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Axiomtek’s PoE embedded vision system delivers AI for IoT

Mon, Jul 01, 2019

For applications in machine vision, edge computing, traffic vision, deep learning, and artificial intelligence (AI) of things, the eBOX671-521-FL is a graphics processing unit (GPU) computing embedded system with four-channel PoE and a MXM 3.1 Type A slot.

The eBOX671-521-FL is powered by the 8th gen Intel Core i7, i5, i3 (Coffee Lake-S) processor with either up to six-core, Intel Pentium processor, or Intel Celeron processor and comes with Intel Q370 or optional Intel C246 chipset.

The fanless embedded GPU-based system is equipped with dual DDR4 error code correction (ECC) /non-ECC SO-DIMM slots for up to 64Gbyte of system memory. The embedded vision system has an optional MXM type A slot for NVIDIA GTX1030 and GTX1050 graphics modules to enhance the performance of the visual display.

The Intel Coffee Lake-based embedded box PC is designed with four Gigabit 802.3at (Power-over-Ethernet or PoE) -compliant Ethernet ports with a power budget of 60W, six USB 3.1 ports and two Gigabit LANs to connect different devices or sensors.

“Axiomtek’s eBOX671-521-FL is dedicated to AI inference, GPU computing, and machine learning and image processing,” explains Janney Lee, a product manager of Product PM Division at Axiomtek. In addition to the expansion options of an internal MXM 3.1 type A connector, two full-size PCI Express Mini Card slots and two SIM slots, there are two swappable SATA HDD drive bays with a height of up to 9.5 mm and one mSATA for RAID 0 and 1 feature, for storage. Lee continues: “We have designed a flexible I/O window slot for incorporating application-oriented I/O functions to meet the requirements of various cases. This embedded vision computer can be mounted using wall or DIN-rail mounting for versatile use in various environments.”

I/O interfaces include two RS-232/422/485, one DVI-I port, one HDMI port, one VGA port, and two DisplayPort outputs through an optional MXM graphics kit. There is also a Phoenix-type VDC power input connector, AT/ATX quick switch, ATX power switch, reset switch, and four SMA-type antenna openings. The four-channel Gigabit PoE embedded vision system supports a 24V DC power input with power protection.

The eBOX671-521-FL supports Windows 10 IoT and Linux operating systems and supports Axiomtek’s AXView 3.0 software for smart device monitoring and remote management in the industrial IoT world.

http://www.axiomtek.com

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Capacitive touch controllers increase SNR for EMI qualification

Fri, Jun 28, 2019

Three maXTouch touchscreen controllers have been introduced by Microchip, together with optimisation services which address the EMI and EMC challenges of automotive touchscreens.

The MXT1067TD, MXT1189TD and MXT1665TDTD family of touch controllers have a differential mutual signal acquisition method that significantly increases the signal-to-noise ratio (SNR), explains Microchip. This allows the use of very thick glass or plastic cover lenses and multi-finger thick gloved touch support up to the equivalent of 4.5mm polymethyl methacrylate (PMMA).

The touchscreen controllers are cost-optimised for nine- to 13-inch automotive touchscreens and are complemented by the recently introduced MXT449TD, MXT641TD, MXT2113TD and MXT2912TD devices supporting up to 20-inch touchscreens. Each addresses aspects of functional safety features and is designed in accordance with the Automotive SPICE Level 3 capability and ISO 26262 automotive safety integrity level (ASIL) B requirements.

The latest and existing controllers in the TD family have a waveform shaping capability to optimise the performance of the touch controller’s radiated emissions through an EMI optimisation tool. Developers can enter user-defined RF limits and tune the shape of the transmitted burst waveform used for the touch-sensing acquisition.

Waveform shaping is achieved through firmware parameters derived from the tool and helps designers to position the fundamental burst frequency to work together with other in-vehicle applications, such as the remote keyless entry system. The parameters are added to the maXTouch configuration file, which customises the touch controller performance to the customer design.

This process can save the designer many hours, or even weeks, of expensive EMC test chamber time, explains Microchip, by eliminating experimentation with different configuration settings to achieve the desired EMI/EMC performance.

Target applications for the touchscreen controllers are centre stack displays and navigation systems; they are also suitable for industrial automation and manufacturing stations.

An evaluation kit is available for each of the parts: ATEVK-MXT1067TDAT-A (I2C), ATEVK-MXT1189TDAT-A (I2C), ATEVK-MXT1189TDAT-C (SPI), ATEVK-MXT1665TDAT-A (I2C) and ATEVK-MXT1665TDAT-C (SPI). Each kit includes a PCB with the maXTouch touchscreen controller, a touch sensor on a clear glass lens, the flat printed circuit (FPC) to connect to the sensor and a bridge PCB to connect the kit to the host computer via USB, as well as cables, software and documentation. All parts are compatible with maXTouch Studio, a full software development environment to support the evaluation of maXTouch touchscreen controllers.

