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Rutronik adds ‘fastest’ time-of-flight sensor from STMicroelectronics

Tue, May 15, 2018

The VL53L1CXV0FY/1 from STMicroelectronics is claimed to be the fastest, miniature time-of-flight (ToF), laser-ranging sensor. It joins the FlightSense and is now available from Rutronik. It has long-distance accurate ranging up to four metres and fast ranging frequency up to 50Hz.

The VL53L1CXV0FY/1 is particularly well suited for applications where user detection is required, e.g. smart home and smart lighting in target applications such as autonomous devices like service robots, drones, smart shelves and vending machines as well as gesture recognition and laser-assisted autofocus systems.

The sensor’s dimensions are 4.9 x 2.5 x 1.56mm. The VL53L1CXV0FY/1 sensor integrates a SPAD receiving array, a 940nm invisible Class1 laser emitter, physical infra red filters, and optics to achieve the best ranging performance in various ambient lighting conditions with a range of cover window options. Unlike conventional IR sensors, the VL53L1CXV0FY/1 uses ST’s latest generation ToF technology that allows absolute distance measurement whatever the target colour and reflectance, explains Rutronik.

It is possible to program the size of the region-of-interest on the receiving array, allowing the sensor field-of-view of 27 degrees to be customised. Setting a specific region of interest position can provide multi-zone operation control from the host. Additionally, the VL53L1CXV0FY/1 is pin-to-pin compatible with the VL53L0X FlightSense ranging sensor.

The VL53L1CXV0FY/1 can be hidden behind a selection of cover window materials and colours allowing designers to integrate them creatively into devices. The sensor provides a standard two-wire I²C interface with up to 400kHz and works with a single power supply (2v8).

For a fast design-in process, ST offers a software driver and code examples for turnkey ranging.

Rutronik UK operates as an independent company with a team of highly qualified employees with broad experience of the electronics industry. Parent company Rutronik Elektronische Bauelemente GmbH is one of the leading broadline distributors for semiconductors, passive and electromechanical components as well as storage technologies, displays and boards and wireless products. Rutronik primarily targets automotive, medical, industrial, home appliance, energy and lighting markets.

http://www.rutronik.com

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Integrated connected car module is scalable

Mon, May 14, 2018

Targeted at the global automotive industry, the Laird Modular Automotive Connectivity (MAX) module is believed to be the first fully integrated connected car platform.

The integrated and scalable module is for secure mobile connectivity and automotive Ethernet for reliable internet use inside and outside the vehicle.

Laird MAX has been introduced worldwide and brings together communications technologies, an open software concept, a Linux-based security module, and Laird’s integrated antenna system.

MAX enables a range of services for safety and comfort, explains Laird, from driver-assisted navigation, advanced diagnostics for maintenance, theft protection and over-the-air software updates that can be scaled to meet the needs of automakers and their customers.

Worldwide sales of connected cars are expected to reach 72.5 million in the next five years, according to industry analyst IHS Markit, with almost 70 per cent of all passenger vehicles sold around the globe will be exchanging data with external sources, bringing new services and new business models to bear in automotive markets by 2023.

The modularisation of MAX enables automakers to have a short time-to-market compared to tailor-made solutions, says Laird. It can be integrated into a Laird system solution, including control unit and antenna, and used for external service providers as the basis for a back-end connection or for app development.

Its scalability means it can cater for customers who only need networking for small batches.

Applications that can be implemented on MAX include internet gateway functionality, a remote diagnostic tool, a remote-control system, location functions, and driver statistics. It can be used to set up a wide range of services for OEMs, fleet operators and insurance companies.

MAX enables a connected vehicle to continuously and securely stream and share data with multiple wireless devices and applications inside and outside the vehicle’s immediate environment. It can serve as a communication basis for networked and autonomous vehicles in smart cities, as well as with trucks, fork-lifts or machines in networked logistics or for smart farming.

