Keysight and Calterah collaborate for connected-car supply chain

Keysight Technologies has announced a collaboration with China’s automotive millimeter wave radar chipset design house, Calterah, to support the design, verification, test and launch of an automotive millimeter wave radar chipset that will drive development of the connected car supply chain.

Calterah released the ALPS family of chips which integrates high-speed ADCs, complete radar signal processing baseband and high-performance CPU core. During design and verification of this chip, Keysight supported Calterah with the company’s E8740A automotive radar signal analysis and generation instrument (pictured) solution for77GHz radar signal receiving and transmission characterisation, radar target simulation, and testing the basic radio frequency parameters of the chip.

Qitao Pan, general manager of the Automotive and Energy Solutions Group at Keysight Technologies China, said: “Keysight has delivered mature and complete testing solutions for key technologies such as millimeter wave radar, automotive Ethernet, automotive wireless interconnect and [vehicle to everything] V2X”

“ALPS is an SoC and its chip architecture and performance parameters are far superior to previous generations, ” said Dr. Wang Dian, chief mmW scientist at Calterah. “Keysight’s measurement solution covers the entire range from digital to analog to RF, ensuring the functionality and performance of each sub-module of ALPS,” he added.

Calterah Semiconductor provides 77GHz CMOS mmWave radar sensor ICs for advanced driver assistance systems (ADAS), security screening and imaging and the smart home. In 2017, the company mass-produced the first generation of 77GHz and 79GHzCMOS mmWave radar transceiver IC.

Keysight Technologies is focused on optimising networks and bringing electronic products to market faster and at a lower cost with offerings from design simulation, to prototype validation, to manufacturing test, to optimisation in networks and cloud environments. Customers span the worldwide communications ecosystem, aerospace and defence, automotive, energy, semiconductor and general electronics end markets.

http://www.keysight.com

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Aetina showcases AI in the smart factory

At this year’s Computex (28 May 1 June, Taipei, Taiwan), Aetina will display its edge artificial intelligence (AI) computing for the smart factory.

Aetina has co-operated with a third party in the textile industry to detect defects in textile production. Its small form factor, edge computing AI platform with five 2M cameras has been deployed in a defect-detect machine. The system consists of Aetina Jetson edge AI platform and third-party algorithm, which can detect up to nine kinds of textiles and reach 90% of accuracy. With this system, the factory can realise automation for production, says Aetina.

Analyst firm, IDC predicted that there would be a quarter of the edge device supported AI solution; it is essential to connect everything to the internet in the future. Aetina has integrated the eco-partner’s WiGi (5G last mile) solution so that the detected images of the textiles can immediately be sent to the cloud. The use of the internet, means that the factory’s control room can remotely deal with most of the problem and control the status of the factory.

“The combination of our edge AI platform and the 5G solution may realize the unmanned factory soon,” said Joe Lo, general manager, Aetina.

Aetina will be showing the combination of the smart factory and 5G at Computex 2019, booth 1-K0806.

Aetina was founded in Taiwan in 2012 and provides general purpose graphics processing units (GPGPUs) and Jetson edge AI computing solutions for embedded applications. The company focuses on the industrial market, providing industrial components and longevity service.

http://www.aetina.com

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Aetina showcases AI in the smart factory

At this year’s Computex (28 May 1 June, Taipei, Taiwan), Aetina will display its edge artificial intelligence (AI) computing for the smart factory.

Aetina has co-operated with a third party in the textile industry to detect defects in textile production. Its small form factor, edge computing AI platform with five 2M cameras has been deployed in a defect-detect machine. The system consists of Aetina Jetson edge AI platform and third-party algorithm, which can detect up to nine kinds of textiles and reach 90% of accuracy. With this system, the factory can realise automation for production, says Aetina.

Analyst firm, IDC predicted that there would be a quarter of the edge device supported AI solution; it is essential to connect everything to the internet in the future. Aetina has integrated the eco-partner’s WiGi (5G last mile) solution so that the detected images of the textiles can immediately be sent to the cloud. The use of the internet, means that the factory’s control room can remotely deal with most of the problem and control the status of the factory.

“The combination of our edge AI platform and the 5G solution may realize the unmanned factory soon,” said Joe Lo, general manager, Aetina.

Aetina will be showing the combination of the smart factory and 5G at Computex 2019, booth 1-K0806.

Aetina was founded in Taiwan in 2012 and provides general purpose graphics processing units (GPGPUs) and Jetson edge AI computing solutions for embedded applications. The company focuses on the industrial market, providing industrial components and longevity service.

http://www.aetina.com

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Murata and Cypress develop battery saving Wi-Fi-Bluetooth module

A collaboration between Murata and Cypress Semiconductor has led to the development of small form factor Wi-Fi and Bluetooth module. The Type 1LV (CYW43012) module is claimed to be the lowest power, small form factor Wi-Fi and Bluetooth module and to improve battery life in wearables, smart home products, and portable audio applications.

It is based on the Cypress CYW43012 combo chipset, the small dual-band Wi-Fi 11a/b/g/n/ (11ac Friendly) +Bluetooth 5.0 module which provides data transference rates up to 78Mbits per second on Wi-Fi and 3Mbits per second on Bluetooth.

The Type 1LV supports a range of popular processors including PSoC6, i.MX RT, STM32, i.MX, and IP camera platforms, as well as Linux and RTOS-based applications.

The Type 1LV uses enhanced hardware mechanisms and algorithms to ensure that Wi-Fi and Bluetooth co-existence is optimised. An embedded Ipv6 network stack can be used to keep the host processor in sleep mode while maintaining network connections.

The module also supports BLE 2Mbits per second, LE Secure Connections, LE Privacy 1.2, and LE Data Packet Length Extension. The device operates seamlessly in dual-band networks with increased energy efficiency and enhanced security providing optimal performance in Wi-Fi 5 networks, says Murata.

The module measures 10.0 x 7.2 x 1.4mm. It will have a reference antennae design for FCC/IC certifications and CE conducted test to provide a lower development cost and faster time to market.

The Type 1LV module is now in mass production.

http://www.murata.com

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