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Arm introduces CPU and GPU for 5G mobiles

Tue, May 28, 2019

At Computex in Taiwan this week, Arm has unveiled the latest Cortex CPU, a new Mali GPU. Based on a new architecture and a processor for machine learning.

The latest Cortex CPU, the Cortex-A77 improves instruction per cycle (IPC) performance by 20 per cent, compared with the Cortex-A76 for machine learning, augmented reality and virtual reality (ML, AR and VR).

The Arm Mali-G77 GPU is based on Valhall architecture and is intended for use in mobile devices to deliver graphics at increased efficiency, according to Arm. Microarchitecture enhancements including engine, texture pipes, and load store caches, which achieve 30 per cent better energy efficiency and 30 per cent more performance density. The Valhall architecture is claimed to deliver close to 40 per cent performance improvement compared with the Mali-G76 in devices today.

Arm also says that it boosts inference and neural net (NN) performance for ML and to deliver more immersive games for mobile apps.

A dedicated ML processor delivers up to five tera operations per second (TOPS) per W as part of Project Trillium. The ML processor and open-source Arm NN software framework was announced in 2018 and enhancements to the ML processor include more than double energy efficiency to 5TOPS/W, memory compression improved by up to a factor or three and scaling to peak next-generation performance up to eight cores for up to 32TOPS.

http://www.arm.com

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Farnell extends semiconductor range with Osram Opto family

Fri, May 24, 2019

LEDs, infra red emitters, photodiodes and optical sensors from Osram Opto Semiconductor have been added to the semiconductor portfolio by Farnell.

The Osram range extends Farnell’s line card to provide customers with products to support applications in markets such as automotive, mobile, smart grid, metering, industrial, office and building automation, energy management and network infrastructure.

The distributor now ships the Olson Black family of infra red LEDs. Now with dedicated automotive versions that include the 850nm version for exterior applications such as night vision, pedestrian protection, pre-field recognition and lane detection. The 940nm version is targeted at interior automotive applications such as driver monitoring, seat occupancy detection and gesture recognition. The LEDs have different wavelengths and lenses and can be operated at up to 5A in pulse mode.

There is also the SFH 2200 family of photodiodes. The package allows them to be soldered without any damage for up to one year after initial contact with air, compared to only three days for typical standard products, reports Farnell. The package is approved up to an operating temperature of 125 degrees C. The SFH 2200 devices meet the requirements for AEC-Q101-C qualification and are particularly suitable for use in rain sensors.

The TOPLED E1608 family of low-power LEDs is also in a smaller package and are particularly suited to automotive applications such as displays, ambient lighting and backlighting of switches and instruments.

Other LEDs are the SFH 4776 broadband infra red LED range. They are suitable for near-infra red spectroscopy techniques for measuring parameters such as the water, fat, sugar and protein content of food and pharmaceutical products.

The SYNIOS P2720 platform consists of 15 LED products with different chip sizes, power ratings and colours which can be configured within a single footprint. The LEDs have high thermal reliability and high brightness and the devices can be scaled for cost-effective automotive and light design.

http://www.element14.com

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Validation app accelerates AI, graphics and processor development

Fri, May 24, 2019

Synopsys claims to delivers 100X faster formal verification closure for artificial intelligence (AI), graphics and processor designs with the introduction of the Datapath Validation (DPV) app as part of the VC Formal tool suite.

The DPV app leverages proven Hector technology (Synopsys’ C to RTL formal consistency checking technology) to deliver exhaustive formal verification closure on datapath-intensive designs during the design and verification cycle. The app also delivers over 100X speed-up in formal verification between a reference C/C++ algorithm and register transfer level (RTL) design implementation over conventional techniques of complex SoC designs and enables exhaustive functional verification in situations previously deemed impractical, explains Synopsys.

Samsung reports that using VC Formal’s Hector technology reduced simulation efforts and helped the team catch more than 30 RTL bugs in designs for its datapath-centric designs.

AI, graphics and processor designs involve complex algorithmic functional blocks that are datapath- heavy and have to have behaviour modelled in high-level languages such as C/C++. The implemented RTL for these designs needs to be verified for functional equivalence with the C/C++ model. The native integration of VC Formal with Synopsys’ Verdi automated debug system enables design and verification teams to leverage formal technologies and automate root cause analysis of formal results. The native integration of VCS in VC Formal allows formal analysis to be inserted easily into the existing verification environment.

The VC Formal Datapath Validation application is available now.

Synopsys styles itself as the ‘Silicon to Software’ partner for innovative companies developing electronic products and software applications. It is 15th largest software company in the world and specialises in electronic design automation (EDA) and semiconductor IP while growing its software security products. Its customer base is made up of SoC designers creating advanced semiconductors and software developers writing applications that require the highest security.

http://www.synopsys.com

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High-current photorelays achieve UL 508 for factory automation 

Thu, May 23, 2019

Certification to UL 508 for factory automation allows designers using Toshiba Electronics Europe’s photorelays to achieve UL approval for control equipment

The nine high-current photorelays in the series include low on-state resistance MOSFETs based upon Toshiba’s U-MOS VIII process that ensure high performance in a range of applications.

The TLP3556A, TLP3558A, TLP241A, TLP3543A, TLP3545A, TLP3546A, TLP3547, TLP3548 and TLP3549 are now fully certified to UL 508 and UL1577. These approvals allow designers to meet the UL safety requirements for control equipment, including the thermal design margin.

The devices can be used in industrial applications such as PLCs, interfaces and sensor control as well as building automation (heating and ventilation / heating ventilation air conditioning or HVAC). They can also be used for relay replacement in DC systems to 125V and AC systems to 400V, replacing 1-Form-A and other mechanical relays.

The photorelays are more robust than their mechanical counterparts and do not require a driver, so space, weight and cost savings can also be realised.

The nine photorelays are housed in DIP packages with four, six or eight pins (DIP4, DIP6 or DIP8). All packages have a surface mount option available, including wide-body versions. Devices are able to operate across the industrial temperature range of -40 to +85 degrees C ambient, while the case temperature can safely rise to 105 degrees C.

The photorelays can handle off-state output terminal voltages (Voff) as high as 600V. They also offer on-state resistances (Ron) as low as 22mOhm and can handle continuous currents (Ion) up to 5A. The pulsed current (IONP) is three times this level.

All nine photorelays in the range are available in production quantities.

http://www.toshiba.semicon-storage.com  

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