IoT Innovations Challenge – #KeysightIoTChallenge

One Idea Is All It Takes

Keysight Technologies is inviting undergraduate and graduate students worldwide to participate in its IoT Innovation Challenge. To enter, students must design a low-power sensor network strategy in one of two Innovation Tracks.

Students will compete via online written and video submissions to win an all-expenses-paid trip to the Grand Final at the World Maker Faire in New York, September 21-22, 2019. Six teams will advance to the final, where they will demonstrate their prototypes live before a panel of judges.

Prizes
The Grand Champion team will win $50,000 in cash and $50,000 of select Keysight test equipment for their school. Two first-place winners in each Innovation Track will win $25,000 in cash and $25,000 of select Keysight test equipment for their school.

Pick Your Innovation Track

Track 1: Smart Land
Design a sensor network strategy to cover one sq. km. of urban area to monitor and report on one or more of the following: air quality, water quality, data quality and sound quality, for at least one year.

Track 2: Smart Water
Design a sensor network strategy to cover a major waterway area to monitor and report, on one or more of the following: acidity, turbidity, and contaminants, for at least one year.

Calling All Students!
This is your chance to make the world better for billions. Are you ready to step up and innovate? Contest open to graduate and undergraduate students. Any student graduating before the Grand Final event is also eligible to participate.

Registration opens April 2019. Contest rules are forthcoming. Sign up now to be notified when registration goes live. #KeysightIoTChallenge

Signup here

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#KeysightIoTChallenge
#KeysightIoTChallenge

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AI computer holds promise for millions of intelligent systems

At this week’s GPU Technology Conference in San Jose, California this week, Nvidia has announced an artificial intelligence (AI) computer that makes it possible to create millions of intelligent systems.

There are two versions of the Nvidia CUDA-X Jetson Nano computer, a $99 development kit for developers and makers, and a production-ready module, priced at $129 for companies to create mass-market edge systems.

The small CUDA-X AI computer delivers 472GFLOPS of compute performance for running modern AI workloads and is power-efficient, consuming as little as 5W.

Jetson Nano supports high-resolution sensors, can process many sensors in parallel and can run multiple modern neural networks on each sensor stream. It also supports many popular AI frameworks, allowing developers to integrate preferred models and frameworks.

The Jetson Nano developer kit is priced to bring the power of modern AI to a low-cost platform, for makers, inventors, developers and students to build AI projects, for example mobile robots and drones, digital assistants and automated appliances.

The kit includes support for full desktop Linux and is compatible with many popular peripherals and accessories. Ready-to-use projects and tutorials are included to help makers get started with AI fast.

The Jetson Nano module can be used in embedded applications, including network video recorders, home robots and intelligent gateways with full analytics capabilities.

The design includes power management, clocking, memory and fully accessible input/outputs. The AI workloads are entirely software defined, allowing companies to update performance and capabilities even after the system has been deployed.

To help customers easily move AI and machine learning (ML) workloads to the edge, Nvidia has worked with Amazon Web Services (AWS) to qualify AWS Internet of Things Greengrass to run optimally with Jetson-powered devices such as Jetson Nano.

Nvidia CUDA-X is made up of over 40 acceleration libraries for graphics processing unit (GPU) -accelerated computing. JetPack SDK is built on CUDA-X and is a complete AI software stack with accelerated libraries for deep learning, computer vision, computer graphics and multimedia processing that supports all of the Nvidia Jetson family, including Jetson AGX Xavier for fully autonomous machines and Jetson TX2 for AI at the edge.

JetPack includes the latest versions of CUDA, cuDNN, TensorRT and a full desktop Linux OS.

A reference platform has also be created to minimise the time spent on initial hardware assembly.

http://www.nvidia.com

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AI computer holds promise for millions of intelligent systems

At this week’s GPU Technology Conference in San Jose, California this week, Nvidia has announced an artificial intelligence (AI) computer that makes it possible to create millions of intelligent systems.

There are two versions of the Nvidia CUDA-X Jetson Nano computer, a $99 development kit for developers and makers, and a production-ready module, priced at $129 for companies to create mass-market edge systems.

The small CUDA-X AI computer delivers 472GFLOPS of compute performance for running modern AI workloads and is power-efficient, consuming as little as 5W.

Jetson Nano supports high-resolution sensors, can process many sensors in parallel and can run multiple modern neural networks on each sensor stream. It also supports many popular AI frameworks, allowing developers to integrate preferred models and frameworks.

The Jetson Nano developer kit is priced to bring the power of modern AI to a low-cost platform, for makers, inventors, developers and students to build AI projects, for example mobile robots and drones, digital assistants and automated appliances.

The kit includes support for full desktop Linux and is compatible with many popular peripherals and accessories. Ready-to-use projects and tutorials are included to help makers get started with AI fast.

The Jetson Nano module can be used in embedded applications, including network video recorders, home robots and intelligent gateways with full analytics capabilities.

The design includes power management, clocking, memory and fully accessible input/outputs. The AI workloads are entirely software defined, allowing companies to update performance and capabilities even after the system has been deployed.

To help customers easily move AI and machine learning (ML) workloads to the edge, Nvidia has worked with Amazon Web Services (AWS) to qualify AWS Internet of Things Greengrass to run optimally with Jetson-powered devices such as Jetson Nano.

Nvidia CUDA-X is made up of over 40 acceleration libraries for graphics processing unit (GPU) -accelerated computing. JetPack SDK is built on CUDA-X and is a complete AI software stack with accelerated libraries for deep learning, computer vision, computer graphics and multimedia processing that supports all of the Nvidia Jetson family, including Jetson AGX Xavier for fully autonomous machines and Jetson TX2 for AI at the edge.

JetPack includes the latest versions of CUDA, cuDNN, TensorRT and a full desktop Linux OS.

A reference platform has also be created to minimise the time spent on initial hardware assembly.

http://www.nvidia.com

> Read More

Small PoL DC/DC converter eases power management integration

TDK claims that its FS1406 uPOL point of load (PoL) DC/DC converter is the smallest available. It is scalable and configurable, with multi-time programmable memory.

It is designed for big data, machine learning, artificial intelligence (AI), 5G cells, IoT and computing enterprise applications.

While conventional DC/DC converters use side by side discrete integrated circuit (IC) and discrete inductor (L) the FS series integrates the IC and inductor in a compact 3.3 x 3.3 x 1.5mm package. It is particularly suitable for space-constrained applications requiring a low-profile power source, adds TDK.

The DC/DC converter minimises the external components required and its simplified design eases integration. The FS series can deliver a high density solution of 1W per mm3, while reducing size by 50 per cent, compared with other products available in its class, says TDK. This minimises system solution cost, reduces board size and assembly costs, as well as bill of materials and PCB costs. The DC/DC converter operates at a broad junction temperature range, from -40 to +125 degrees C.

uPOL products were developed by TDK’s Faraday Semi company. They combine high-performance semiconductors in advanced packaging technologies such as semiconductor embedded in substrate (SESUB) and advanced electronic components to achieve system integration in a smaller size and lower profile by 3D integration. This integration allows TDK to deliver higher efficiency and ease of use at a lower total system cost to what is currently available today.

μPOL technology includes a DC/DC converter placed in the vicinity of complex chipsets such as ASICs, FPGAs. It is by minimising the distance between the converter and the chipset, that the resistance and the inductance components are minimised, allowing fast response and accurate regulation with dynamic load currents.

The product family is rated for industrial application, is lead free and is RoHS- compliant.

Mass production of FS1406 is expected to begin in Q3 2019.

https://www.global.tdk.com

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