Dual-output digital PoL regulator saves space in ICT applications

Designed for high current ICT applications, the BMR469 family of digital point of load (PoL) regulators has been introduced by Flex Power Modules. The BMR469 delivers high power density, up to 160A per square inch, to save valuable board space in space constrained designs.

There are two variants with different output currents. The 80A BMR4690000 measures 25.4 x 12.7 x 11.6mm (1.00 x 0.50 x 0.46-inch) and the 50A BMR4696001 has a low profile with a maximum height of 5.8mm (0.23-inch). This model can be used where designers need to find space for a large processor heatsink, or who want to place the PoL regulator on the underside of the PCB. The low height of the BMR4696001 also makes it possible to place it very close to the processor, thus improving transient response, says Flex Power Modules.

Both versions are configurable as either dual outputs or a single, higher-power output. Designers can use one part to cover different requirements, for example to drive different processors or FPGA rails, which helps simplify power system design, adds Flex.

The BMR4690000 variant provides two independent 40A outputs for dual configurations, or one 80A rail in single-output operation mode. The BMR4696001 provides two 25A outputs or one 50A rail in single-output operation mode. Up to four modules can be paralleled for current sharing, delivering a total of up to 320A for the BMR4690000 and 200A for the BMR4696001.

The BMR469 can be configured via pin-strap or PMBus, according to the application. The regulator is also supported by a simulation model in Flex’s Power Designer software, for design and debug. Using Flex Power Designer’s advanced simulation functions, designers can optimise configuration parameters to achieve a stable control loop with fast load transient responses.

The BMR469 is suitable for a range of applications in the ICT market and designs that require high power density and a digital architecture, such as test equipment or simulator manufacturers. The BMR469 is capable of providing sufficient power to drive components such as processors, FPGAs and ASICs.

Efficiency is typically 92.6 per cent at half load (12Vin, 5Vout). The input voltage range is 7.5 to 14V, and output range is 0.6 to 5.0V. The BMR469 meets safety requirements according to IEC/EN/UL 62368-1, and offers a mean time between failures (MTBF) of 18.49 million hours.

The BMR4690000 is available now, and the BMR4696001 will be available in April 2019.

http://www.flex.com

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AI computer holds promise for millions of intelligent systems

At this week’s GPU Technology Conference in San Jose, California this week, Nvidia has announced an artificial intelligence (AI) computer that makes it possible to create millions of intelligent systems.

There are two versions of the Nvidia CUDA-X Jetson Nano computer, a $99 development kit for developers and makers, and a production-ready module, priced at $129 for companies to create mass-market edge systems.

The small CUDA-X AI computer delivers 472GFLOPS of compute performance for running modern AI workloads and is power-efficient, consuming as little as 5W.

Jetson Nano supports high-resolution sensors, can process many sensors in parallel and can run multiple modern neural networks on each sensor stream. It also supports many popular AI frameworks, allowing developers to integrate preferred models and frameworks.

The Jetson Nano developer kit is priced to bring the power of modern AI to a low-cost platform, for makers, inventors, developers and students to build AI projects, for example mobile robots and drones, digital assistants and automated appliances.

The kit includes support for full desktop Linux and is compatible with many popular peripherals and accessories. Ready-to-use projects and tutorials are included to help makers get started with AI fast.

The Jetson Nano module can be used in embedded applications, including network video recorders, home robots and intelligent gateways with full analytics capabilities.

The design includes power management, clocking, memory and fully accessible input/outputs. The AI workloads are entirely software defined, allowing companies to update performance and capabilities even after the system has been deployed.

To help customers easily move AI and machine learning (ML) workloads to the edge, Nvidia has worked with Amazon Web Services (AWS) to qualify AWS Internet of Things Greengrass to run optimally with Jetson-powered devices such as Jetson Nano.

Nvidia CUDA-X is made up of over 40 acceleration libraries for graphics processing unit (GPU) -accelerated computing. JetPack SDK is built on CUDA-X and is a complete AI software stack with accelerated libraries for deep learning, computer vision, computer graphics and multimedia processing that supports all of the Nvidia Jetson family, including Jetson AGX Xavier for fully autonomous machines and Jetson TX2 for AI at the edge.

