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NB-IoT shield enhances ARIS-Edge platform

Fri, Nov 23, 2018

An NarrowBand IoT shield by Shiratech has been added to the ARIS (Arrow Renesas IoT Synergy) platform, available from the distributor Arrow Electronics. The ARIS-Edge-NB-IoT shield features a Quectel BG96 module and plugs onto the ARIS-Edge-S3 board, which is based on the low-power Renesas Synergy S3A3 microcontroller. These two boards combined, enable users to evaluate streaming of sensor data to Microsoft’s Azure cloud via a cellular connection (2G/3G, NB-IoT or CAT-M1 depending on network availability), easily and fast.

The shield has an Arduino form factor and the low-power Quectel BG96 LTE CAT-M1 and NB-IoT modem, together with built-in GPS plus an antenna. Download speed up to 300kbits per second and upload up to 375kbits per second are supported. The ARIS-Edge-S3 board features a radio module with Bluetooth Low Energy (BLE 4.1/4.2), Thread, and ZigBee stacks. The kit is suitable for home automation, smart meters, smart lighting, wearable electronics, medical monitors and industrial sensing. Arrow plans to add a LoRa shield as well.

The ARIS-Edge-S3 features a Bosch Sensortec BNO055 nine-degrees-of-freedom (9-DOF) application specific sensor node (ASSN). This sensor is widely used in robotics, augmented and virtual reality, drones, gaming, and other industrial applications. There is also an on-board BME280 environmental sensor from Bosch Sensortec, which combines temperature, humidity and pressure sensing, a separate MEMS microphone and an ambient light sensor for contextual awareness.

Arrow’s ARIS-Edge concept connects developers with the Renesas Synergy platform giving access to an optimised operating system, qualified stacks, consistent software libraries, and APIs that streamline IoT-device development and lower total cost of ownership.

Arrow Electronics maintains a network of more than 345 locations serving over 80 countries.

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http://www.arrow.com

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Energy harvesting embedded controller simplifies Industry 4.0

Fri, Nov 23, 2018

Renesas Electronics claims to accelerates sensor network gateway design with its RZ/N1S IO-Link Master development kit for the smart factory.

The IO-Link master development kit accelerates IO-Link-based application development for industrial networked devices in a smart factory. The development kit includes a board and pre-qualified sample software provided by TMG. The board has eight IO-Link connecters, allowing developers to immediately connect IO-Link slave devices and start the evaluation process.

Renesas believes that the development kit contributes to shorter prototype-to-production process time and helps to reduce the development burden for engineers.

The kit is supported by two CPUs that operate independently and simultaneously with a large built-in SRAM. The eight-port IO-Link Master is controlled by one CPU; the other CPU features an R-IN engine architecture and supports industrial Ethernet communication to the upper layers, such as PLC, without any external microcontroller, microprocessor, or memory like DDR. The two CPUs are integrated in a small 12 x 12mm LFBGA package.

The RZ/N1S IO-Link Master development kit reduces the system evaluation period by up to six months, reports Renesas. The all-in-one development kit makes it easy for users to begin evaluation immediately and accelerate their time to market.

Optimised for limited space and industrial environments, the board as 6Mbytes of on-chip SRAM which eliminates the need for external memory.

The small 12 x 12mm LFBGA package makes the master suited for PCBs in space-constrained industrial applications.

Renesas is demonstrating the new IO-Link master solution in booth 130, Hall 10.1, at the 2018 SPS IPC Drives, November 27-29, in Nuremberg, Germany.

The RZ/N1S IO-Link master solution is available now for rental.

Renesas Electronics delivers microcontorller, analogue, power, SoC products and integrated platforms, for automotive, industrial, home electronics, office automation and information communication technology applications.

This news story is brought to you by softei.com, the specialist site dedicated to delivering information about what’s new in the electronics industry, with daily news updates, new products and industry news.

To stay up-to-date, register to receive our weekly newsletters and keep informed of the latest technology news and new products from around the globe. Simply click this link to register here: softei.com

http://www.renesas.com

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Zynq UltraScale+ family is certified for AI-class devices

Thu, Nov 22, 2018

Xilinx has received the IEC 61508 specification certificate, issued by Exida, for the Zynq UltraScale+ MPSoC family. The processors has been assessed as SIL 3, HFT1 capable, according the IEC 61508 functional-safety specification. This means product developers can build systems including artificial intelligence (AI) for safety-critical applications using Xilinx’s feature-rich, integrated single-chip MPSoC family, with the assurance of IEC 61508 functional-safety certification up to Safety Integrity Level 3 (SIL 3).

