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Silicon Labs releases next-generation Gecko platform for the smart home

Thu, Dec 13, 2018

Following the acquisition of Z-Wave technology earlier this year, Silicon Labs introduces the next-generation Z-Wave 700 on the Wireless Gecko platform. It is, say the company, the industry’s most comprehensive hardware and software connectivity solution for the IoT.

The smart home platform builds on Z-Wave’s Security 2 (S2) and interoperability by improving energy efficiency and adding higher performance, longer range RF capabilities, explains Silicon Labs. With the Wireless Gecko platform, developers will be able to create new classes of smaller, more intelligent smart home products at a lower cost and faster time-to-market, assures the company.

The worldwide smart home market is expected to grow to 1.3 billion devices, shipped annually by 2022. Much of that growth will be driven by sensors that enable AI and edge computing applications, in new verticals such as security, aging-in-place, energy, voice control and insurance.

Z-Wave 700 combines a powerful Arm processor-based platform with large on-chip memory to enable greater intelligence at the edge and secure inclusion in less than one second. The Z-Wave 700 platform delivers 10-year coin-cell battery life, enabling more wireless sensor applications. Enhanced RF performance extends the Z-Wave 700 device range beyond traditional limits to the edge of the yard and throughout a multi-storey home.

Z-Wave 700 enables interoperability with thousands of devices and ensure best-in-class security with built-in S2, says Silicon Labs. Z-Wave 700 also includes SmartStart, to automatically create and configure Z-Wave networks for instant device installation success.

There are no requirements for regionalised SAW filters or external memory, which means that the Z-Wave 700 offers a single global software stock-keeping unit for easier logistics and cost-effective global production, predicts Silicon Labs.  .

Silicon Labs offers a range of development tools to enable smart home product design. It offers developers low-cost developer kits, energy profiler tools and ready-made gateway software with certified reference code, minimising the time from prototype to final product. Developers can also use Silicon Labs’ Simplicity Studio development suite to access tools to simplify Z-Wave 700-based designs.

https://www.silabs.com/

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Infineon introduces Optiga Trust X to secure connected IoT devices

Tue, Dec 11, 2018

Infineon Technologies has introduced Optiga Trust X as an open source platform that offers enhanced security for connected/IoT devices. According to Infineon, the security controller reduces integration effort and is easy to use and is designed to support customers who lack security expertise but require a fast time-to-market. The low-power devices support non-rich operating systems and is available in compact 3.0 x 3.0mm PG-USON-10-2 packages.

There are two versions available, operating in two temperature ranges. The SLS32AIA020X4 operates at the standard temperature range of -25 to +85 degrees C and, for harsh industrial environments, the SLS32AIA020X2 operates at the extended temperature range -40 to +105 degrees C.

The open source host code for Optiga Trust X and documentation is now available as open source on GitHub. Customers have a direct line of communication to developers and will immediately and directly be informed of new versions, features and bug fixes. According to Infineon, the ecosystems facilitates the integration of standard open-source crypto software libraries or the integration of the host code into other systems.

Features of the Optiga Trust X is one-way authentication using ECDSA, mutual authentication using DTLS client (IETF standard RFC 6347) and secure communications using DTLS.

It is compliant with the USB Type-C authentication standard and offers up to 10kbyte user memory.

Cryptographic support is ECC256, AES128, SHA-256, TRNG, DRNG with a cryptographic tool box based on ECC NIST P256, P384 and SHA256 (sign, verify, key generation, ECDH, session key derivation).

https://www.infineon.com

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Chipsets provide connectivity for automotives

Sun, Dec 09, 2018

Introducing the SkyOne Ultra 3.0, Skyworks is expanding its SkyOne cellular platform, with devices that are scalable to meet 5G radio standards. The chipsets target automotive applications.

The portfolio delivers robust, low latency, high bandwidth LTE connectivity with extended operating temperature ranges and production lifetimes, claims Skyworks. The portfolio exceeds LTE CAT 16 requirements, is scalable to 5G radio standards and supports all global cellular bands. Compatibility with all leading chipset providers and a simplified compliance process means that these integrated architectures are can reduce design complexity as well as time to market.

“With the introduction of SkyOne® Ultra 3.0 for automotive, Skyworks is enabling the full benefit of high-speed data and real-time communication in the connected car,” said Joel King, senior vice president and general manager of mobile solutions for Skyworks. “At a higher level, in-vehicle technologies and rapidly changing standards are being adopted at a pace previously unheard of in the automotive industry – particularly with the advent of 5G and the move toward autonomous driving.”

SkyOne Ultra 3.0 incorporates the key analogue and RF functionality in both transmit and receive paths of LTE communications. Transmit devices contain power amplifier modules with SkyBlue technology for improved efficiency, as well as integrated duplexers (PAMiDs), low noise amplifiers (LNAs) and antenna switches.

Diversity receive (DRx) modules combine the necessary components within the LTE receive path including LNAs, filters and antenna switches.

Package size is less than 40 x 40mm; this is a critical element in meeting automotive-qualified network attached device (NAD) reliability requirements, points out Skyworks. Connectivity engines can be regionally optimised for North America, Europe and China.

The SkyOne Ultra 3.0 series is made up of the SKYA230xx front-end modules with SkyBlue enabling technology, LNAs and integrated duplexers, the SKYA220xx suite of power amplifiers, the SKYA250xx DRx and MIMO modules and the SKYA21xxx, discrete switches and LNA products.

Embedded navigation systems, diagnostic capabilities, personalisation services and other smart features are fuelling consumer demand for connected cars. IHS Markit forecasts that worldwide sales will increase from 24 million units in 2015 to more than 72 million by 2023. In eight years, nearly 70 per cent of the passenger vehicles sold will be transmitting data with external sources, to offer new services, revenue streams and business models to automotive markets.

http://www.skyworksinc.com

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Low-noise LDO regulator powers automotives and smart automation

Fri, Dec 07, 2018

For always-on automotive modules and noise-sensitive loads, the LDO40L 400mA low-dropout (LDO) linear regulator delivers quiet and efficient power, says STMicroelectronics.

The AEC-Q100 qualified LDO40L has 45 microA quiescent current and reduces the demand on vehicle batteries to run loads such as body and interior functions that are active when the ignition is off. The LDO40L can be disabled to achieve a very-low shutdown current of only one microA.

The internal circuity operates from an input voltage as low as 3.5V and combines with the extremely low dropout voltage of 36mV at 100mA load, or 140mV at full load. The LDO40L maintains power to the load as the input dips during cold cranking.

The LDO40L powers automotive body-control modules, instruments and clusters, and LED lighting, and ensures stable DC for industrial controls and building- or home-automation applications. Output noise is just 20 microV, power-supply rejection ratio (PSRR) 70dB at 1kHz, and protection features including current limit and thermal shutdown are built-in.

There is a choice of fixed 3.0, 3.3, 5.0 or 8.5V output voltage, regulated within ± three per cent including line, load and temperature variation. Only two capacitors are needed to complete the application circuit. An adjustable-output version is also available, which allows designers to set an output voltage down to 2.5V minimum using an external resistor divider.

All versions are housed in a 3.0 x 3.0mm DFN6 package with wettable flanks, which is smaller than the DPAK outline of typical competing devices yet maintains high thermal performance and excellent reliability in relation to heatsink size.

http://www.st.com

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