Embedded edge computing modules exploit Intel processor technology

10 new COM Express Type 6 modules have been announced by congatec. They feature the latest Intel embedded processor technology, with four Intel Xeon, three Intel Core, two Intel Celeron and one Intel Pentium processors based on the same Intel microarchitecture (codenamed Coffee Lake H). This enables congatec to provide all 10 new processors on one COM Express module design – the conga-TS370.

This brings the total of processor module variants now available on this single microarchitecture to 14, offering wide scalability, points out the company.

The 45W six-core module with 2.8GHz Intel Xeon E-2276ME processor provides the highest embedded computing performance with integrated high-performance processor graphics currently available, claims congatec. The 2.4GHz Intel Celeron G4930E processor module with 35 watts sets a new price-performance benchmark, adds the company.

The two six-core congatec modules with a TDP of 25W offered on Intel Xeon E-2276ML and Intel Core i7-9850HL processors enable developers to create passively cooled embedded edge computing systems that can run up to 12 standalone virtual machines in parallel, via hyperthreading. This allows operation even in fully sealed systems, under the harshest environmental conditions and with the highest IP protection, asserts congatec. The same applies to the two quad-core modules with Intel Xeon E-2254ML or Intel Core i3-9100HL processor as well as the Intel Celeron G4932E processor-based module, all featuring a – partly configurable – TDP of 25W.

The company has released these modules in response to OEM customers using multi-core platforms to consolidate separate systems on a single embedded edge computer. Hypervisor technology allows customers to operate up to 12 virtual machines in parallel on one system, including real-time controllers (soft PLCs), industry 4.0 gateways for tactile internet via time synchronised networking, IoT gateways for sending big data towards the cloud and central management systems, as well as vision systems, artificial intelligence (AI) and deep learning applications. Software-defined networking functions such as intrusion prevention and detection systems that analyse data traffic parallel to the applications can avoid latencies that would arise with serial operation of analytics and applications, advises congatec.

In addition to embedded edge computing, they can be used in medical imaging systems and human machine interfaces (HMIs) as well as gaming, infotainment and digital signage systems.

http://www.congatec.de

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Time of flight sensors from Premier Farnell provide 3D information

Distributor, Premier Farnell is shipping a range of time of flight (ToF) sensors designed to meet the changing needs of design engineers and address demand for 3D information and extended range created by new use cases. ToF devices support applications such as gesture sensing, distance measurement, robotics, industrial automation and process control, enabling, for example, the monitoring of the position of an object in production as it is transported through a plant on a conveyor belt.

Devices available for next day delivery increase distance capabilities irrespective of colour and surface of the item tracked, maximise potential use within both indoor and outdoor environments and satisfy high-speed, small size and low power demands, driven by Industrial IoT application needs.

A new device is the ISL29501 ToF IC from Renesas. This is designed for detecting objects at distances up to two metres, providing a cost effective and efficient solution for distance measurement, says Premier Farnell. The ISL29501 provides object detection and distance measurement solution when combined with an external emitter (LED or laser) and photodiode. Its small size and low power consumption enable the IC to be used with connected devices in IoT applications, as well as for consumer mobile devices, home automation and the emerging commercial drone market.

There is also the VL53L1X ToF Nucleo pack from ST Microelectronics. The evaluation kit allows anyone to learn, evaluate and develop an application using the VL53L1X ToF, a device based on ST’s patented FlightSense technology. The VL53L1X is claimed to be the fastest miniature ToF sensor on the market with accuracy ranging up to four metres and fast-ranging frequency up to 50Hz. It allows absolute long-distance to be measured independently of target reflectance as instead of estimating the distance by measuring the amount of light reflected back from an object the VL53L1X precisely measures the time the light takes to travel to the nearest object and reflect back to the sensor.

Another tool is the AFBR-S50MV85G evaluation kit, from Broadcom. This comprises an NXP FRDM-KL46Z evaluation board and the AFBR-S50MV85G adapter board for connectivity between the sensor and a microcontroller board without the need for soldering. This sensor is suitable for indoor and outdoor use and optimised for distances of up to 10 metres. It has been developed with a special focus on industrial sensing and gesture sensing applications that require high speed, small size and very low power consumption, such as human machine interfaces, robotics, and augmented reality.

http://www.premierfarnell.com

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Research indicates Pohoiki Beach chip for neural-inspired algortithms

An eight million neuron system, comprised of 64 Phokiki Beach chips, the codename for Loihi chips, is now available to the research community. The neuromorphic system will allow researchers to experiment with Lohi, Intel’s brain-inspired research chip, which applies the principles found in biological brains to computer architectures. Loihi enables users to process information up to 1,000 times faster and 10,000 times more efficiently than CPUs for specialised applications like sparse coding, graph search and constraint-satisfaction problems.

The early results success has led Intel to make Pohoiki Beach available to over 60 ecosystem partners, who will use the system to solve complex, compute-intensive problems, explained Rich Uhlig, managing director of Intel Labs.

