Energy harvester from ZF for windows and doors

Installed in applications for windows and doors, the Energy Harvester from ZF contribute to energy efficiency and building security. They monitor if a window is open or closed and prevent for example the waste of heating energy. By RF technology, the current status of a window will be reported to the building technology and when the window is open, the heating or air-condition will turn down. If a window or door has not been closed, this information can also be checked on a central unit. Thus, the effort for the guard duty of big commercial buildings will be reduced.

By each actuation of the ZF Energy Harvester, sufficient energy for the transmission of a RF protocol is generated. The connected radio electronics transfers the status information to a receiver unit. So, window handle, window latch or door lock inform with every opening and closing about the change of status.

The completely battery-free and wireless technology from ZF is free of maintenance and flexible in use. It can be realised with different RF protocols such as Bluetooth®, EnOcean or customer-specific RF protocols.

https://switches-sensors.zf.com/

 

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Nexperia broadens its range of discrete FET solutions at APEC 2024

Nexperia bringing its product innovations to APEC and has announced the release of several new MOSFETs to further broaden its range of discrete switching solutions for use in various applications across multiple end markets. This release includes 100 V application specific MOSFETs (ASFETs) for PoE, eFuse and relay replacement in 60% smaller DFN2020 packaging, and 40 V NextPowerS3 MOSFETs with improved electromagnetic compatibility (EMC) performance.

PoE switches typically have up to 48 ports, each requiring 2 MOSFETs for protection. With up to 96 MOSFETs on a single PCB, any reduction in device footprint is attractive. For this reason, Nexperia has released 100 V PoE ASFETs in 2 mm x 2 mm DFN2020 packaging which occupies 60% less space than previous versions in LFPAK33 packaging. A critical function of these devices is to protect PoE ports by limiting inrush currents while safely managing fault conditions. To manage this scenario, Nexperia has enhanced the safe operating area (SOA) of these devices by up to 3x with only a minimal increase in RDS(on). These ASFETs are also suitable for battery management, Wi-Fi hotspot, 5G picocell and CCTV applications and can serve as replacements for mechanical relays in smart thermostats, for example.

EMC-related issues caused by MOSFET switching usually only emerge late in the product development life cycle and resolving them can incur additional R&D costs and delay market release. Typical solutions include using significantly more expensive MOSFETs with lower RDS(on) (to slow down switching and absorb excessive voltage ringing) or to fit an external capacitive snubber circuit but this approach has the disadvantage of increasing component count. Nexperia has optimised its 40 V NextPowerS3 MOSFETs to offer similar EMC performance as that which can be achieved using an external snubber circuit, while also offering higher efficiency. These MOSFETs are suitable for use in switching converters and motor controllers across various applications and are available in LFPAK56 packaging.

To learn more about Nexperia’s PoE ASFETs visit: https://nexperia.com/asfets-for-poe
To learn more about Nexperia’s NextPowerS3 MOSFETs visit: https://nexperia.com/nextpowers3

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Infineon unveils high density power modules

Artificial Intelligence is currently driving an exponential increase in global data generation, and consequently increasing the energy demands of the chips supporting this data growth. Infineon has launched its TDM2254xD series dual-phase power modules that enable best-in-class power density, quality and total cost of ownership (TCO) for AI data centres. The TDM2254xD series products blend innovation in robust OptiMOS MOSFET technology with novel packaging and proprietary magnetic structure to deliver industry-leading electrical and thermal performance with robust mechanical design. This lets data centres operate at higher efficiency to meet the high power demands of AI GPU (Graphic Processor Unit) platforms while also significantly reducing TCO.

Given that AI servers require 3 times more energy than traditional servers, and data centres already consume more than 2 percent of the global energy supply, it is essential to find innovative power solutions and architecture designs that further drive decarbonisation. Paving the way for the green AI factory, Infineon’s TDM2254xD dual-phase power modules combine with XDP Controller technology to enable efficient voltage regulation for high-performance computing platforms with superior electrical, thermal and mechanical operation.

Infineon introduced the TDM2254xD series at the Applied Power Electronics Conference (APEC). The modules’ unique design allows for efficient heat transfer from the power stage on to the heat sink through novel inductor design that is optimised to transfer current and heat, thereby allowing for a 2 percent higher efficiency than industry average modules at full load. Improving power efficiency at the core of a GPU yields significant energy savings at scale. This translates into megawatts saved for data centres computing generative AI and in turn leads to reduced CO 2 emissions and millions of dollars in operating cost savings over the system’s lifetime.

