Renesas announces memory technology for AI

Renesas Electronics has developed an AI accelerator that performs convolutional neural network (CNN) processing at high speeds and low power.  A test chip with this accelerator has achieved the power efficiency of 8.8Tera operations per second per W (TOPS/W), which is the industry’s highest class of power efficiency, reports Renesas. The accelerator is based on the processing-in-memory (PIM) architecture, in which multiply-and-accumulate (MAC) operations are performed in the memory circuit as data is read out from that memory.

To create the new AI accelerator, Renesas developed three technologies. The first is a ternary-valued (-1, 0, 1) SRAM structure PIM technology that can perform large-scale CNN computations. The second is an SRAM circuit to be applied with comparators that can read out memory data at low power. The third is a technology that prevents calculation errors due to process variations in the manufacturing. Together, these technologies achieve a reduction in the memory access time in deep learning processing and a reduction in the power required for the MAC operations. As a result, the accelerator achieves the industry’s highest class of power efficiency while maintaining an accuracy ratio more than 99 per cent when evaluated in a handwritten character recognition test (MNIST), claims Renesas.

Before this development, the PIM architecture was unable to achieve an adequate accuracy level for large-scale CNN computations with single-bit calculations because the binary (0,1) SRAM structure was only able to handle data with values 0 or 1. Additionally, process variations in the manufacturing reduced the reliability of these calculations. The technologies developed by Renesas resolve these issues and can be applied to implement AI chips of the future and e-AI solutions for applications such as wearable equipment and robots that require both performance and power efficiency, says Renesas.

Since introducing the embedded AI (e-AI) concept in 2015, Renesas has defined classes based on the effectiveness of e-AI and applications that are implemented and has been developing e-AI solutions based on four classes: judging the correctness or abnormality of signal waveform data; judging correctness or abnormality using real-time image processing; performing recognition in real time and enabling incremental learning at an endpoint.

https://www.renesas.com 

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Rohde & Schwarz verifies 5G NR with mobile network testing

Field tests of 5G NR networks have been performed by Rohde & Schwarz, using commercially available 5G NR devices.

The field tests of network performance and quality from the end-user perspective on a live 5G NR network are an important step to verify that the 5G network performance supports the demanding technical requirements, says Rohde & Schwarz, and ensuring it delivers the required quality of experience (QoE) to the end user. The company’s mobile network testing solutions for engineering, site acceptance, optimization, benchmarking and monitoring offer the ability to conduct such measurements using commercially available smartphones.

The ultimate test is to verify that the required quality of experience (QoE) is delivered to subscribers by using real 5G devices in live networks. A complete 5G NR network’s operation can be tested using commercially available 5G devices such as the Samsung S10 5G, Xiaomi Mi Mix 3 5G, Oppo Reno 5G and the LG V50 ThinQ 5G phones. Rohde & Schwarz engineers have conducted first field tests in live 5G networks and measured key quality of service (QoS) and QoE parameters.

The quality and performance of 5G NR mobile networks can be tested by operators using commercially available user equipment and Rohde & Schwarz mobile network testing solutions such as the R&S QualiPoc smartphone-based optimiser, R&S ROMES4 universal network measurement software or R&S SmartBenchmarker network benchmarking software. These cover video streaming quality and app testing, providing detailed IP and RF trace data using a rooted phone, RF and voice and data testing with a standard commercial off-the-shelf (COTS) device with open diagnostic ports.

At 5G World 2019 in London (12 to 13 June, booth 5G401) Rohde & Schwarz will showcase its test solutions that accelerate the adoption of 5G, including device testing in FR1 and FR2, 5G NR network coverage and operation testing and intelligent QoE analytics.

Rohde & Schwarz supplies mobile network testing, with a diverse product portfolio for mobile operators, infrastructure vendors, testing service providers, installation companies and government regulators. Products address every test scenario in the network lifecycle – from basestation installation to network acceptance and network benchmarking, from optimisation and troubleshooting to interference hunting and spectrum analysis and from IP application awareness to QoS and QoE of voice, data, video and app-based services.

