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AI vision sensor encourages creativity

Wed, Jul 24, 2019

Robotics and open source hardware provider, DFRobot, describes its artificial intelligence (AI) vision sensor as user-friendly, with powerful algorithms and designed for click, learn and play to encourage creative projects.

The HuskyLens has several types of built-in image processing algorithms, allowing creators to start experimenting without requiring a deep understanding algorithms. DFRobot says that it is a time-saving device for experienced makers and an easy-to-use powerful tool for enthusiastic future makers.

The pre-installed algorithms in HuskyLen are designed for facial recognition, object recognition, object tracking, line following, colour detection, and tag detection. Users can also switch between algorithms with a single click. Algorithms like line-following and tag recognition can be activated simultaneously. The company gives the example that once applied to a small robot, it can not only follow a line but can also determine in which direction to turn.

HuskyLens can improve its abilities through learning. With a single click, the device can learn new objects, faces, and colours. By holding down the button, HuskyLens can continually learn the target, from different perspectives and at various ranges. The AI camera carries a 2.0-inch display, which means users do not have to connect to a PC for monitoring performance.

CEO, Ricky Ye, said: “HuskyLens has been designed with creators and makers in mind and has infused the latest AI technology with compact design and exceptionally fast processors to ensure that users are only limited by their imagination”.

HuskyLens is compatible with a range of microcontrollers including Arduino, Raspberry Pi, LattePanda, and micro:bit.

The company has introduced a KickStarter project.

DFRobot is a robotics and open source hardware provider that is dedicated to creating innovative, user-friendly products for the maker community and for innovation. DFRobot collaborates with multiple tech giants, including Intel and Microsoft, and has a product catalogue of over 1,000 components and widgets including sensors, robotic platforms, and communication modules.

http://www.dfrobot.com

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ANPC inverter design secures ‘sweet spot’ for PV

Mon, Jul 22, 2019

According to Infineon Technologies, the use of an advanced neutral-point-clamped (ANPC) inverter design supports an even loss distribution between semiconductor devices, compared with traditional three-level neutral-point-clamped topologies. The company has used the ANPC topology for its hybrid SiC and IGBT power module EasyPack 2B in the 1,200V family. It is claimed to optimise ‘sweet spot’ losses of Infineon’s CoolSiC MOSFET and TrenchStop IGBT4 chipsets respectively, with increased power density and a switching frequency of up to 48kHz. The inverters are suitable for the needs of new generation 1,500V photovoltaic and energy storage applications, adds Infineon.

The ANPC topology supports a system efficiency of more than 99 per cent. Implementing the hybrid Easy 2B power module in, for example, the DC/AC stage of a 1,500V solar string inverter allows for coils to be smaller than with devices with a lower switching frequency. This reduces the weight “significantly” compared with a corresponding inverter with purely silicon components, says the company. Additionally, the losses with silicon carbide are smaller than with silicon. For this reason, less heat must be dissipated so that the heat sink can also shrink. This results in smaller inverter housings and costs savings at system level. The design also reduces inverter design complexity, compared to five-level topologies.

The Easy 2B standard package for power modules is characterised by an industry-leading low stray inductance. The integrated body diode of the CoolSiC MOSFET chip ensures low-loss without the need for another SiC diode chip. There is also an NTC temperature sensor for monitoring and PressFit technology to reduce assembly time for mounting the device.

The hybrid EasyPack 2B can be ordered now.

http://www.infineon.com

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Embedded edge computing modules exploit Intel processor technology

Thu, Jul 18, 2019

10 new COM Express Type 6 modules have been announced by congatec. They feature the latest Intel embedded processor technology, with four Intel Xeon, three Intel Core, two Intel Celeron and one Intel Pentium processors based on the same Intel microarchitecture (codenamed Coffee Lake H). This enables congatec to provide all 10 new processors on one COM Express module design – the conga-TS370.

This brings the total of processor module variants now available on this single microarchitecture to 14, offering wide scalability, points out the company.

