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STMicroelectronics and Virscient partner for vehicle connectivity

Thu, Feb 28, 2019

Wireless connectivity skills from Virscient are used in STMicroelectronics’ Telemaco3P automotive application processors for connected vehicles.

Virscient offers support to ST customers in the development and delivery of advanced automotive applications based on the ST Modular Telematics Platform (MTP). MTP is a development and demonstration platform incorporating ST’s Telemaco3P telematics and connectivity microprocessor. MTP enables the rapid prototyping and development of smart driving applications, including vehicle connectivity to back-end servers, road infrastructure, and other vehicles, explains ST. Virscient brings wireless connectivity technologies and protocols for architecting connected car systems that rely on technologies such as GNSS (precise positioning), LTE/cellular modems, V2X technologies, Wi‑Fi, Bluetooth, and Bluetooth Low Energy.

The Telemaco3P incorporates dual Arm Cortex-A7 processors with an embedded hardware security module (HSM), an independent Arm Cortex-M3 subsystem, and a set of connectivity interfaces.

Telemaco3P SoC ensures a secure connection between the vehicle and the Cloud, explains ST. Its asymmetric multi-core architecture provides powerful application processors as well as an independent CAN control subsystem with optimised power management. Its ISO 26262 silicon design, its embedded Hardware Security Module, and automotive-grade qualification up to 105 degrees C ambient temperature allow for the implementation of a range of secure telematics applications supporting high-throughput wireless connectivity and over the air (OTA) firmware upgrades.

ST and Virscient will be exhibiting the Modular Telematics Platform within the ST Automotive Telematics Ecosystem at Embedded World. Visit ST in Hall 4A, stand 4A-138.

Semiconductor supplier, ST provides intelligent and energy-efficient products enabling smarter driving and smarter factories, cities and homes, along with the next generation of mobile and IoT devices.

Virscient helps the world’s leading semiconductor and product companies get to market faster with quality wireless connectivity solutions for automotive, audio, IoT, and industrial markets. With deep expertise in secure wireless and connected systems, Virscient provides engineering services and intellectual property spanning a range of technologies such as Wi‑Fi, Bluetooth, 5G, GNSS, LoRa, Sigfox and IEEE 802.15.4.

http://www.st.com

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Nvidia-based modules deliver AI to the edge

Wed, Feb 27, 2019

Four carrier boards and a finished system from Diamond Systems are all targeted at delivering artificial intelligence (AI) at the edge computing. The family is based on Nvidia Jetson TX2, TX2i and AGX Xavier modules and target industrial and military applications, particularly those in harsh environments such as vehicles and other outdoor applications.

The Ziggy (pictured) and Jethro carriers are designed to work with the Jetson TX2 and TX2i system on modules (SoMs). Stevie and Elton implement AGX Xavier. Elton is distinguished by a PCI/104 Express expansion socket. According to Diamond Systems, Elton bridges Ai and machine learning (ML) with the durable, rugged industrial PC/104 computing ecosystem.

Elton provides support for PCI-104, PCIe/104 type 2 (x8 lane), and PCIe/104 OneBank expansion modules (4 x1 lanes), for the rapid creation of rugged, custom-configured PCIe-based computing using off-the-shelf I/O modules from a large number of manufacturers.

Another feature of all four modules is the data acquisition circuit with analogue input, analogue output and digital I/O to interface to analogue and digital sensors and controls. There is a programming library with support for custom development and an application with graphical user interface (GUI) for real time control of the data acquisition I/O and data logging.

Ziggy is the carrier for Jetson TX2 and TX2i. It is compact, measuring just 50 x 87mm. The compact ZiggyBox computer system houses the Ziggy carrier and Jetson module and has DIN rail mounting capability, both characteristics that make it suitable for equipment racks and cabinets.

Jethro measures 76 x 107mm – slightly larger TX2/TX2i carrier – and offers more I/O and expansion capability, as well as a rugged connector scheme, explains Diamond Systems. It includes a PCIe MiniCard socket, an M.2 SATA flash socket, and a LTE modem socket designed to work with Nimbelink SkyWire cellular modems. Pin headers can accommodate both low-cost, traditional connector technology, or more rugged latching connectors where resistance to vibration and shock are required

Stevie is a translator board that enables the Ziggy and Jethro TX2 carriers to be used with the higher performance AGX Xavier module. It is the same size as Xavier (87 x 100mm) and adds an M.2 PCIe NVMe flash socket, two CAN ports, and an additional USB 3.0 port, as well as a socket for connecting high performance cameras.

Finally, Elton is a rugged carrier board for NVidia’s Xavier SoM. It uses a PCB that is around 50 per cent thicker than the others in the family, and has latching connectors and the rugged PCI/104-Express expansion bus for the most demanding compute-intensive harsh-environment applications. It is larger too, measuring 102 x 152mm which allows it to include all the I/O and expansion of Diamond’s other carriers, namely data acquisition, M.2 and PCIe minicard sockets, and LTE modem socket.

