Angle sensors from Infineon are accurate at low magnetic fields

Sensors based on anisotropic magnetoresistive (AMR) technology will be unveiled by Infineon Technologies at this week’s Sensor+Test show in Nuremberg, Germany.

The Xensiv TLE5109A16 family of AMR-based angle sensors are used in the measurement of angles where high functional safety levels are demanded, for example the industrial and automotive sectors.

They can be used for position measurement in brushless DC motors for pumps, wipers or brakes, position measurements of valves, flaps or pedals and steering angle measurement.

The Xensiv TLE5109A16 angle sensors are designed for 180 degree angle measurement but are also applicable for 360 degree measurement in motors with an even number of pole pairs. They are suitable for a range of magnetic fields, from 10 to 500mT.

Accuracy 0.1 degree angle error which is a benefit, especially at low magnetic fields between 10 and 20mT, where usually the angle error significantly increases, says Infineon. The Xensiv TLE5109A16 products outperform current angle sensors with angle errors as low as 0.2 degrees, says the company. As a result, customers can use less powerful, i.e. cheaper, magnets.

Xensiv TLE5109A16 angle sensors are available as single and dual die versions, the latter is suitable for ASIL D level safety applications. Infineon offers them with two supply voltage options: 3.3 and 5.0V. The sensors have a short start-up time of 40 to 70 micro seconds and are suitable for high-speed applications with more than 30,000 rotations per minute.

The AMR-based TLE5109A16 family will be added to Infineon’s GMR-based TLE5009A16 and TLE5309D products. Identical pin-configuration and interfaces of all Xensiv TLE5x09 sensors inside a TDSO-16 package enable customers to switch from one to another product or product version very quickly and at low design-in efforts.

Infineon will show the Xensiv TLE5109A16 angle sensors and other sensors for smart vehicles, the smart home, smart industry and robotics as well as health and fitness applications at Sensor+Test 2019 (25 to 27 June 2019) Hall 1, booth 429.

http://www.infineon.com/sensortest

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Power supply monitoring IC has self-diagnosis for functional safety

Designed for automotive application power supply systems the BD39040MUF-C, by Rohm Semiconductor, has built in self-test (BIST).

It supports functional safety and provides monitoring functions for the power supply systems of advanced driver assistance systems (ADAS) sensor modules. For functional safety, to meet the highest safety requirement level (ASIL) it is necessary to detect potential failures of the power supply monitoring function itself. In addition to voltage monitoring functions (power-good, reset) and a watchdog timer for monitoring the engine control unit, the BD39040MUF-C is the first to introduce a self-diagnostic function, claims Rohm. The IC makes it possible to detect a potential failure of the power supply IC itself without affecting existing systems. Both the reference voltage and oscillator circuits are multiplexed to enable continuous mutual monitoring between systems in order to improve safety during normal operation.

The BD39040MUF-C easily supports functional safety in existing systems without any changes of power supply sequences. Additionally, the watchdog timer for the ECU can be adjusted via external resistance and the effective monitoring timing arbitrarily set to on/off.

The BD39040MUF-C has an input range of 2.7 to 5.5V and is supplied in a compact, 3mm square package.

Applications include radars, cameras and sensors for ADAS/automated driving, ECUs, electric power steering, dashboard cluster, LCD panels, infotainment, lamps
and other power systems requiring functional safety measures beyond ASIL-B.

Rohm Semiconductor develops and manufactures low power microcontrollers, power management and standard ICs, SiC diodes, MOSFETs and modules, power transistors and diodes, LEDs and passives components such as resistors, tantalum capacitors and LED display units and thermal printheads in manufacturing plants in Japan, Korea, Malaysia, Thailand, the Philippines, China and Europe.

Rohm Semiconductor Europe has its head office near Dusseldorf, Germany serving the EMEA (Europe, Middle East and Africa) region.

http://www.rohm.com

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Xilinx ships Versal ACAP devices

Xilinx has announced that it has shipped Versal AI Core series and Versal Prime series devices to multiple tier one customers through the company’s early access program.

Versal is the industry’s first Adaptive Compute Acceleration Platform (ACAP), described as heterogeneous compute devices with capabilities that far exceed those of conventional CPUs, GPUs, and FPGAs.

The integrated, multi-core, heterogeneous compute platform can be changed at both the hardware and software levels to dynamically adapt to the needs of applications and workloads in data centre, automotive, 5G wireless, wired and defence markets.

