Tiny position-sensing switches from Omron have resistors for functional safety

Omron has extended its portfolio of sealed basic switches, adding the D2EW-R series that contains integrated resistors to detect events such as malfunctions and tampering.

Depending on the voltage across the D2EW-R internal resistors, the system can differentiate between normal switch-open or switch-closed status and an open circuit or short circuit at the terminals. By helping detect faults such as wiring defects, equipment failures, or malicious damage, these switches can extend diagnostic monitoring in industrial automation and enhance security protection for equipment such as vending machines and smart meters.

Using the underlying architecture of Omron’s D2EW switches, the new D2EW-R series has the same tiny 8.3mm x 7.0mm x 5.3mm outline and supports multi-angle operation without using a lever. These features save space and enhance flexibility in customer-unit design, while the sliding contact structure ensures high reliability and quiet operation. Options include polarised mounting posts or M3-screw mount that ease installation in small spaces, as well as press-fit electrical terminals, solder terminals, and moulded lead wires with straight or angled exit.

In addition, the switch mechanism has IP67 protection and is highly resistant to vibration and shock. With their built-in resistors, D2EW-R variants are rated for operation from 5V to 18V over the temperature range from -40°C to 85°C.

The D2EW-R series is a suitable solution for security applications requiring anti-theft or anti-tamper functionality, such as smart meters, safety boxes, surveillance cameras, and automated locking systems. Additionally, it is well-suited for use in factory automation systems that require failure detection and diagnostics, including industrial robots, autonomous mobile robots (AMRs), and automated guided vehicles (AGVs).

The new switches join the extensive family of sealed miniature switches from OMRON that also includes D2AW, D2AW-R, D2GW, and D2QW sliding-contact types for levered and lever-free operation and 0.1A current rating. Other switches, such as the D2VW, D2SW, and D2HW, which are capable of handling higher current load, are also available.

https://components.omron.com

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Quectel Wi-Fi 6/Bluetooth 5.3 modules for smart and industrial IoT applications

Mouser is now shipping the new FCMA62N Wi-Fi 6/Bluetooth 5.3 modules from Quectel. The FCMA62N modules boast an ultra-compact LCC form factor (38.3mm × 21.6mm × 4.75mm), with multiple low-power consumption modes and custom features that provide flexibility and versatility for smart homes, industrial IoT, automotive, and medical device applications.

The Quectel FCMA62N modules are optimised for size and cost savings with an integrated, high-performance Arm® Cortex®-M33 processor running up to 260MHz. These devices support the IEEE 802.11a/b/g/n/ac/ax Wi-Fi protocol and Bluetooth Low Energy (BLE) 5.3. The modules feature built-in 1.2MB SRAM and 8MB flash, ensuring efficient performance that complies with WPA-PSK, WPA2-PSK, and WPA3-SAE security standards with an AES-128 encryption algorithm.

The FCMA62N modules support UART, SWD, and GPIO interfaces (by default), as well as SPI, I2C, I2S, and PWM interfaces in Quectel’s QuecOpen solutions. QuecOpen is a development platform that enables Quectel IoT modules to act as the main processor for an IoT device, allowing customers to program their own applications alongside the module’s standard processes. The FCMA62N modules support both the QuecOpen solution and standard AT commands with a compact protocol that enhances user product development.

The FCMA62N modules are supported by the FCMA62NABTB-0P-08 and FCMA62NABTB-1X-08 evaluation boards. The evaluation boards each feature a pre-mounted FCMA62N module, debugger, and PCB antenna.

https://eu.mouser.com

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ROHM develops an ultra-compact MOSFET ideal for fast charging

ROHM has developed a 30V N-channel MOSFET — AW2K21 — in a common-source configuration that achieves an industry-leading ON-resistance of 2.0mΩ (typ.) in a compact 2.0mm × 2.0mm package.

With the rise of compact devices featuring large-capacity batteries, such as smartphones, the need for fast charging functionality to shorten charging times continues to grow. These applications require bidirectional protection to prevent reverse current flow to peripheral ICs and other components when not actively supplying or receiving power. What’s more, fast charging involves high current power transfer, leading smartphone manufacturers to demand stringent specifications for MOSFETs, including a maximum current rating of 20A, breakdown voltage between 28V and 30V, and an ON-resistance of 5mΩ or less.

In response, ROHM developed an ultra-compact low ON-resistance MOSFET optimised for fast high-power charging. The AW2K21 adopts a proprietary structure that enhances cell density while minimising the ON-resistance per unit chip area. Two MOSFETs are integrated into a single package, allowing a single part to support bidirectional protection applications (commonly required in power supply and charging circuits).

