Tracking camera uses inside-out tracking, for computing at the edge

Guidance and navigation can be provided for autonomous vehicles using the Intel RealSense Tracking Camera T265. The standlone inside-out tracking device uses proprietary visual inertial odometry simultaneous localisation and mapping (V-SLAM) technology with computing at the edge, making it particularly suitable for applications that require a highly accurate and low-latency tracking solution, for example, robotics, drones, augmented reality (AR) and virtual reality (VR).

The RealSense Tracking Camera T265 was designed to complement Intel’s existing RealSense Depth Cameras and provide a quick path to product development with its next-generation integrated V-SLAM technology.

The camera is powered by the Intel Movidius Myriad 2 vision processing unit (VPU), which directly handles all the data processing necessary for tracking on the machine, providing a small footprint and low-power consumption camera that can be implemented into existing designs or for building IP that requires rich visual intelligence.

Potential applications are where tracking the location of a device is important, especially in locations without GPS service, such as warehouses or remote outdoor areas. In these cases, the camera uses a combination of known and unknown data to navigate to its destination. For example, integrating the T265 into a robot designed for agriculture allows the device to navigate fields in a precise pattern and intelligently adapt to avoid obstacles in its environment, including structures or people. Another example is bringing medical supplies to remote, off-the-grid areas or to a lab inside a hospital ward. Here, the T265 can be used in drone or robotic deliveries due to its wider field of view and optimisation for tracking use cases.

The T265 uses inside-out tracking which means the device does not rely on any external sensors to understand the environment. Intel adds that unlike other inside-out tracking solutions, the T265 delivers six-degrees-of-freedom (6DoF) inside-out tracking by gathering inputs from two onboard fish-eye cameras, each with an approximate 170 degree range of view. The V-SLAM systems construct and continually update maps of unknown environments and the location of a device within that environment. Since all position calculations are performed directly on the device, tracking with the T265 is platform independent and allows the T265 to run on very low-compute devices.

The only hardware requirements are sufficient non-volatile memory to boot the device and a USB 2.0 or 3.0 connection that provides 1.5W of power.

http://www.intel.com

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Mouser boosts high-speed wired connectivity; ships MaxLinear’s G.hn Wave-2 platform

Distributor Mouser Electronics stocks the G.hn Wave-2 networking chipset from MaxLinear, featuring the G.hn digital baseband and G.hn analogue front ends. Offering physical data rates up to 2Gbits per second across a variety of physical media, the Wave-2 networking G.hn processors deliver reliable connectivity and reduced congestion in smart grid, security, broadband, industrial, smart home, and automotive applications.

MaxLinear’s G.hn Wave-2 networking platform offers designers the flexibility to combine footprint-compatible components to address multiple G.hn applications. The MaxLinear G.hn digital broadband (DBB) processors provide high-speed networking with 1 Gbits per second maximum throughput over power lines and 1.7Gbits per second maximum throughput over coaxial cables and phone lines. The DBB processors feature a G.hn physical layer (PHY), G.hn datalink layer (DLL), and an embedded CPU for management and control functions. The G.hn analogue front ends provide up to 2Gbits per second physical data rates over any wired medium.

The processors are housed in a small 4 × 4 mm QFN package, the devices deliver programmable transmission and reception gains for each wired medium.

A set of software development kits (SDKs) enable designers to create custom solutions that meet requirements such as IPv4/IPv6 support, quality of service (QoS), and TR-069 management. Engineers can also use the SDKs to develop customised applications that run on a DBB processor’s embedded CPU.

Mouser also stocks three G.hn Wave-2 networking evaluation kits, for a power line, coaxial, or phone line medium. Each kit includes a DBB processor, analogue front end and two evaluation boards that allow designers to evaluate the performance of G.hn networking technology.

MaxLinear was founded in 2003. The company delivers broadband and networking semiconductors based on its integrated radio frequency analogue technology, high-performance optical networking technology. It pioneered MoCA (Multimedia over Coax) and direct broadcast satellite ODU single-wire technology.

Mouser claims to stock the world’s widest selection of the latest semiconductors and electronic components for the newest design projects. Its’ website is continually updated and offers advanced search methods to help customers quickly locate inventory. Mouser.com also houses data sheets, supplier-specific reference designs, application notes, technical design information, and engineering tools.

http://www.mouser.com

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Rutronik UK offers Intel’s Neural Compute Stick 2 for AI

Able to bring greater intelligence to network edge devices, the Intel Neural Compute Stick 2 (NCS2) is designed to bring artificial intelligence (AI) algorithms and for prototyping computer vision at the network edge. It is now available from Rutronik UK.

The Intel NCS2 is an affordable way to accelerate the development of deep neural networks inference applications and delivers a performance boost compared with the earlier neural compute stick.

The Intel NCS2 is powered by the latest generation of Intel vision processing unit (VPU), the Intel Movidius Myriad X VPU. According to Rutronik, this is the first VPU that features a neural compute engine for delivering additional performance. Deep learning neural networks like Caffe, Tensor Flow or MXNet can be integrated with the OpenVINO toolkit on the NCS2. These machine learning frameworks are optimised for the entirely new deep neural network (DNN) inferencing engine, which delivers eight times the performance of the previous generation device.

Developers can develop AI and computer vision applications and have them operating in minutes using just a laptop and the Intel NCS2, explains Rutronik. The Intel NCS2 runs on a standard USB 3.0 port and requires no additional hardware, enabling users to seamlessly convert and then deploy PC-trained models to a range of devices and without internet or cloud connectivity. Potential uses for the NCS2 is to develop a smart camera, a drone with gesture-recognition capabilities, an industrial robot, or smart home devices.

The NCS2 is available immediately.

http://www.Rutronik24.com

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Super-junction MOSFETs minimise power dissipation

Leveraging ST Microelectronics’ carrier-lifetime control technology, the MDmesh DM6 MOSFETs are 600V devices that contain a fast recovery body diode to bring the performance advantages of ST’s super-junction technology to full and half-bridge topologies, zero voltage switching (ZVS) phase shift converters and any topologies that require a diode able to handle dynamic dV/dt.

The MDmesh DM6 MOSFETs have reduced reverse-recovery time (trr) to minimise power dissipation in the diode when turning off after freewheeling. Recovery softness is optimised to enhance reliability, adds ST. In addition, very low gate charge (Qg) and on-resistance (RDSON), and a capacitance profile tailored for light loads, allow higher operating frequencies and greater efficiency, with simplified thermal management and reduced EMI. These characteristics make the MDmesh DM6 devices suitable for equipment such as charging stations for electric vehicles, telecom or data centre power converters, and solar inverters, where they are claimed to enable superior energy ratings with more robust performance and increased power density.

The MOSFETs are part of the STPower portfolio. There are 23 part numbers covering current ratings from 15 to 72A, with gate charge (Qg) ranging from 20nC to 117nC and RDSON from 0.240 down to 0.036 Ohm respectively.

Package options include the new low-inductance leadless TO-LL, PowerFLAT 8×8 HV, D2PAK, TO-220, and TO-247 with short leads, long leads, or Kelvin pin for applications requiring precision current sensing.

The MDmesh DM6 family is in production now. Please contact your local ST office for pricing and sample requests.

http://www.st.com

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