Bosch claims to offer the first position tracking smart sensor

Believed to be the first position tracking smart sensor, the BHI160BP is designed for wearables and uses integrated inertial sensors to improve GPS location tracking.

When used with a GPS or GNSS module, the BHI160BP enables users to take full advantage of pedestrian position tracking with up to 80 per cent saving in system power consumption compared with a typical GNSS-only solution, without compromising on accuracy, says Bosch.

Users benefit from an extended battery life and longer charging intervals for wearable applications such as smartwatches and fitness trackers and other mobile devices such as smartphones. Bosch believes that position tracking is set to enable a new class of compact devices with even smaller batteries.

The BHI160BP tracks a person’s position by intelligently applying an inertial sensor based algorithm for pedestrian dead reckoning (PDR). To maintain accuracy, it calculates the user’s relative location based on data collected from the inertial sensors and then re-calibrates itself every few minutes to obtain the absolute position provided by the GNSS/GPS module. In this way, the GNSS/GPS module can be kept in sleep mode for most of the time, which both reduces a device’s power consumption and extends its operating time.

The position tracking capability provided by the BHI160BP also means that a device can maintain solid accuracy, says Bosch, even when the GNSS signal is blocked or weak, e.g. near tall buildings or indoors. This ensures accurate pedestrian navigation at all times, even in shielded indoor areas such as subways.

The BHI160BP joins Bosch Sensortec’s BHI160 family and adds application-specific functionality for position tracking. It can be quickly and easily integrated into a system design without requiring an update to a new GNSS module, thereby significantly cutting time to market.

While the current configuration is optimised for use with GNSS receivers (such as GPS), the BHI160BP can also support most of the common global localisation technologies. As well as improving localisation, the BHI160BP can also serve to handle gesture recognition and 3D orientation, with 3D calculations performed by the sensor rather than by an application processor.

The BHI160BP draws only 1.3mA in active operation mode and is the industry’s lowest-power solution that integrates the Fuser Core microcontroller and a six-axis inertial measurement unit (IMU). Additionally, the position tracking smart sensor offers a variety of customised virtual sensors, such as a calibrated accelerometer, orientation and wake up gesture, within a single device. The BHI160BP can be extended by connecting additional physical sensors, such as a magnetometer, over a secondary interface.

The new BHI160BP comes in a compact 3.0 x 3.0 x 0.95mm3 LGA-package and is pin-to-pin compatible with the BHI160.

The BHI160BP will be available via distribution in December 2018.

https://www.bosch-sensortec.com

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Mouser stocks Wireless Xpress Bluetooth modules to upgrade connectivity

Designed to quickly develop Bluetooth technology based IoT applications, Silicon Labs’ Wireless Xpress BGX13x modules are now available from distributor, Mouser.

The modules offer Bluetooth 5 compliance in either a system in package (SiP) or PCB module for smart home devices, sensors, and industrial monitoring.

The Silicon Labs Wireless Xpress BGX13x modules enable a Bluetooth low energy cable replacement without requiring wireless firmware development. Using only the modules’ UART interface, the devices allow embedded systems to connect and communicate across a Bluetooth low energy link to smartphones and other BGX devices. Users can also remotely manage and update Bluetooth-enabled products over the air (OTA) using native device management features. Silicon Labs’ Zentri Device Management Service (DMS) allows end users to easily install and update firmware, view real-time device health metrics, and adjust product settings through mobile apps.

There are two options, the BGX13P PCB module and the BGX13S SiP, both of which include an on-board Bluetooth stack controlled through an Xpress command API, plus cable replacement firmware pre-programmed. The modules require a total PCB area of just 51mm². Both have certifications from Bluetooth, CE, FCC, Japan, and South Korea.

The modules are supported by the Wireless Xpress BGX13P starter kit, which includes a BGX13P expansion board with a pre-mounted BGX13P module. The BGX13P expansion board can operate in standalone mode with a PC via USB port or in a simulated embedded host mode with a Silicon Labs’ EFM8 or EFM32 starter kit.

Mouser stocks semiconductors and electronic components for the newest design projects. Its website is continually updated and offers advanced search methods to quickly locate inventory. Mouser.com also houses datasheets, supplier-specific reference designs, application notes, technical design information, and engineering tools. The global distributor’s website, Mouser.com, is available in multiple languages and currencies and features more than five million products from over 750 manufacturers.