The use of custom features limits the number of components and their weight, to make MAX is environmentally-friendly, says Laird. By optimizing the energy management, the power consumption is reduced, which is a differentiation advantage especially for electric vehicles.

http://www.laird.com

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Software improves operation efficiency for distributed systems management

Fri, May 11, 2018

Designed to improve operational efficiency and decrease maintenance costs through a centralised interface for automating tasks, SystemLink application software is for distributed systems management.

NI has introduced the software in response to trends like the industrial IoT, 5G and the electrification of vehicles, coupled with maintaining distributed legacy systems. NI believes the drive towards connected and centrally co-ordinated systems has transformed theories and pilot projects into large-scale, distributed deployments. Companies derive returns from the actionable, data-driven insights that help them maximise uptime, increase efficiency and drive future product innovation. At the same time, companies need to balance their adoption of new, connected technologies while preserving support for valuable legacy assets with long life cycles.

Systems that manage, maintain and extract insight from small-scale pilots or groups of systems are relatively straightforward to implement, explains NI. The next challenge is to scale and manage large deployments, varying life cycle stages and distributed testers and nodes across entire plants, fabs and factories. This includes tasks like remote software and system configuration as well as data management and performance monitoring in industries from aerospace and defence to transportation and manufacturing.

SystemLink enables engineers to connect, deploy, and manage distributed systems, both NI and third-party, through a centralised interface accessible from anywhere. As a result it is possible to remotely configure and deploy software, monitor the health and performance of their equipment, manage alarms, and visualise application parameters. Additionally, engineers can automate the communication of data to

To meet demands like testing higher complexity devices under test and shorter timeframes, engineers need tools tailored to their needs. SystemLink is the latest addition to NI’s software-centric platform. It has LabVIEW engineering system design software at its core and TestStand test management software for overall execution. The workflow helps to improve the productivity of test and validation labs, says NI. Each piece of the workflow is also interoperable with third-party software to maximise code/IP reuse and draws on the LabVIEW Tools Network ecosystem of add-ons and tools for more application-specific requirements.

http://www.ni.com/systemlink

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Deep learning ASIC is in production qualification

Tue, May 01, 2018

Independent FinFET-class ASIC, custom IP and 2.5D packaging provider, eSilicon, has announced that the deep learning ASIC that taped out last September has moved to production qualification.

The ASIC includes custom pseudo two-port memories designed by eSilicon, TSMC’s Chip on Wafer on Substrate (CoWoS) technology, 28G SerDes, and four second-generation High-Bandwidth Memory (HBM2) stacks. eSilicon’s end-to-end 2.5D/HBM2 structure includes 2.5D ecosystem management, silicon-proven HBM2 PHY, ASIC physical design, 2.5D package design, manufacturing, assembly and test.

The CoWoS interposer is over 1,000 square mm and contains over 170,000 microbumps. The design has successfully passed test bring-up and is in final qualification, reports eSilicon. Four-high and eight-high HBM stack versions are in qualification. This design is in the industry vanguard of ASICs targeting deep learning applications, says eSilicon.

The 2.5D/HBM2 single package implementation gives the ASIC advantages such as orders of magnitude higher total bandwidth in a much smaller board footprint. Another benefit, says eSilicon, is that it affords highly parallel connections to memory stacks inside the package for fast access and a “significant” reduction in power consumption.

“This design greatly expands the possibilities for deep learning, and we are delighted to enter final qualification,” said Ajay Lalwani, vice president, global manufacturing operations at eSilicon. “TSMC’s 2.5D CoWoS packaging technology has been a key differentiater for this advanced design.”

As well as complex FinFET-class ASICs, custom IP and advanced 2.5D packaging solutions, eSilicon provides complete 2.5D/HBM2 and TCAM platforms for FinFET technology at 14,16 and 17nm as well as SerDes, specialised memory compilers and I/O libraries. It has a patented knowledge base and optimisation technology that it provides to customers serving the high-bandwidth networking, high-performance computing, artificial intelligence and 5G infrastructure markets.

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Picture credit – TSMC foundry

www.esilicon.com

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Rutronik adds ‘fastest’ time-of-flight sensor from STMicroelectronics

Integrated connected car module is scalable

Software improves operation efficiency for distributed systems management

Deep learning ASIC is in production qualification

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