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Infineon claims industry’s first true 1000A voltage regulator for AI

Tue, Mar 26, 2019

Adding to its high current system chipset portfolio, Infineon claims to offer the industry’s first 16-phase digital PWM multiphase controller.

The XDPE132G5C extends the existing portfolio which enables currents of 500 to 1000A and above for next generation CPUs, GPUs, FPGA and ASICs used in artificial intelligence (AI) and 5G datacomms applications.

It has been introduced as CPU current requirements increase to enable next-generation AI and networking workloads, DC/DC voltage regulators to deliver more than 500A to the load. The XDPE132G5C has a true 16-phase digital PWM engine and an improved advanced transient algorithm to address these high phase count requirements, says Infineon. The true active current sharing between phases enables a reliable, compact and cost-saving design, with no need for extra logic doubler ICs.

The XDPE132G5C offers fine V out setting in 0.625mV increments to meet the demands of ASICs and FPGAs of V out control in less than 1mV steps, seen in communication systems today. The XDPE132G5C also supports auto-restart for communications with options to reduce remote site maintenance following power or system glitches.

The XDPE132G5C is packaged in a 7.0 x 7.0mm 56-pin QFN to accommodate 16 phases. It employs a full digital and programmable load line and is PMBus 1.3/AVS-compliant.

Infineon advises that it can be paired with TDA21475, the thermally efficient integrated current sense power stage, to efficiently deliver over 1000A.

The 70A-rated TDA21475 power stage is housed in a 5.0 x 6.0mm package. It provides efficiency of more than 95 per cent. The exposed top significantly reduces the R th(j-top) from 19 degrees C/W in the over-moulded package to 1.6 degrees C/W. This removes heat from the top of the package, for voltage regulator power density and optimal phase count and footprint. The TDA21475 also offers smart over-current and over-voltage protection and delivers temperature and current information to the XDPE132G5C controller.

The company also offers the IR35223 true 10-phase PWM digital controller. This controller provides a cost-effective option for voltage regulation up to 500 A. The IR35223 is housed in a 6.0 x 6.0mm, 48-pin QFN package and provides advanced transient performance and telemetry features including PMBus 1.3/AVS bus compliance.

http://www.infineon.com/next-gen-processors

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Quick Starter kit evaluates NXP i.MX 8 QuadMax processors

Fri, Mar 22, 2019

Industrial computing module manufacturer, congatec, has released its latest evaluation kit for NXP i.MX 8 processor. The SMARC 2.0 Quick Starter Kit for NXP i.MX 8 designs offers everything developers need for the immediate evaluation of the new NXP i.MX 8 processor generation. In particular, vision-based AI application developers can benefit from the natively supported integrated Mobile Industry Processor Interface (MIPI) and optional pre-configured software support for artificial intelligence (AI).

The SMARC 2.0 Quick Starter Kit for NXP i.MX 8 can be used by developers of integrated industry IoT (IIoT), industrial and embedded vision applications because they can immediately integrate a credit card sized off-the-shelf module into their applications with minimum space requirements, says congatec. The starter kit complements the comprehensive i.MX 8 ecosystem of products and services. “It enables the rapid evaluation of the i.MX 8 processor architecture, which will open up many new application fields for us in the real-time industrial area as well as in vision-based AI sectors,” explains Martin Danzer, director product management at congatec. “Thanks to the comprehensive design-in services of our Technical Solution Center that come with the starter kit, it really couldn’t be any easier to start developing SMARC 2.0 based i.MX 8 applications,” he adds.

Services offered by the Technical Solution Center for the new SMARC 2.0 and Qseven modules with NXP i.MX 8X processors include high assurance booting (HAB) implementation, bootloader and operating system (OS) image authentication through private and public key cryptography and customer-specific board support package (BSP) adaptation to long-term software maintenance for Linux and Android. The offering further includes a selection of suitable carrier board components and design reviews as well as high-speed signal compliance tests, thermal simulations, meantime between failure (MTBF) calculations, and debugging services for customer-specific solutions.

The congatec SMARC 2.0 Quick Starter Kit integrates conga-SMX8 computer modules with either the low-power NXP i.MX 8X or the high-end NXP i.MX 8 (QuadMax) series, as well as a conga-SEVAL evaluation carrier board, which offers access to all interfaces and functions for SMARC 2.0 based NXP i.MX 8 designs. The evaluation carrier supports a set of interfaces including four PCIe x1, one mini PCIe, two USB 3.0, and four USB 2.0 for generic extensions. Next to two RJ45 for Gigabit Ethernet, four COM, one CAN bus and 12 general purpose input/outpus (GPIOs) are also available.