The Versal ACAP is natively software programmable and its architecture features a flexible, multi-Tbit per second network on chip (NoC). By seamlessly integrating all engines and key interfaces, the NoC ensures that the ACAP is available at boot and easily programmed, whatever a developer’s specialism, be they software developers, data scientists or hardware developers, says Xilinx. Tools, software, libraries, IP, middleware, and frameworks are available to dynamically customize accelerated computing using industry-standard design flows.

The Versal ACAP portfolio is based on TSMC’s 7nm process technology ad is claimed to be the first platform to combine software programmability with dynamically configurable domain-specific hardware acceleration. It includes a mix of next-generation scalar engines for embedded compute, adaptable engines for FPGA silicon programmability, and intelligent engines for AI inference and advanced signal processing for advantageous raw performance and performance per Watt capabilities compared to CPU and GPU implementations, adds Xilinx.

The Versal AI Core series delivers the portfolio’s highest compute and lowest latency, for AI inference throughput and performance through the AI Engine. This core is optimised for cloud, networking and autonomous technology and is claimed to offer the highest range of AI and workload acceleration available in the industry.

The Versal Prime series is optimised for connectivity and in-line acceleration to operate across multiple markets and a diverse set of workloads, continues the company.

Both the Versal AI Core series and Versal Prime series include multiple devices, each with dual-core Arm Cortex-A72 application processors, dual-core Arm Cortex-R5F real-time processors, over 2m logic cells of adaptable hardware, and over 3,000 DSP engines optimised for high-precision floating point and low latency. The Versal AI Core devices offer up to 400 AI Engines optimised for AI inference and advanced signal processing workloads.

The Versal portfolio includes four additional series of devices, architected to deliver scalability and AI inference capabilities for diverse applications, from cloud and networking to wireless communications, edge computing, and endpoints.

The Versal AI Core and Versal Prime series will be generally available in the second half of 2019.

http://www.xilinx.com

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Servers are powered by AI for HPC

At this year’s ISC in Frankfurt, Tyan, is showcasing its second generation Intel Xeon Scalable processor-based server platforms. According to the company, they are optimised for predictive analytics, machine learning (ML) and high performance computing (HPC) applications.

“The most demanding workloads including HPC, AI deep learning, data analytics, and multi-cloud infrastructure require maximum performance across compute, memory, storage, and network resources, “said Danny Hsu, vice president of MiTAC Computing Technology’s Tyan business unit

Powered by the newest generation of Intel Xeon Scalable processors, Tyan’s Thunder HX range takes advantage of Intel Deep Learning Boost technology to enable faster machine learning application execution. The Thunder HX FT83-B7119 supports 3Tbyte of memory, 12 hot-swappable 3.5-inch drives in a 4U enclosure. The system is suitable for AI training and inference applications.

Another 4U server system is the Thunder HX FT77D-B7109. It supports dual second generation Intel Xeon Scalable processors with integrated Intel Omni-Path 100Gabit networking fabric that can reach a total of 200Gbits per second fabric connectivity for massively parallel workloads such as scientific computing and large-scale facial recognition.

Tyan’s Thunder HX FT48T-B7105 is a pedestal workstation platform with dual second generation Intel Xeon Scalable processors and support for up to five, high performance workstation graphic cards. The workstation gives maximum I/O to professional power users and can be used for 3D rendering and image processing.

Intel Optane DC persistent memory and increased DDR4 memory speed and capacity features in the Thunder SX FA100-B7118, which is Tyan’s flagship storage server supporting dual second generation Intel Xeon Scalable processors and 100 hot-swap 3.5-inch drives in a 4U rackmount form factor. The platform is designed for both cold storage and large-scale object storage applications such as Lustre.

Visitors will also see the Thunder SX GT90-B7113 which features support for dual Intel Xeon Scalable processors, 12 hot-swap 3.5-inch drives mounted to a service drawer and four hot-swap NVMe U.2 drive bays in a 35-inch deep 1U chassis. The platform matches CSP server-based storage applications by allowing serviceability and density within the same server.

The Thunder CX GT24E-B5556 is a 1U single-socket Intel Xeon E-2100 processor-based server platform for CSP deployment. It has support for up to four DDR4 DIMM slots, one double-width PCIe x16 slot, and dual 10GBase-T Ethernet ports. The platform is optimised for cost-effective cloud gaming applications, confirms Tyan.

Visit Tyan at ISC 2019 (17-19 June) Messe Frankfurt, booth C-1250.

http://www.tyan.com

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