The proprietary structure also places the drain terminal on the top surface, unlike on the backside in standard vertical trench MOS structures. This enables the use of a WLCSP, which achieves a larger chip-to-package area ratio that further reduces ON-resistance per unit area. As a result, the new product not only minimises power loss but also supports high current operation, making it ideal for high-power fast charging applications despite its ultra-compact size.

For example, in power supply and charging circuits for compact devices, standard solutions typically require two 3.3mm × 3.3mm MOSFETs. In contrast, the AW2K21 can achieve the same functionality with a single 2.0mm × 2.0mm unit, reducing the footprint and ON-resistance by approximately 81% and 33%, respectively. Even compared to similarly sized GaN HEMTs, ON-resistance is decreased by up to 50%, contributing to lower power consumption and increased space savings across a variety of applications.

The AW2K21 is also suitable for use as a unidirectional protection MOSFET in load switch applications, where it maintains the industry’s lowest ON-resistance. At the same time, ROHM is further pushing the limits of miniaturisation with the development of an even smaller 1.2mm × 1.2mm model.

https://www.rohm.com

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Renesas announces new MCU group targeting AI and ML applications

Renesas has introduced the RA8P1 microcontroller (MCU) Group targeted at Artificial Intelligence (AI) and Machine Learning (ML) applications, as well as real-time analytics. The new MCUs establish a new performance level for MCUs by combining 1GHz Arm Cortex-M85 and 250MHz Cortex-M33 CPU cores with the Arm Ethos-U55 Neural Processing Unit (NPU). This combination delivers the highest CPU performance of over 7300 CoreMarks and AI performance of 256 GOPS at 500 MHz.

The RA8P1 is optimised for edge and endpoint AI applications, using the Ethos-U55 NPU to offload the CPU for compute intensive operations in Convolutional and Recurrent Neural Networks (CNNs and RNNs) to deliver up to 256 MACs per cycle that yield 256 GOPS performance at 500 MHz. The new NPU supports most commonly used networks, including DS-CNN, ResNet, Mobilenet TinyYolo and more. Depending on the neural network used, the Ethos-U55 provides up to 35x more inferences per second than the Cortex-M85 processor on its own.

The RA8P1 MCUs are manufactured on the 22ULL (22nm ultra-low leakage) process from TSMC, enabling ultra-high performance with very low power consumption. This process also enables the use of embedded Magnetoresistive RAM (MRAM) in the new MCUs. MRAM offers faster write speeds along with higher endurance and retention compared with Flash.

Renesas has integrated dedicated peripherals, ample memory and advanced security to address Voice and Vision AI and Real-time Analytics applications. For vision AI, a 16-bit camera interface (CEU) is included that supports sensors up to 5 megapixels, enabling camera and demanding Vision AI applications. A separate MIPI CSI-2 interface offers a low pin-count interface with two lanes, each up to 720Mbps. In addition, multiple audio interfaces including I2S and PDM support microphone inputs for voice AI applications.

The RA8P1 offers both on-chip and external memory options for efficient, low latency neural network processing. The MCU includes 2MB SRAM for storing intermediate activations or graphics framebuffers. 1MB of on-chip MRAM is also available for application code and storage of model weights or graphics assets. High-speed external memory interfaces are available for larger models. SIP options with 4 or 8 MB of external flash in a single package are also available for more demanding AI applications.

Along with the RA8P1 MCUs, Renesas has introduced RUHMI (Renesas Unified Heterogenous Model Integration), a comprehensive framework for MCUs and MPUs. RUHMI offers efficient AI deployment of the latest neural network models in a framework agnostic manner. It enables model optimisation, quantisation, graph compilation and conversion, and generates efficient source code. RUHMI provides native support for machine-learning AI frameworks such as TensorFlow Lite, Pytorch & ONNX. It also provides the necessary tools, APIs, code-generator, and runtime needed to deploy a pre-trained neural network, including ready-to-use application examples and models optimised for RA8P1. RUHMI is integrated with Renesas’s own e2 studio IDE to allow seamless AI development. This integration will facilitate a common development platform for MCUs and MPUs.

The RA8P1 MCUs provide leading-edge security for critical applications. The new Renesas Security IP (RSIP-E50D) includes numerous cryptographic accelerators, including CHACHA20, Ed25519, NIST ECC curves up to 521 bits, enhanced RSA up to 4K, SHA2 and SHA3. In concert with Arm TrustZone®, this provides a comprehensive and fully integrated secure element-like functionality. The new MCUs also provides strong hardware Root-of-Trust and Secure Boot with First Stage Bootloader (FSBL) in immutable storage. XSPI interfaces with decryption-on-the-fly (DOTF) allow encrypted code images to be stored in external flash and decrypted on the fly as it is securely transferred to the MCU for execution.

https://www.renesas.com

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