The industry’s first commercial ARM-based SoC, the Zynq-7000 is able to demonstrate compliance to functional safety requirements for on-chip redundancy (HFT=1). The Zynq-7000 and Zynq UltraScale+ MPSoC families feature isolated function domains on a single die with hardware protection mechanisms, creating the required hardware fault tolerance consistent with on-chip redundancy. Developers can take advantage of the embedded FPGA fabric to accelerate performance beyond conventional software-based systems, explains Xilinx, to achieve the fast response times and low latency typically required of safety-critical systems. Xilinx has also introduced safety-enhanced automotive-qualified XA Zynq UltraScale+ MPSoCs, certified to ISO 26262 ASIL C (pictured).

Combined with the recent IEC 61508 safety certification of the supporting Vivado Design Suite by TÜV Süd and the MicroBlaze compiler for additional soft processors by SGS-TÜV Saar, Xilinx believes it provides a complete ecosystem with supporting documentation, assessment reports and IP, to minimise risks for customers.

Developers can find tools and resources at Xilinx’s online Functional Safety Lounge. Privileges include access to the Safety Manual for Zynq UltraScale+ MPSoC, device and architecture updates, tool-flows and documentation including future reports and assessments.

This news story is brought to you by softei.com, the specialist site dedicated to delivering information about what’s new in the electronics industry, with daily news updates, new products and industry news.

To stay up-to-date, register to receive our weekly newsletters and keep informed of the latest technology news and new products from around the globe. Simply click this link to register here: softei.com

Readers can also register to receive the monthly newsletter from our sister site, weartechdesign.com. This is the only website dedicated to developers of wearable electronic products. Simply click this link to register: weartechdesign.com

We have a Fitbit to give away on both Softei.com and Weartechdesign.com! Register today to enter the competition to win a Fitbit at softei.com or weartechdesign.com.

https://www.xilinx.com/

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Six-axis inertial module combine robustness for industrial applications

Tue, Nov 20, 2018

Adding to STMicroelectronics’ family of low power MEMS sensors for industrial applications, the ISM330DLC six-axis inertial measurement unit (IMU) is said to combine high accuracy and robustness with long-term availability assured by ST’s 10-year longevity programme.

The ISM330DLC contains a three-axis accelerometer and a three-axis gyroscope with user-selectable full-scale up to ±16g and ±2000dps respectively. It provides high measurement resolution and energy-saving features for long-lasting battery-powered industrial devices. Target applications include industrial IoT systems, robots, drones, platform stabilisers, and telematics. The wide accelerometer bandwidth up to 3kHz also allows its use in vibration-monitoring and compensation systems.

The ISM330DLC consumes just 0.5mA in normal combination mode and 0.75mA in high-performance mode. A large integrated FIFO that lets the host system retrieve data efficiently, and saves energy with tilt detection, free-fall, wakeup, 6D/4D orientation, click, and double-click features. There is also a sensor-hub feature for collecting data from additional external sensors.

Integrated industrial-grade design features include a dedicated configurable low-latency signal-processing path, low noise, and filtering optimised to ensure closed-loop control stability. The signal path can be independently configured to make gyroscope or accelerometer data available through an auxiliary SPI.

The ISM330DLC also contains a temperature sensor and built-in self-test both for the gyroscope and accelerometer.

The ISM330DLC is in production now, as a 2.5 x 3.0 x 0.83mm plastic land-grid array (LGA) system-in-package.

This news story is brought to you by softei.com, the specialist site dedicated to delivering information about what’s new in the electronics industry, with daily news updates, new products and industry news.

To stay up-to-date, register to receive our weekly newsletters and keep informed of the latest technology news and new products from around the globe. Simply click this link to register here: softei.com

Readers can also register to receive the monthly newsletter from our sister site, weartechdesign.com. This is the only website dedicated to developers of wearable electronic products. Simply click this link to register: weartechdesign.com

We have a Fitbit to give away on both Softei.com and Weartechdesign.com! Register today to enter the competition to win a Fitbit at softei.com or weartechdesign.com.

http://www.st.com

> Read More

NB-IoT shield enhances ARIS-Edge platform

Energy harvesting embedded controller simplifies Industry 4.0

Zynq UltraScale+ family is certified for AI-class devices

Six-axis inertial module combine robustness for industrial applications

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