isolators combine robust EMC performance with high levels of protection against system-level electrostatic discharge (ESD), electrical fast transients (EFTs) and voltage surges. Each device offers an insulation voltage up to 8kVrms, chip-level ESD HBM protection to ±8kV and common-mode transient immunity (CMTI) up to 200kV/μs.

The isolators are available with options for four forward channels, three forward and one reverse channel or two forward and two reverse channels. Default output state on power loss can be set to low or high. Channel speeds up to 150Mbps are supported, while a wide input voltage range of 2.5V to 5.5V simplifies level shift operations by ensuring compatibility with a wide variety of digital interfaces. A low power consumption of 1.5mA per channel (at speeds of 1Mbps) helps designers to meet system efficiency targets.

As with all members of the range, the latest NSI824x devices employ an adapted capacitive isolator technology in which the digital signal undergoes modulation by an RF carrier generated on the transmitter side and is then demodulated on the receiver side. Subsequently, the signal is transmitted via a capacitive isolator and demodulated on the receiver side. Use of Novosense’s proprietary Adaptive OOK modulation technology is key to robust performance, which includes high noise resistance and low EMI.

The devices are supplied in an SOWW16 package, can support 15mm creepage distance and operate across a wide temperature range of -55℃ to 125℃, and are fully compliant with all relevant UL, CQC, CSA and VDE safety standards. In industrial automation systems, they can be used for industrial control, industrial motor drive applications, industrial transportation, instrumentation, industrial field instruments, isolated SPI, RS232, and RS485 applications, universal multi-channel isolators, and motor control. Automotive targets will include automobile sensors, electric drives and power supplies and battery management systems.
https://www.novosns.com/en

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New EnOcean bluetooth module with doubled radio transmission power

Renesas debuts its lowest power consumption, dual-core bluetooth low energy SoC with integrated flash

Rohm announces industry’s first speech synthesis ICs dedicated for acoustic vehicle alerting systems in xEVs

Novosense announces quad-channel digital isolators for industrial and automotive applications

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