Availability means researchers can now efficiently scale up neural-inspired algorithms — such as sparse coding, simultaneous localisation and mapping (SLAM), and path planning — that can learn and adapt based on data inputs.

Intel Labs hopes to scale the architecture to 100 million neurons later this year.

As new complex computing workloads become the norm, there is a growing need for specialised architectures designed for specific applications. This will be achieved by continued process node scaling in the same vein as the power-performance increases achieved by Moore’s Law.

Using the Pohoiki Beach neuromorphic system rather than general purpose computing technologies, Intel hopes to realise gains in speed and efficiency in autonomous vehicles, smart homes and cybersecurity.

“With the Loihi chip we’ve been able to demonstrate 109 times lower power consumption running a real-time deep learning benchmark, compared to a [graphics processor unit] GPU, and five times lower power consumption compared to specialised IoT inference hardware,” said Chris Eliasmith, co-CEO of Applied Brain Research and professor at University of Waterloo. He continued: “As we scale the network up by 50 times, Loihi maintains real-time performance results and uses only 30 per cent more power, whereas the IoT hardware uses 500 per cent more power and is no longer real-time.”

In another research project, Loihi has been used in a neural network that imitates the brain’s underlying neural representations and behaviour. “The SLAM solution emerged as a property of the network’s structure,” explained Konstantinos Michmizos of Rutgers University. “We benchmarked the Loihi-run network and found it to be equally accurate while consuming 100 times less energy than a widely used CPU-run SLAM method for mobile robots,” he said.

Later this year, Intel will introduce an even larger Loihi system, named Pohoiki Springs. Intel’s engineers expect that measurements from these research systems will quantify the gains that are achievable with neuromorphic-computing methods and will clarify the application areas most suitable for the technology. This research paves the way for the eventual commercialisation of neuromorphic technology.

The Intel’s Nahuku boards pictured each contain eight to 32 Intel Loihi neuromorphic chips, interfaced to an Intel Arria 10 FPGA development kit.

(Credit: Tim Herman/Intel Corporation)

http://www.intel.com

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Microchip adds FPGAs and IP to smart embedded vision initiative

Microchip has added low-power PolarFire FPGAs with enhanced high-speed imaging interfaces, an intellectual property (IP) bundle for image processing to its Smart Embedded Vision initiative.

FPGAs are increasingly popular in vision-based systems, for their high bandwidth processing capabilities in intelligent systems deployed in small form factors with tight thermal and power constraints.

The Smart Embedded Vision initiative provides a suite of FPGA offerings that includes IP, hardware and tools for low-power, small form factor machine vision designs across the industrial, medical, broadcast, automotive, aerospace and defence markets.

The initiative includes a serial digital interface (SDI) IP which is used to transport uncompressed video data streams over coaxial cabling. The interface is available in multiple speeds: HD-SDI (1.485Gbits per second, 720p, 1080i), 3G-SDI (2.970Gbits per second, 1080p60), 6G-SDI (5.94Gbits per second, 2Kp30) and 12G-SDI (11.88 Gbits per second, 2Kp60).

A MIPI-CSI-2 IP, operating at 1.5Gbits per second per lane is a sensor interface that links image sensors to FPGAs. The PolarFire family supports receive speeds up to 1.5Gbits per second per lane and transmit speeds up to 1Gbits per second per lane.

There is also an image sensor interface IP. The 2.3Gbits per second per lane SLVS-EC Rx – SLVS-EC Rx supports high-resolution cameras. Customers can implement a two-lane or eight-lane SLVS-EC Rx FPGA core.

Microsemi’sPolarFire family can support one, 2.5, five and 10Gbits per second speeds over an Ethernet PHY, enabling the initiative to meet the need for Universal Serial 10GE Media Independent Interface (USXGMII) MAC IP with auto-negotiation.

CoaXPress is a standard used in high- performance machine vision, medical and in industrial inspection. Microchip will support CoaXPress v2.0, which doubles the bandwidth to 12.5Gbits per second.

The HDMI 2.0b IP core today supports resolutions up to 4K at 60 frames per second transmit and 1080p at 60 frames per second receive.

The PolarFire FPGA imaging IP bundle features the MIPI-CSI-2 and includes image processing IPs for edge detection, alpha blending and image enhancement for colour, brightness and contrast adjustments.

A new ecosystem partner is Kaya Instruments, which provides PolarFire FPGA IP Cores for CoaXPress v2.0 and 10 GigE vision. The ecosystem also includes Alma Technology, Bitec and artificial intelligence partner ASIC Design Services, which provides a Core Deep Learning (CDL) framework that enables a power-efficient convolutional neural network (CNN)-based imaging and video platform for embedded and edge computing applications.

All Smart Embedded Vision solutions are supported by the Libero® SoC Design Suite, Microchip’s comprehensive development tool.

Through the Libero SoC Design Suite, all IP can be implemented on the PolarFire FPGA Video and Imaging Kit, the evaluation platform for Smart Embedded Vision designs.

http://www.microchip.com

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