Automation engine manages IoT across countries and networks

Arm has announced Pelion Connectivity Management 2.0, an automation engine to scale the IoT and automatically manage millions of devices across multiple countries and different networks.

The company believes that a single platform for managing IoT connectivity across all a mobile network operator’s (MNOs) devices’ lifecycles. Arm says MNOs can drive additional revenue opportunities by enabling their enterprise clients the capability to automatically configure IoT devices. The automation capabilities are claimed to significantly improve the IoT services, speed and reliability of connectivity, which can be the provisioning of new devices or ensuring monthly bills never go over a set threshold.

Automation capabilities include real-time data triggers to create rules that are triggered by what is happening in the physical world.

The seamless remote subscriber identity module (eSIM) provisioning management ensures the correct service and commercial configuration and IoT deployment operational costs can be reduced, adds Arm.

The company believes Pelion Connectivity Management 2.0 will help enterprises overcome the challenges of moving from pilot IoT projects to a global scale, which enterprises have not been able to achieve before as manually managing every device across multiple countries and different mobile networks had not been possible until now.

“With our enterprise customers increasingly expanding internationally, as well as the rise of new technologies such as NB-IoT and eSIM, we wanted an IoT connectivity management service that can provide a single pane of glass regardless of underlying technology, MNO or geography,” said Carlos Lourenço, director corporate IoT business unit, of Portugal’s mobile network operator, NOS.

Michele Mackenzie, principal analyst, Analysys Mason, believes this introduction will accelerate IoT adoption. “Network operators and enterprise customers might start with small estates of devices but look to scale up quickly as the benefits of IoT are realised,” she said. “For millions (and potentially billions) of devices to be connected to telecoms networks in a timely, cost efficient, scalable way platform services will need to become increasingly automated.”

http://www.arm.com

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32-bit microcontrollers pack functions into less space

Reducing PCB footprint by up to 59 per cent, the RX651 32-bit microcontrollers provide functionality for space constrained IoT connectivity modules and edge devices.

Renesas Electronics announced the four new RX651 microcontrollers, supplied in small LQFP and BGA packages, that have been added to the RX651 family. The 64-pin BGA package measures 4.5 x 4.5mm, which reduces footprint size by 59 per cent compared to the 100-pin LGA and a 64-pin LQFP, measuring 10 x 10mm reduces the footprint by 49 per cent compared with the 100-pin LQFP. The microcontrollers are designed for a secure endpoint devices employing compact sensor and communication modules in industrial, network control, building automation, and smart metering systems operating at the IoT edge.

The IoT and Industry 4.0 both rely on higher performance, smaller form factor connectivity modules that support confidentiality, data integrity and availability in connected devices. According to Daryl Khoo, vice president of marketing, IoT Platform business division, Renesas Electronics said: “The 64-pin RX651 MCUs give customers the small footprint, high performance, and security features they need to safeguard their connected industrial and manufacturing systems against cyber-attacks.”

The RX651 MCUs integrate connectivity, Trusted Secure IP (TSIP), and trusted flash area protection that enable flash firmware updates in the field through secure network communications. The increase in endpoint devices operating at the edge has increased the need for secure over-the-air (OTA) firmware updates. These RX651 devices support this reprogramming requirement with integrated TSIP and enhanced flash protection. Enhanced security features are based on the RXv2 core and 40nm process that provide a 520 CoreMark score at 120MHz, and strong power efficiency with a 35 CoreMark/mA score as measured by EEMBC Benchmarks.

The integrated dual bank flash memory enables engineers to realise high root-of-trust levels through a combination of TSIP that protects the encryption key. Encryption hardware accelerators including AES, 3DES, RSA, SHA, and TRNG and code flash area protection to safeguard boot code from reprogramming. The dual bank flash function supports both background operation) and SWaP, making it easier for manufacturers to execute in-the-field firmware updates securely and reliably.

The RX651 microcontrollers monitor the operating state of machinery from both inside and outside the factory, enabling data exchanges to change production instructions, and reprogram microcontroller memory to update equipment settings.