JetPack includes the latest versions of CUDA, cuDNN, TensorRT and a full desktop Linux OS.

A reference platform has also be created to minimise the time spent on initial hardware assembly.

http://www.nvidia.com

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AI computer holds promise for millions of intelligent systems

At this week’s GPU Technology Conference in San Jose, California this week, Nvidia has announced an artificial intelligence (AI) computer that makes it possible to create millions of intelligent systems.

There are two versions of the Nvidia CUDA-X Jetson Nano computer, a $99 development kit for developers and makers, and a production-ready module, priced at $129 for companies to create mass-market edge systems.

The small CUDA-X AI computer delivers 472GFLOPS of compute performance for running modern AI workloads and is power-efficient, consuming as little as 5W.

Jetson Nano supports high-resolution sensors, can process many sensors in parallel and can run multiple modern neural networks on each sensor stream. It also supports many popular AI frameworks, allowing developers to integrate preferred models and frameworks.

The Jetson Nano developer kit is priced to bring the power of modern AI to a low-cost platform, for makers, inventors, developers and students to build AI projects, for example mobile robots and drones, digital assistants and automated appliances.

The kit includes support for full desktop Linux and is compatible with many popular peripherals and accessories. Ready-to-use projects and tutorials are included to help makers get started with AI fast.

The Jetson Nano module can be used in embedded applications, including network video recorders, home robots and intelligent gateways with full analytics capabilities.

The design includes power management, clocking, memory and fully accessible input/outputs. The AI workloads are entirely software defined, allowing companies to update performance and capabilities even after the system has been deployed.

To help customers easily move AI and machine learning (ML) workloads to the edge, Nvidia has worked with Amazon Web Services (AWS) to qualify AWS Internet of Things Greengrass to run optimally with Jetson-powered devices such as Jetson Nano.

Nvidia CUDA-X is made up of over 40 acceleration libraries for graphics processing unit (GPU) -accelerated computing. JetPack SDK is built on CUDA-X and is a complete AI software stack with accelerated libraries for deep learning, computer vision, computer graphics and multimedia processing that supports all of the Nvidia Jetson family, including Jetson AGX Xavier for fully autonomous machines and Jetson TX2 for AI at the edge.

JetPack includes the latest versions of CUDA, cuDNN, TensorRT and a full desktop Linux OS.

A reference platform has also be created to minimise the time spent on initial hardware assembly.

http://www.nvidia.com

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Small PoL DC/DC converter eases power management integration

TDK claims that its FS1406 uPOL point of load (PoL) DC/DC converter is the smallest available. It is scalable and configurable, with multi-time programmable memory.

It is designed for big data, machine learning, artificial intelligence (AI), 5G cells, IoT and computing enterprise applications.

While conventional DC/DC converters use side by side discrete integrated circuit (IC) and discrete inductor (L) the FS series integrates the IC and inductor in a compact 3.3 x 3.3 x 1.5mm package. It is particularly suitable for space-constrained applications requiring a low-profile power source, adds TDK.

The DC/DC converter minimises the external components required and its simplified design eases integration. The FS series can deliver a high density solution of 1W per mm3, while reducing size by 50 per cent, compared with other products available in its class, says TDK. This minimises system solution cost, reduces board size and assembly costs, as well as bill of materials and PCB costs. The DC/DC converter operates at a broad junction temperature range, from -40 to +125 degrees C.

uPOL products were developed by TDK’s Faraday Semi company. They combine high-performance semiconductors in advanced packaging technologies such as semiconductor embedded in substrate (SESUB) and advanced electronic components to achieve system integration in a smaller size and lower profile by 3D integration. This integration allows TDK to deliver higher efficiency and ease of use at a lower total system cost to what is currently available today.

μPOL technology includes a DC/DC converter placed in the vicinity of complex chipsets such as ASICs, FPGAs. It is by minimising the distance between the converter and the chipset, that the resistance and the inductance components are minimised, allowing fast response and accurate regulation with dynamic load currents.

The product family is rated for industrial application, is lead free and is RoHS- compliant.

Mass production of FS1406 is expected to begin in Q3 2019.

https://www.global.tdk.com

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