“This unique Product-to-System solution combined with our cutting-edge manufacturing lets Infineon deliver solutions with differentiated performance and quality at scale, thereby significantly reducing total cost of ownership for our customers,” said Athar Zaidi, Senior Vice President, Power & Sensor Systems at Infineon Technologies. “We are excited to bring this solution to market; it will accelerate computing performance and will further drive our mission of digitalisation and decarbonisation.”

https://www.infineon.com/cms/en/product/promopages/power-modules/

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Renesas develops new AI accelerator for lightweight AI models

Renesas has announced the development of embedded processor technology that enables higher speeds and lower power consumption in microprocessor units (MPUs) that realise advanced vision AI.

The newly developed technologies are a dynamically reconfigurable processor (DRP)-based AI accelerator that efficiently processes lightweight AI models, and Heterogeneous architecture technology that enables real-time processing by cooperatively operating processor IPs, such as the CPU.

Renesas produced a prototype of an embedded AI-MPU with these technologies and confirmed its high-speed and low-power-consumption operation. It achieved up to 16 times faster processing (130 TOPS) than before the introduction of these new technologies, and world-class power efficiency (up to 23.9 TOPS/W at 0.8 V supply).

Amid the recent spread of robots into factories, logistics, medical services, and stores, there is a growing need for systems that can autonomously run in real time by detecting surroundings using advanced vision AI. Since there are severe restrictions on heat generation, particularly for embedded devices, both higher performance and lower power consumption are required in AI chips. Renesas developed new technologies to meet these requirements.

As a typical technology for improving AI processing efficiency, pruning is available to omit calculations that do not significantly affect recognition accuracy. However, it is common that calculations that do not affect recognition accuracy randomly exist in AI models. This causes a difference between the parallelism of hardware processing and the randomness of pruning, which makes processing inefficient.

To solve this issue, Renesas optimised its unique DRP-based AI accelerator (DRP-AI) for pruning. By analysing how pruning pattern characteristics and a pruning method are related to recognition accuracy in typical image recognition AI models (CNN models), we identified the hardware structure of an AI accelerator that can achieve both high recognition accuracy and an efficient pruning rate, and applied it to the DRP-AI design. In addition, software was developed to reduce the weight of AI models optimised for this DRP-AI. This software converts the random pruning model configuration into highly efficient parallel computing, resulting in higher-speed AI processing. In particular, Renesas’ highly flexible pruning support technology (flexible N:M pruning technology), which can dynamically change the number of cycles in response to changes in the local pruning rate in AI models, allows for fine control of the pruning rate according to the power consumption, operating speed, and recognition accuracy required by users.

This technology reduces the number of AI model processing cycles to as little as one-sixteenth of pruning incompatible models and consumes less than one-eighth of the power.
Robot applications require advanced vision AI processing for recognition of the surrounding environment. Meanwhile, robot motion judgment and control require detailed condition programming in response to changes in the surrounding environment, so CPU-based software processing is more suitable than AI-based processing. The challenge has been that CPUs with current embedded processors are not fully capable of controlling robots in real time. That is why Renesas introduced a dynamically reconfigurable processor (DRP), which handles complex processing, in addition to the CPU and AI accelerator (DRP-AI). This led to the development of heterogeneous architecture technology that enables higher speeds and lower power consumption in AI-MPUs by distributing and parallelising processes appropriately.

A DRP runs an application while dynamically changing the circuit connection configuration between the arithmetic units inside the chip for each operation clock according to the processing details. Since only the necessary arithmetic circuits operate even for complex processing, lower power consumption and higher speeds are possible. For example, SLAM (Simultaneously Localisation and Mapping), one of the typical robot applications, is a complex configuration that requires multiple programming processes for robot position recognition in parallel with environment recognition by vision AI processing. Renesas demonstrated operating this SLAM through instantaneous program switching with the DRP and parallel operation of the AI accelerator and CPU, resulting in about 17 times faster operation speeds and about 12 times higher operating power efficiency than the embedded CPU alone.

Renesas created a prototype of a test chip with these technologies and confirmed that it achieved the world-class, highest power efficiency of 23.9 TOPS per watt at a normal power voltage of 0.8 V for the AI accelerator and operating power efficiency of 10 TOPS per watt for major AI models. It also proved that AI processing is possible without a fan or heat sink.
Utilising these results helps solve heat generation due to increased power consumption, which has been one of the challenges associated with the implementation of AI chips in a variety of embedded devices such as service robots and automated guided vehicles. Significantly reducing heat generation will contribute to the spread of automation into various industries, such as the robotics and smart technology markets. These technologies will be applied to Renesas’ RZ/V series—MPUs for vision AI applications.

https://renesas.com.

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