Visit Diamond Systems at Embedded World (Hall 2, stand 2-350) for a chance to win one of three ZiggyBox Nvidia Jetson TX2 embedded computers.

http://www.diamondsystems.com

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Collaboration realises onboard data management for ‘data centre on wheels’

Mon, Feb 25, 2019

Solid state drives from Toshiba Memory Europe will be used in OSR’s Evolver onboard data management, or ‘data centre of wheels’ platform.

The two companies have extended their partnership to provide in-car data centre services as OEM customers are requesting ways of logging, analysing and managing the growing amounts of data.

OSR Enterprises created the Evolver automotive platform for connected, autonomous, shared and electric mobility. This announcement extends the companies’ existing collaboration to enhance live data management and logging in cars, in a vehicle’s data centre, with high-density and low-power solid state drives.

Evolver is described as an artificial intelligence (AI) ‘brain’ for smart, autonomous and securely networked vehicles. The hardware and software platform provides the computing power for the car of the future and operates as a central data hub which stores, processes and analyses real-time data for AI and analytical insights. The data and information are crucial for autonomous driving, customised user experiences and is the foundation for new automotive business models, explains OSR.

One of the elements supporting this capability is an advanced high-density in-car storage. The collaboration with Toshiba Memory Europe. The combination of the technologies ensures that the development cycles of OSR’s OEM customers are shortened, while retaining robustness for a solid development process, claims the company.

Toshiba Memory’s flash technology features high performance, low latency and high-density solid-state drives. Toshiba Memory’s CM5 NVM Express™ (NVMe) is built with its latest 64 layer, three-bit-per-cell enterprise-class TLC (triple-level cell) BiCS Flash, making today’s demanding storage environments possible. This, combined with selectable power modes in Toshiba Memory’s solid state drives (SSDs) which improve the thermal performance and heat dissipation of the system. Additionally, optimal operation and data integrity is provided by its power loss protection technology within the storage components.

OSR Enterprises is a Swiss based automotive Tier 1 supplier with R&D centres in Switzerland and Israel.

Toshiba Memory Europe is the European business of Toshiba Memory Corporation.

https://business.toshiba-memory.com

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Development board helps developers connect for Cloud IoT Core

Mon, Feb 25, 2019

To help device manufacturers to develop secure IoT products, Microchip Technology introduces the PIC-IoT WG development board for Cloud IoT Core. PIC microcontrollers are used in a wide variety of products, from coffee makers to thermostats and irrigation systems yet as developers migrate next-generation PIC microcontroller-based applications to the cloud, they have to overcome complexities associated with communications protocols, security and hardware compatibility. To accelerate the development of these applications, Microchip has announced an IoT rapid development board for Google Cloud IoT Core that combines a low-power PIC microcontroller, CryptoAuthentication secure element IC and fully certified Wi-Fi network controller. According to Microchip, this provides a simple way to connect and secure PIC microcontroller-based applications, removing the added time, cost and security vulnerabilities that come with large software frameworks and real time operating systems (RTOS). Once connected, Google Cloud IoT Core provides powerful data and analytics to help designers make better, smarter products, explains Microchip.

Microchip Technology has an extended partnership with Google Cloud, which means that the PIC-IoT WG development board enables PIC microcontroller designers to easily add cloud connectivity to next generation products using a free online portal at www.PIC-IoT.com. Once connected, developers can use Microchip’s MPLAB Code Configurator (MCC) development tool to develop, debug and customise an application. The board combines smart, connected and secure devices to enable designers to create connected applications. It includes the eXtreme low-power PIC microcontroller with integrated core independent peripherals. Suitable for battery-operated, real-time sensing and control applications, the PIC24FJ128GA705 microcontroller employs the PIC architecture with added memory and advanced analogue integration explains Microchip. It is supported by the latest Core Independent Peripherals (CIPs) designed to handle complex applications with less code and decreased power consumption.

There are also secure element to protect the root of trust in hardware. The ATECC608A CryptoAuthentication device provides a trusted and protected identity for each device that can be securely authenticated. It is supplied pre-registered on Google Cloud IoT Core. For Wi-Fi connectivity to Google Cloud, the ATWINC1510 is an industrial-grade, fully certified IEEE 802.11 b/g/n IoT network controller that provides an easy connection to a microcontroller via an SPI, with the designer needing networking protocols expertise.

Google Cloud IoT Core provides a managed service that enables designers to easily and securely connect, manage and ingest data from devices at a global scale. The platform collects, processes and analyses data in real time to enable designers to improve operational efficiency in embedded designs.

The PIC-IoT WG development board is supported by the MPLAB X integrated development environment (IDE) and MCC rapid prototyping tool and is compatible with more than 450 MikroElektronika Click boards to expand sensors and actuator options.

http://www.microchip.com

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STMicroelectronics and Virscient partner for vehicle connectivity

Nvidia-based modules deliver AI to the edge

Collaboration realises onboard data management for ‘data centre on wheels’

Development board helps developers connect for Cloud IoT Core

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