Multi-chip package is set to advance 5G CPE modem roll out

Memory supplier, Winbond Electronics, supports accelerated roll-out of 5G customer premises equipment (CPE) modems as it releases a 2Gbit+2Gbit NAND+LPDDR4x multi-chip package.

The W71NW20KK1KW combines non-volatile flash/high-speed DRAM for cost and memory capacity in static 5G modem applications, says Winbond.

The 1.8V device is provided in a compact 8.0 x 9.5 x 0.8mm multi-chip package (MCP).

The W71NW20KK1KW combines robust single level cell (SLC) NAND flash and high-speed, low-power LPDDR4x memory. It provides sufficient memory capacity for 5G cellular modems that are intended for use as CPE in homes and offices.

Static 5G CPE modems can operate with memory capacities of 2Gbit NAND/2Gbit DRAM. This combination in a single package enables 5G modem manufacturers to meet the system requirements of CPE units at the lowest possible materials and production cost, says Winbond, to help accelerate consumer adoption of 5G as an alternative to fixed-line copper or optical xDSL links in the last mile of high-speed broadband networks.

According to Wilson Huang, product marketing manager at Winbond, Winbond is the only MCP chip manufacturer that produces both NAND and LPDDR4x in its own wafer fabrication plants to assure customers of supply quantities and schedules, quality and service.’

The W71NW20KK1KW is a 149-ball ball grid array (BGA) MCP consisting of a 2Gbit SLC NAND flash die and a 2Gbit LPDDR4x DRAM die. The robust SLC NAND flash offers endurance and high data integrity, adds Winbond. The SLC NAND only requires 4-bit error code correction (ECC) to achieve high data integrity, but the device’s 2kbyte+128byte page size provides enough space for the use of 8-bit ECC.

The W71NW20KK1KW has an 8-bit bus, and is organized in blocks of 64 pages. The NAND die’s performance specifications include a maximum page Read time of 25 micro seconds and a typical page program time of 250 micro seconds.

The LPDDR4x DRAM die, which operates at a high frequency of 1866MHz, provides an LVSTL_11 interface and features eight internal banks for concurrent operation. It offers a data rate of up to 4267M transfers per second, supporting the fast data-transfer rates to be offered by 5G cellular networks, according to Winbond.

The W71NW20KK1KW is available now in production volumes.

http://www.winbond.com

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Powerline communication dev tools evaluate G3-PLC chipset

A plug-and-play powerline communication (PLC) development toolset from STMicroelectronics provides all the hardware and software components needed to build and run a PLC application. It is designed to accelerate the development of turnkey powerline networks.

It lets developers connect smart devices using the ST8500/STLD1 chipset, used in utility-class smart-meter projects, on ST’s EVALKITST8500-1 evaluation kit for the ST8500 PLC modem system-on-chip and STLD1 dual line driver.

The hardware, software and documentation tools include the certified protocol stacks for G3-PLC communication in all frequency bands up to 500kHz (CENELEC-A, CENELEC-B and FCC bands certified),  a 6LowPAN adaptation layer for IPv6 that enables scalable networking, and single modem protocol engine and real-time engine firmware images for both PAN co-ordinator and device nodes.

There is also support for self-adaptive and mesh networking, allowing use in electrically noisy environments. For cyber security, there is an AES cryptography engine with up to a 256-bit key.

The toolset provides an open-source firmware framework based on the STM32 general purpose companion microcontroller for the chipset, ready for users to create and integrate application firmware.

Application examples for the STM32 include remote control of indicator LEDs, real-time clock (RTC) configuration, and ping and string data transfers between nodes. The application firmware example implements a UDP/IPv6 protocol on top of the 6LowPAN adaptation layer of the G3-PLC communication layers running on the ST8500.

The toolset also includes ST’s STSW-SGKITGUI SmartGrid LabTool, a PC-based graphical user interface (GUI) to allow users to configure and control the EVALKITST8500-1 hardware, run application commands, and apply firmware upgrades. Supporting documentation is also provided, including the STM32 Firmware User Manual and G3-PLC host interface driver application note.

According to STMicroelectronics, developers can use the toolset for smart home, smart building, smart city, smart infrastructure, and smart energy applications.

The toolset is available now and free to qualified potential customers.

http://www.st.com

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Amplifiers and comparators shrink space requirements

Smaller personal electronics, enterprise, industrial and communications designs can be achieved with the INA185 current-sense amplifier, and open-drain TLV4021 and push-pull TLV4041 comparators, claims Texas Instruments.

The INA185 is claimed to be the industry’s smallest current-sense amplifier in a leaded package and the TLV4021 and push-pull TLV4041, with an internal 1.2 or 0.2V reference, are claimed to be the smallest, most accurate comparators. In addition, says Texas Instruments, pairing the amplifier with one of the comparators produces the smallest, highest performing overcurrent detection solution in the industry.