The microcontrollers are available now from Renesas Electronics’ distributors. Target boards and starter kits, combined with the e2 studio integrated development environment (IDE) are also available.

http://www.renesas.com

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COM Express module is powered by AMD Ryzen Embedded V1000

Targeting graphics intensive devices which demand reliable performance to maintain stable operation, the ET976 is a Computer on Module (COM) Express Compact Type 6 module, developed by IBASE Technology.

The application-specific industrial embedded computing manufacturer has developed the ET976, powered by AMD Ryzen Embedded V1000 SoC, for industrial automation, medical imaging, transportation, gaming as well as payment systems and ATM machines.

The ET976 is available with a scalable selection of AMD Ryzen SoCs including V120B, V1605B, and V1807B and Radeon Vega 3 graphics that offer twice the level of performance when compared to its predecessor. The 125 x 95mm module is built with up to 8Gbyte of DDR4 RAM (supports ECC) and provides triple independent display ports, a Gigabit Ethernet and a high definition audio controller. It also supports a variety of the high-speed interfaces on the carrier board such as eight USB 2.0, four USB 3.1, and two SATA III.

Wilson Lin, director of IBASE Product Planning, observed: “The Ryzen line-up based on AMD’s new Zen micro-architecture, delivers significantly increased computing and graphics performance to meet the growing needs of today’s embedded technologies.”

Established in 2000, IBASE Technology specialises in the design and manufacturing of application specific embedded industrial PC products. Manufacturing and quality control is at its own production sites in Taiwan that are certified to meet ISO 9001, ISO 13485 and ISO 14001 standards. Its core strength is in OEM/ODM/JDM services, and its current standard product range comprise of x86 and RISC-based industrial motherboards, embedded systems, industrial panel PCs, digital signage players and network appliances for applications in the automation, digital signage, gaming, transportation, smart building, medical, retail and networking markets.

IBASE is an Associate member of the Intel Internet of Things Solutions Alliance. From modular components to market-ready systems, Intel and the 250+ global member companies of the Intel Internet of Things Solutions Alliance provide scalable, interoperable solutions that accelerate deployment of intelligent devices and end-to-end analytics. Close collaboration with Intel and each other enables Alliance members to innovate with the latest technologies, helping developers deliver first-in-market solutions, says IBASE.

http://www.ibase-europe.com

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CommAgility supports scalable 5G network tester for Viavi

The TM500 is a scalable test system for validating the performance of cellular networks, including 3GPP 4G, 4.5G, and 5G. CommAgility is supporting Viavi Solution in the 5G TM500 network tester. The system tests network performance as experienced by end users, across multiple cells and different radio access technologies.

Virtually all 4G and 5G base stations have been validated using the Viavi TM500, said Evan Gray, vice president product management at Viavi. CommAgility has supported TM500 with the development of 4G solutions since 2007.

He continued that the latest module has enabled the company to streamline the development process to upgrade the TM500 to 5G.

“We’re delighted to extend our long relationship with Viavi by providing signal processing cards for their 5G base station test systems,” said Edward Young, vice president and general manager at CommAgility. “By incorporating our standards-based processing boards they have been able to streamline development, and to focus efforts on customer requirements,” he added.

CommAgility’s hardware provides signal processing and flexible I/O options enabling OEMs to bring 5G products to market quickly. Baseband processing and RF cards include Texas Instruments SoCs from four to 16 DSP cores and Xilinx high-density Virtex-7 and Kintex-7 FPGAs, in a variety of form factors including AMC and VPX. The modules also provide fast, flexible I/O including Gen2 RapidIO, Gigabit Ethernet and PCI Express.

Viavi provides network test and monitoring equipment to communications service providers, enterprises, network equipment manufacturers, civil, government, military and avionics customers, supported by a worldwide channel community including Viavi Velocity Partners.

CommAgility designs and manufactures RF and microwave components, modules, systems and instruments for the wireless, telecommunication, satellite, military, aerospace, semiconductor and medical industries.

http://www.commagility.com

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