The 45W six-core module with 2.8GHz Intel Xeon E-2276ME processor provides the highest embedded computing performance with integrated high-performance processor graphics currently available, claims congatec. The 2.4GHz Intel Celeron G4930E processor module with 35 watts sets a new price-performance benchmark, adds the company.

The two six-core congatec modules with a TDP of 25W offered on Intel Xeon E-2276ML and Intel Core i7-9850HL processors enable developers to create passively cooled embedded edge computing systems that can run up to 12 standalone virtual machines in parallel, via hyperthreading. This allows operation even in fully sealed systems, under the harshest environmental conditions and with the highest IP protection, asserts congatec. The same applies to the two quad-core modules with Intel Xeon E-2254ML or Intel Core i3-9100HL processor as well as the Intel Celeron G4932E processor-based module, all featuring a – partly configurable – TDP of 25W.

The company has released these modules in response to OEM customers using multi-core platforms to consolidate separate systems on a single embedded edge computer. Hypervisor technology allows customers to operate up to 12 virtual machines in parallel on one system, including real-time controllers (soft PLCs), industry 4.0 gateways for tactile internet via time synchronised networking, IoT gateways for sending big data towards the cloud and central management systems, as well as vision systems, artificial intelligence (AI) and deep learning applications. Software-defined networking functions such as intrusion prevention and detection systems that analyse data traffic parallel to the applications can avoid latencies that would arise with serial operation of analytics and applications, advises congatec.

In addition to embedded edge computing, they can be used in medical imaging systems and human machine interfaces (HMIs) as well as gaming, infotainment and digital signage systems.

http://www.congatec.de

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Time of flight sensors from Premier Farnell provide 3D information

Wed, Jul 17, 2019

Distributor, Premier Farnell is shipping a range of time of flight (ToF) sensors designed to meet the changing needs of design engineers and address demand for 3D information and extended range created by new use cases. ToF devices support applications such as gesture sensing, distance measurement, robotics, industrial automation and process control, enabling, for example, the monitoring of the position of an object in production as it is transported through a plant on a conveyor belt.

Devices available for next day delivery increase distance capabilities irrespective of colour and surface of the item tracked, maximise potential use within both indoor and outdoor environments and satisfy high-speed, small size and low power demands, driven by Industrial IoT application needs.

A new device is the ISL29501 ToF IC from Renesas. This is designed for detecting objects at distances up to two metres, providing a cost effective and efficient solution for distance measurement, says Premier Farnell. The ISL29501 provides object detection and distance measurement solution when combined with an external emitter (LED or laser) and photodiode. Its small size and low power consumption enable the IC to be used with connected devices in IoT applications, as well as for consumer mobile devices, home automation and the emerging commercial drone market.

There is also the VL53L1X ToF Nucleo pack from ST Microelectronics. The evaluation kit allows anyone to learn, evaluate and develop an application using the VL53L1X ToF, a device based on ST’s patented FlightSense technology. The VL53L1X is claimed to be the fastest miniature ToF sensor on the market with accuracy ranging up to four metres and fast-ranging frequency up to 50Hz. It allows absolute long-distance to be measured independently of target reflectance as instead of estimating the distance by measuring the amount of light reflected back from an object the VL53L1X precisely measures the time the light takes to travel to the nearest object and reflect back to the sensor.

Another tool is the AFBR-S50MV85G evaluation kit, from Broadcom. This comprises an NXP FRDM-KL46Z evaluation board and the AFBR-S50MV85G adapter board for connectivity between the sensor and a microcontroller board without the need for soldering. This sensor is suitable for indoor and outdoor use and optimised for distances of up to 10 metres. It has been developed with a special focus on industrial sensing and gesture sensing applications that require high speed, small size and very low power consumption, such as human machine interfaces, robotics, and augmented reality.

http://www.premierfarnell.com

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AI vision sensor encourages creativity

ANPC inverter design secures ‘sweet spot’ for PV

Embedded edge computing modules exploit Intel processor technology

Time of flight sensors from Premier Farnell provide 3D information

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