Mouser Electronics is a Berkshire Hathaway company. Mouser offers 23 support locations around the world to provide best-in-class customer service and ships globally to over 600,000 customers in more than 220 countries/territories from its facility south of Dallas, Texas, USA.

Silicon Labs provides silicon and software focused on performance, energy savings, connectivity and simplicity.

http://www.mouser.com

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Digital input ICs halve footprint and lower power

To meet the size, power and performance requirements of Industry 4.0, Maxim Integrated has added to its family of digital input devices.

One, the MAX22192, is integrated into the company’s new Go-IO programmable logic controller (PLC) reference design.

Increased automation means a need for real-time decision-making and feedback-loop mechanisms. These intelligent Industry 4.0 systems require digital input ICs inside the PLCs to receive on/off status signals. They must also be robust, high performing and robust for integration throughout manufacturing environments.

Maxim’s expanded portfolio of IEC61131-2-compliant digital input devices is claimed to offer the industry’s smallest solution size (by as much as 50 per cent), the lowest power dissipation (by as much as 60 per cent), and is up to six times faster and has the most robust performance (integrating 1kV of surge protection and integrated diagnostics).

The family also includes a parasitically powered digital input that reduces power dissipation by up to 60 per cent and does not require a discrete isolated power supply.

The digital input devices available from Maxim are the MAX22190 eight-channel octal digital input with serial peripheral interface (SPI), accurate input current limiters, built-in surge protection of more than 1kV and wire break detection in a 5.0 x 5.0mm package.

The MAX22191 single-channel, parasitically powered digital input with accurate input current limiters and 250ns (max) propagation delay is in a 2.8 x 2.9mm package; the

MAX22192 eight-channel octal digital input with isolated SPI, wire break detection and accurate input current limiters in a 6.0 x 10mm package.

The MAX22195 high-speed octal digital input ICs have parallel output and accurate input current limiters, 300ns (max) propagation delay, parallel interface, low power, low heat dissipation, fault tolerance with built-in diagnostics, configurability and a robust design in a 5.0 x 5.0mm 32-TQFN package.

These ICs join the MAX14912 and MAX14913 octal high-speed, switch/push-pull driver with integrated surge protection, diagnostics and fast/safe demagnetisation, the MAX14914 universal digital IO with surge protection, high-side switch/push-pull driver/digital input and an SPI and the MAX14483 six-channel, high-density, high-speed, low-power digital isolator optimised for daisy chained SPI applications.

Evaluation kits (MAX22190, MAX221919, MAX22192 and MAX22195) are also available.

Visit Maxim at electronica 2018 in Hall C4, Stand 440.

https://www.maximintegrated.com

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Two Xeon processor additions target HPC and AI

Intel announces two member of its Xeon processor portfolio. The Cascade Lake advanced performance processor is expected to be released the first half of 2019 and the Intel Xeon E-2100 processor for entry-level servers is available now.

Cascade Lake represents a new class of Intel Xeon Scalable processors designed for the most demanding high-performance computing (HPC), artificial intelligence (AI) and infrastructure-as-a-service (IaaS) workloads. The processor incorporates a performance optimised multi-chip package to deliver up to 48 cores per CPU and 12 DDR4 memory channels per socket.

Cascade Lake advanced performance processors will deliver both core CPU performance gains and leadership in memory bandwidth constrained workloads, promises Intel. Performance estimates include Linpack up to 1.21x versus Intel Xeon Scalable 8180 processor and 3.4×2 versus AMD EPYC 7601; Stream Triad up to 1.83x versus Intel Scalable 8180 processor and 1.3×2 versus AMD EPYC 7601;

AI/deep learning inference up to 17x images-per-second versus Intel Xeon Platinum processor at launch.

Intel SGX on the Intel Xeon E-2100 processor family delivers hardware-based security to secure customer data and applications. This feature allows new entry-level servers featuring an Intel Xeon E-2100 processor to provide an additional layer of hardware-enhanced security measures when used with properly enabled cloud applications.

The Xeon E-2100 processor is targeted at small- and medium-size businesses and cloud service providers. It supports workloads suitable for entry-level servers as well as any computing applications requiring enhanced data protection for sensitive workloads.

The Intel Xeon E-2100 processor-based servers will support the latest file-sharing, storage and backup, virtualisation, and employee productivity solutions.

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