Rohde & Schwarz’s mobile network testing solutions provide hardware, software and resources for the mobile networking industry to efficiently deliver better services, while enabling suppliers to increase the value of their networks and products.

http://www.rohde-schwarz.com

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Mixed-signal RF converter caters for 4G LTE and 5G mmWave radios

A mixed-signal front-end (MxFE) RF data converter from Analog Devices combines analogue and digital signal processing (DSP) for wireless equipment such as 4G LTE and 5G millimeter-wave (mmWave) radios. The AD9081/2 MxFE platform allows manufacturers to install multi-band radios in the same footprint as single-band radios, which can triple call capacity of today’s 4G LTE basestations. The 1.2GHz channel bandwidth RF data converter also enables wireless carriers that have additional antennae to cell towers to meet the higher radio density and data rate requirements of emerging mmWave 5G, adds Analog Devices.

The AD9081 and AD9082 provide software configurability to allow designers to customise radios as frequency translation and filtering moves to the digital domain.

The AD9081 and AD9082 MxFE converters integrate eight and six RF data converters, respectively, which are manufactured using 28nm CMOS process technology.

The MxFE platform processes more of the RF spectrum band and embeds DSP functions on-chip to enable the user to configure the programmable filters and digital up and down conversion blocks to meet specific radio signal bandwidth requirements. This results in a 10X power reduction compared to architectures that perform RF conversion and filtering on the FPGA, while freeing up valuable processor resources or allowing designers to use a more cost-effective FPGA.

Both MxFE options achieve the industry’s widest instantaneous signal bandwidth (up to 2.4 GHz), according to Analog Devices. This simplifies hardware design by reducing the number of frequency translation stages and relaxing filter requirements. This level of integration lowers chip count and yields a 60 per cent reduction in PCB area compared to alternative devices, adds the company.

The MxFE platform meets the needs of other wide-bandwidth applications in 5G test and measurement equipment, broadband cable video streaming, multi-antenna phased array radar systems and low-earth-orbit satellite networks, confirms Analog Devices.

The AD9081 will be available as either a quad 12-bit, 4Gsamples per second and quad 16-bit 12Gsamples per second ADC in 324-BGA thermally enhanced packages. Sampling will begin in September, with full production scheduled for March 2020.

The AD9082 will be available as a dual 12-bit, 4Gsamples per second and quad 16-bit 12Gsamples per second ADC in the same package. Sampling will begin in September with full production scheduled for December 2019.

https://www.analog.com

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Hammond prepares for industry 4.0 with IP68 1554 and 1555 enclosures

Two sealed enclosure families from Hammond Electronics have been extended with six new size options. The company has added 36 new configurations to its popular industry 4.0 1554 and 1555 sealed enclosure families.

The enclosures are available in ABS or polycarbonate with styled, opaque, clear or smoked lids. The six new sizes are 105 x 105 x 60mm and 90 x 140 x 60mm, 140 x 140 x 60mm, 90 x 180 x 60mm,  180 x 180 x 60mm and 180 x 180 x 90mm. This give a total of 150 sizes and lid options available as standard.

The company has also announced that the polycarbonate versions now have cUL and UL 508A listing and are tested to IP68 (NEMA Type 4, 4X, 6, 6P, 12 and 13). Sealing is via a tongue and groove construction and a one-piece UL listed silicone gasket.

All versions have a RAL7035 grey base. The polycarbonate range is available with a plain or styled opaque lid, a clear lid or a smoked lid. The ABS units have a plain or styled opaque grey lid which is secured with self-captivated M4 stainless steel machine screws, located outside the sealed area and threaded into integral stainless-steel bushings to preserve the sealing integrity after repetitive assembly and disassembly.

Internal features vary with size. M3 threaded brass inserts and/or standoffs for PCB or inner panel mounting and vertical PCB guides are provided in all but the smallest B size. DIN rail mounting tabs are moulded into most sizes.

The polycarbonate versions are UV stabilised for outdoor use. The grey material has a UL94-5VA flammability rating, the clear and smoked lids are rated UL94V-0. The ABS versions are rated UL94-HB.

Hammond specialises in manufacturing small plastic, die-cast and metal enclosures for use in the electronics, electrical and allied industries.

http://www.hammondmfg.com

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