The INA185 current-sense amplifier achieves more precision in less space, says the company. It is offered in a small-outline transistor (SOT)-563 package (1.6 x 1.6mm or 2.5mm2), making it 40 per cent smaller than the closest competitive leaded packages, says Texas Instruments.

It has a 55 microV input offset that enables higher precision measurements at low currents, and enables the use of lower-value shunt resistors to cut system power consumption. The 350kHz bandwidth and 2.0V/micro second slew rate enable phase-current reproduction to enhance motor efficiency and also save system power.

The matched resistive gain network enables a maximum gain error down to 0.2 per cent, which contributes to robust performance over temperature and process variations. The device’s typical response time of two micro seconds enables fast fault detection to prevent system damage.

The TLV4021 and TLV4041 comparators are available in a small die-size ball grid array (DSBGA) 0.73 x 0.73mm package. Both have an integrated voltage reference which saves board space and supports precise voltage monitoring to optimise system performance.

The comparators can monitor voltages down to 0.2V internal reference and feature a high threshold accuracy of one per cent across a full temperature range from -40 to +125 degrees C. Low 2.5 microA quiescent current delivers extended battery life for smart, connected devices, while a fast propagation delay (as low as 450 nano seconds) reduces latency and enables systems to monitor signals and respond quickly to fault conditions.

When used in combination, the INA185 and the TLV4021 or TLV4041, produce  the smallest, highest-performing overcurrent detection partnership, around 15 per cent smaller and 50 times faster than competitive devices, points out Texas Instruments.

Pairing the amplifier with one of the comparators to support overcurrent detection on rails as high as 26 V delivers more headroom to better manage current spikes, adds Texas Instruments.

TINA-TI SPICE models and reference designs to simulate system designs and predict circuit behaviour when using the INA185 current-sense amplifier and TLV4021 and TLV4041 comparators are available, together with evaluation modules, the INA185EVM and TLV4021-41EVM.

http://www.ti.com

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Detection sensor distinguishes earthquake from false alarms

False detection prevention is a built-in function of the BP3901 compact, high accuracy, seismic detection sensor module, from Rohm Semiconductor. The BP3901 can be used for applications requiring reliable earthquake detection, such as automatic doors, unmanned transport vehicles, and smart meters.

Accurately detecting vibration when an earthquake occurs and for stopping operation of equipment prevents secondary disasters following an earthquake and are also used to detect damage conditions and assist with early recovery. Rohm points out that mechanical earthquake detectors can only detect the presence/absence of vibration and cannot distinguish whether the vibration is due to an actual earthquake or to other external factors, which often results in false positives.

The compact BP3901 measures 11.8 x 8.6 x 2.5mm and integrates an original earthquake detection algorithm and a false detection prevention function to make it capable of accurately distinguishing between vibration due to earthquakes or other external factors. It also has an angle correction function (±15 degrees allowable mounting angle) to correct for unintentional tilt of the module.

The BP3901 incorporates a three-axis accelerometer. The earthquake detection algorithm focuses on determining spectrum intensity (SI) values. The algorithm has a high correlation with measured seismic intensity data used for earthquake damage assessment while it also optimises the digital signal processing of acceleration data and calculation parameters/sequence through analysis of measured excitation data. This makes it possible, says Rohm, to accurately measure the seismic level, enabling more precise earthquake detection compared with conventional mechanical sensors.

By conducting detailed analysis of vibration waveforms and integrating a false detection prevention function, Rohm was able to distinguish between waveforms due to external factors’ vibrations and actual seismic events.

Conventional earthquake detectors can encounter problems in detecting earthquakes due to deviations in the internal seismic detection function and inclination that occurs over time. The BP3901 achieves angle correction by combining the characteristics of the built-in accelerometer with new angle compensation operation. This allows it to correct for inclination within the vertical planes by up to ±15 degrees (three times that of conventional products) in response to the gravitational acceleration of the Earth.

The module is designed to stay in standby mode until a seismic event is detected to prolong application operation. Standby current consumption is 3.5 microA, achieved by optimising arithmetic processing, explains Rohm. For example, installing this module in a fan heater exposed to an average of 10 seismic events a month, each with a duration of 180 seconds each time, enables operation for up to five years or more, using just two alkaline AA batteries (in series).

The BP3901 saves calculated seismic data in non-volatile memory when the vibration exceeds a certain level. The last 16 seismic events can be stored in order of earthquake magnitude. Analysing earthquake data collected at various locations will make it possible to predict future earthquakes. Comparison of past earthquake data with damage conditions and equipment deterioration it is also expected to see use in earthquake recovery work and maintenance prioritization.

The BP3901 is sampling now, with OEM quantities in August.

Rohm has said that it will continue to develop algorithms optimised for different vibration detection and expand its sensor module offering.

http://www.rohm.com/eu

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