Displays can be connected via dual channel LVDS, eDP, DP and two MIPI-DSI, and additional storage media via an SD/MMC socket and one SATA 6G. Digital and analogue audio I/Os for I²S and HDA interfaces are also available.

The Quick Starter Kit also includes an ATX power supply, the conga-ACA2 MIPI CSI-2 dual camera module, WLAN antenna, LVDS adapter, SATA, USB cable and a cooling solution for the module. For software, there is a qualified bootloader package and board support packages for Linux, Yocto and Android available through the congatec Git server.

http://www.congatec.com

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IoT Innovations Challenge – #KeysightIoTChallenge

Thu, Mar 21, 2019

One Idea Is All It Takes

Keysight Technologies is inviting undergraduate and graduate students worldwide to participate in its IoT Innovation Challenge. To enter, students must design a low-power sensor network strategy in one of two Innovation Tracks.

Students will compete via online written and video submissions to win an all-expenses-paid trip to the Grand Final at the World Maker Faire in New York, September 21-22, 2019. Six teams will advance to the final, where they will demonstrate their prototypes live before a panel of judges.

Prizes
The Grand Champion team will win $50,000 in cash and $50,000 of select Keysight test equipment for their school. Two first-place winners in each Innovation Track will win $25,000 in cash and $25,000 of select Keysight test equipment for their school.

Pick Your Innovation Track

Track 1: Smart Land
Design a sensor network strategy to cover one sq. km. of urban area to monitor and report on one or more of the following: air quality, water quality, data quality and sound quality, for at least one year.

Track 2: Smart Water
Design a sensor network strategy to cover a major waterway area to monitor and report, on one or more of the following: acidity, turbidity, and contaminants, for at least one year.

Calling All Students!
This is your chance to make the world better for billions. Are you ready to step up and innovate? Contest open to graduate and undergraduate students. Any student graduating before the Grand Final event is also eligible to participate.

Registration opens April 2019. Contest rules are forthcoming. Sign up now to be notified when registration goes live. #KeysightIoTChallenge

Signup here

Read Keysight News

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Archiving system incorporates AI and machine learning elements

Thu, Mar 21, 2019

Enhanced functions for radiologists, new collaboration tools and artificial intelligence (AI) integration are provided in the latest Telemis Multimedia Archiving and Communication System (MACS).

Version 4.90 of Telemis’ archiving and transmission platform is future-proofed for machine learning (ML) and adds advanced capabilities for diagnosis and collaboration.

Telemis-Medical Version 4.90 also simplifies the capture, storage, comparison and sharing of key diagnostic data through improved image registration functionalities, says Telemic, with the introduction of goniometry tools and enhanced collaboration options. The software also offers integration modules that will speed the incorporation of new and emerging AI and ML techniques.

The latest version of MACS was been developed with a focus on addressing the challenges facing today’s radiologists. Recognising that image comparison is a significant portion of a radiologist’s work, Telemis has developed registration capabilities that allow alignment and comparison between images whatever the modalities (CT/MR/PT), the table positions and the timespan between the series. There are optional report input tools that combine advanced image viewing, dictation management and voice recognition, to simplify and speed up the collection, recording and analysis of radiology measurements.

Medical images can be now captured by peripherals such as smartphones and tablets and then automatically linked with the patient ID and the user ID via scan barcodes and QR codes. These more flexible and faster features have been designed not only for medical facilities with multiple sites but also for emergency units, dermatologists and surgeons.

Telemis-Medical Version 4.90 includes a new feature, TM-Community, which facilitates exchanges between Telemis customers. It also includes TM-Publisher Web which supports the secure distribution of images to external professionals such as GPs and consultant physicians. The TM-Publisher Web tool includes a new uploader module that allows internal and external contacts to send DICOM or non-DICOM images for second opinions. For data exchange and GDPR compliance, the new audit system allows operators to centralise access control and management.

Telemis-Medical Version 4.90 offers modules that speed the integration of AI tools. The AI-Box is designed to harmonise the exchange processes between multimedia archiving and communications systems and AI algorithms, making it easier to use the best algorithm for a given pathology.

http://www.telemis.com

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Infineon claims industry’s first true 1000A voltage regulator for AI

Quick Starter kit evaluates NXP i.MX 8 QuadMax processors

IoT Innovations Challenge – #KeysightIoTChallenge

Archiving system incorporates AI and machine learning elements

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