Industry’s first AC/DC converter ICs with a built-In 1700V SiC MOSFET

ROHM recently announced the availability of AC/DC converter ICs with a built-in 1700V SiC MOSFET, the BM2SCQ12xT-LBZ series. This series is optimised for industrial applications including street lamps, commercial AC systems, and general-purpose AC servos and inverters used in high power equipment.

SiC power semiconductors deliver greater power efficiency, miniaturisation, and higher voltage capability than the existing Si power devices. In recent years, the growing demand for energy savings has resulted in the adoption of power semiconductors such as SiC in 400VAC industrial applications. On the other hand, industrial equipment consists of the main power supply circuit and a built-in auxiliary power supply that supplies power to various control systems. The use of low voltage Si-MOSFETS and IGBTs limits the amount of power savings in auxiliary power supply.

In response, ROHM has strived to lead the development of ICs that maximise the performance of SiC power semiconductors. In 2015, the company became the first to offer AC/DC converter ICs for driving high voltage, low-loss SiC MOSFETs. This time, we created the industry’s first AC/DC converter ICs with a built-in SiC MOSFET that will further accelerate the adoption of AC/DC converters that use SiC MOSFETs in industrial equipment.

Furthermore, the BM2SCQ12xT-LBZ series integrate 1700V SiC MOSFET, which is also an industry first. This series enables breakthrough energy savings and facilitates efficient AC/DC converter design by resolving many of the issues encountered by designers using discrete solutions. Incorporating a SiC MOSFET and control circuitry optimised for auxiliary power supplies for industrial equipment in a single package significantly reduces the number of parts required when compared to the conventional designs (from 12pcs plus heat sink to a single IC). It also aids to minimizing both the component failure risk and the amount of resources required to develop systems using SiC MOSFETs. In addition, this product enables the improvement of power efficiency by 5% (and decreasing power loss by 28%). These features translate to dramatic reduction in size, improved reliability, and superior power savings in industrial applications.

ROHM is committed to developing not only power semiconductors such as SiC devices but also the ICs for controlling them, and to providing optimised solutions that contribute to greater energy savings and performance in industrial equipment.

Key Features

The BM2SCQ12xT-LBZ series adopts a dedicated package that incorporates a 1700V SiC MOSFET along with the control circuitry (i.e. SiC MOSFET gate drive circuit) optimised for industrial auxiliary power supplies.

These leading technology AC/DC converter ICs deliver advantages that contribute to increase the demand of AC/DC converters with integrated SiC MOSFETs by improving the reliability, energy efficiency, and compactness of 400VAC industrial equipment.

1. Breakthrough miniaturisation is enabled by replacing 12 components and heat sink with a single package

ROHM’s latest products replace up to 12 components (AC/DC converter IC, 800V Si MOSFET x 2, Zener diode x 3, resistor x 6) and the heat sink with a single package, dramatically reducing the number of external parts required. In addition, the high withstand voltage and voltage noise resistance of the internal SiC MOSFET make it possible to reduce the size of components used for noise suppression.

2. Development resources and design risks are reduced while providing multiple built-in protection functions that enable superior reliability

The monolithic design reduces the resources required for component selection and reliability evaluation for the clamp and drive circuits while also minimising component failure risk and simplifying the development effort for SiC MOSFET adoption. In addition, overload protection (FB OLP), overvoltage protection (VCC OVP) of the supply voltage pin, and a high accuracy thermal shutdown function (TSD) (achieved through the built-in SiC MOSFETs) are built in, along with the over current protection and secondary overvoltage protection functions. This enables the incorporation of multiple protection circuits for industrial power supplies that require continuous operation hence leading to a significant improvement in system reliability.

3. SiC MOSFET performance is optimised to achieve dramatically improved power savings

Both internal SiC MOSFET and the built-in gate driver circuit optimised for this SiC MOSFET improve efficiency by as much as 5% over conventional Si MOSFETs (ROHM April 2018 study). Also, a quasi-resonant method is adopted for the control circuit that enables operation at higher efficiency and lower noise than conventional PWM systems, minimising the effects of noise in industrial equipment.

(fig. 14

SiC MOSFET Advantages

SiC MOSFETs provide a number of advantages over their silicon counterparts in the high breakdown voltage region, such as lower switching and conduction losses, higher power handling capability, and a high temperature capability. This reduces the number of parts required and PCB area while improving energy savings when used in AC/DC and DC/DC converters.

Availability: Now (samples), May 2019 (OEM quantities).

Additionally, evaluation boards will be released later this year.

About ROHM Semiconductor

For further information please contact www.rohm.com/eu

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GNSS module boasts decimetre level accuracy

Continuous lane accurate positioning is afforded by the ZED-F9K global navigation satellite system (GNSS) and dead-reckoning module for urban environments. According to u-blox, it improves positioning performance x10 over standard precision technology.   