The maXTouch EMI optimisation service will be made available as part of the system support provided by one of Microchip’s worldwide application design centres.

The MXT1067TD, MXT1189TD and MXT1665TD devices are available now in sampling and volume quantities in TQFP128 (MXT1067TD only) and LQFP144 packages.

http://www.microchip.com

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NFC tag allows seamless mobile connectivity

Thu, Jun 27, 2019

Infineon Technologies claims to have introduced the world’s first certified NFC Type 4B tag. It is claimed to be the first product worldwide certified by the NFC Forum that supports the contactless Type B protocol.

Near field communication (NFC) allows wireless communication between two electronic devices within a distance of approximately 4 cm. NFC tags use this technology to exchange data and to enable contactless payments using smart cards or mobile handsets. NFC tags provide smartphones with reliable data exchange and reference tags for interoperability testing with all types of internationally standardised NFC protocols. This latest NFC reference tag is based on SECORA Pay security, which has been approved under the NFC Forum Certification Program. This confirms their compliance with the Type 4A Tag and the Type 4B Tag.

NFC tags have been generally limited to use cases where security is not deemed to be critical – such as sharing URLs or exchanging business cards. However, they can also be combined with security critical payment applications. Users can activate services via NFC connectivity without having to open an app, and thus instantly connect their mobile handset to, for example, smart devices like wearables or access shared services such as pavement scooters with intuitive connectivity for everyday digital transactions.

The NFC reference tags are based on Infineon’s SPA1.1 module and are pre-loaded with NFC data exchange format (NDEF) files so developers can test a wide variety of smartphones for compliance with ISO/IEC 14443 Type A and Type B.

The Type A and Type B NFC tags are available in pairs.

http://www.infineon.com

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Multi-chip package is set to advance 5G CPE modem roll out

Thu, Jun 27, 2019

Memory supplier, Winbond Electronics, supports accelerated roll-out of 5G customer premises equipment (CPE) modems as it releases a 2Gbit+2Gbit NAND+LPDDR4x multi-chip package.

The W71NW20KK1KW combines non-volatile flash/high-speed DRAM for cost and memory capacity in static 5G modem applications, says Winbond.

The 1.8V device is provided in a compact 8.0 x 9.5 x 0.8mm multi-chip package (MCP).

The W71NW20KK1KW combines robust single level cell (SLC) NAND flash and high-speed, low-power LPDDR4x memory. It provides sufficient memory capacity for 5G cellular modems that are intended for use as CPE in homes and offices.

Static 5G CPE modems can operate with memory capacities of 2Gbit NAND/2Gbit DRAM. This combination in a single package enables 5G modem manufacturers to meet the system requirements of CPE units at the lowest possible materials and production cost, says Winbond, to help accelerate consumer adoption of 5G as an alternative to fixed-line copper or optical xDSL links in the last mile of high-speed broadband networks.

According to Wilson Huang, product marketing manager at Winbond, Winbond is the only MCP chip manufacturer that produces both NAND and LPDDR4x in its own wafer fabrication plants to assure customers of supply quantities and schedules, quality and service.’

The W71NW20KK1KW is a 149-ball ball grid array (BGA) MCP consisting of a 2Gbit SLC NAND flash die and a 2Gbit LPDDR4x DRAM die. The robust SLC NAND flash offers endurance and high data integrity, adds Winbond. The SLC NAND only requires 4-bit error code correction (ECC) to achieve high data integrity, but the device’s 2kbyte+128byte page size provides enough space for the use of 8-bit ECC.

The W71NW20KK1KW has an 8-bit bus, and is organized in blocks of 64 pages. The NAND die’s performance specifications include a maximum page Read time of 25 micro seconds and a typical page program time of 250 micro seconds.

The LPDDR4x DRAM die, which operates at a high frequency of 1866MHz, provides an LVSTL_11 interface and features eight internal banks for concurrent operation. It offers a data rate of up to 4267M transfers per second, supporting the fast data-transfer rates to be offered by 5G cellular networks, according to Winbond.

The W71NW20KK1KW is available now in production volumes.

http://www.winbond.com

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Axiomtek’s PoE embedded vision system delivers AI for IoT

Capacitive touch controllers increase SNR for EMI qualification

NFC tag allows seamless mobile connectivity

Multi-chip package is set to advance 5G CPE modem roll out

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