The multi-band GNSS module has built-in inertial sensors. The module combines GNSS receiver technology, signal processing algorithms, and correction services to deliver down to decimeter-level accuracy within seconds, says u-blox. This addresses the evolving needs of advanced driver assisted systems (ADAS) and automated driving markets.

The ZED-F9K high precision dead reckoning module builds on the u‑blox F9 technology. Compatibility with modern GNSS correction services improves positioning accuracy by compensating ionospheric and other errors. The multi-band, multi-constellation real time kinematics (RTK) receiver module receives GNSS signals from all orbiting GNSS constellations. A greater number of visible satellites improves positioning in partially obstructed conditions, while increased satellite signal diversity delivers faster convergence times when signals are interrupted to improve navigation.

Inertial sensors integrated into the module constantly monitor changes in the moving vehicle’s trajectory and deliver lane accurate positioning when satellite signals are partially or completely obstructed, for example when the vehicle is in covered parking areas, tunnels, urban canyons, or wooded areas. When satellite signals become available again, the module combines inertial sensor data with GNSS signals to deliver fast convergence times and high availability of the decimeter-level solution.

The ZED‑F9K’s accuracy and low latency means it also applies to automotive OEMs and Tier 1s developing vehicle-to-everything (V2X) communication systems.

Samples will be available upon request by July 2019.

http://www.u-blox.com

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Keysight and Calterah collaborate for connected-car supply chain

Keysight Technologies has announced a collaboration with China’s automotive millimeter wave radar chipset design house, Calterah, to support the design, verification, test and launch of an automotive millimeter wave radar chipset that will drive development of the connected car supply chain.

Calterah released the ALPS family of chips which integrates high-speed ADCs, complete radar signal processing baseband and high-performance CPU core. During design and verification of this chip, Keysight supported Calterah with the company’s E8740A automotive radar signal analysis and generation instrument (pictured) solution for77GHz radar signal receiving and transmission characterisation, radar target simulation, and testing the basic radio frequency parameters of the chip.

Qitao Pan, general manager of the Automotive and Energy Solutions Group at Keysight Technologies China, said: “Keysight has delivered mature and complete testing solutions for key technologies such as millimeter wave radar, automotive Ethernet, automotive wireless interconnect and [vehicle to everything] V2X”

“ALPS is an SoC and its chip architecture and performance parameters are far superior to previous generations, ” said Dr. Wang Dian, chief mmW scientist at Calterah. “Keysight’s measurement solution covers the entire range from digital to analog to RF, ensuring the functionality and performance of each sub-module of ALPS,” he added.

Calterah Semiconductor provides 77GHz CMOS mmWave radar sensor ICs for advanced driver assistance systems (ADAS), security screening and imaging and the smart home. In 2017, the company mass-produced the first generation of 77GHz and 79GHzCMOS mmWave radar transceiver IC.

Keysight Technologies is focused on optimising networks and bringing electronic products to market faster and at a lower cost with offerings from design simulation, to prototype validation, to manufacturing test, to optimisation in networks and cloud environments. Customers span the worldwide communications ecosystem, aerospace and defence, automotive, energy, semiconductor and general electronics end markets.

http://www.keysight.com

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Aetina showcases AI in the smart factory

At this year’s Computex (28 May 1 June, Taipei, Taiwan), Aetina will display its edge artificial intelligence (AI) computing for the smart factory.

Aetina has co-operated with a third party in the textile industry to detect defects in textile production. Its small form factor, edge computing AI platform with five 2M cameras has been deployed in a defect-detect machine. The system consists of Aetina Jetson edge AI platform and third-party algorithm, which can detect up to nine kinds of textiles and reach 90% of accuracy. With this system, the factory can realise automation for production, says Aetina.

Analyst firm, IDC predicted that there would be a quarter of the edge device supported AI solution; it is essential to connect everything to the internet in the future. Aetina has integrated the eco-partner’s WiGi (5G last mile) solution so that the detected images of the textiles can immediately be sent to the cloud. The use of the internet, means that the factory’s control room can remotely deal with most of the problem and control the status of the factory.

“The combination of our edge AI platform and the 5G solution may realize the unmanned factory soon,” said Joe Lo, general manager, Aetina.

Aetina will be showing the combination of the smart factory and 5G at Computex 2019, booth 1-K0806.

Aetina was founded in Taiwan in 2012 and provides general purpose graphics processing units (GPGPUs) and Jetson edge AI computing solutions for embedded applications. The company focuses on the industrial market, providing industrial components and longevity service.

http://www.aetina.com

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