Intel ships 10nm Agilex FPGAs for networking, 5G and data analytics

Shipments have commenced for the Intel Agilex field programmable gate arrays (FPGAs). The devices are being used by early access program customers to develop advanced solutions for networking, 5G and accelerated data analytics.

Participants in the early access program include Colorado Engineering, Mantaro Networks, Microsoft and Silicom.

Dan McNamara, Intel senior vice president and general manager of the Networking and Custom Logic Group, said that the Agilex FPGA family leverages architecture, packaging, process technology, developer tools and a fast path to power reduction with eASIC technology to enable new levels of  heterogeneous computing, system integration and processor connectivity. It will be the first 10nm FPGA to provide cache-coherent and low latency connectivity to Intel Xeon processors with the upcoming Compute Express Link, he added.

The Agilex FPGAs are expected to provide the agility and flexibility that is demanded by data-centric, 5G-fuelled operations where networking throughput must increase and latency must decrease. Intel Agilex FPGAs deliver “significant gains in performance and inherent low latency,” says the company. They are reconfigurable and have reduced power consumption, together with computation and high-speed interfacing capabilities that enable smarter, higher bandwidth networks to be created. They also contribute to delivering real-time actionable insights via accelerated artificial intelligence (AI) and other analytics performed at the edge, in the cloud and throughout the network.

According to Doug Burger, technical fellow, Azure Hardware Systems at Microsoft, the software company has been working closely with Intel on the development of the Agilex FPGAs and is planning to use them in accelerating real-time AI, networking and other applications/infrastructure across Azure Cloud Services, Bing and other data centre services.

The Intel Agilex family combines second-generation HyperFlex FPGA fabric built on Intel’s 10nm process, which is up to 40 per cent higher performance or up to 40 per cent lower total power compared with Intel Stratix 10 FPGAs. There is also the heterogeneous 3D silicon-in-package (SiP) technology based on Intel’s proven embedded multi-die interconnect bridge (EMIB) technology. As a result, Intel can integrate analogue, memory, custom computing, custom I/O and Intel eASIC device tiles into a single package along with the FPGA fabric.

Intel also says they are the only FPGAs that support hardened BFLOAT16, with up to 40TFLOPS of digital signal processor (DSP) performance. They also have the ability to scale for higher bandwidth compared with PCIe Gen 4, due to the use of PCIe Gen 5.

Transceiver data rates support up to 112Gbits per second for high-speed networking requirements for 400GE and beyond. There is also support for memory option, such as current DDR4, upcoming DDR5, HBM, and Intel Optane DC persistent memory.

Design development support for Intel Agilex FPGAs is available today via Intel Quartus Prime Design Software.

http://www.intel.com

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Congatec introduces rugged data processing engines for oil and gas

Robust embedded edge server platforms for the energy sector will be introduced by congatec at SPE Offshore Europe next month (3 to 6 September).

The oil and gas industry is characterised by distributed assets and infrastructures in harsh environments and therefore require ultra-robust embedded platforms for the digital transformation challenge that offers a huge potential for cost savings.

Digitisation could reduce production costs by up to 30 per cent, estimates the International Energy Agency, with potential savings through efficient maintenance and better operation of assets. “There is also further potential for savings in the supply chain, through the use of artificial intelligence (AI) and integrated platforms that connect organizations with external partners,” explains Dan Demers, director sales and marketing at congatec Americas.

To meet the requirements of the upstream and mid-stream oil and gas industry, congatec’s embedded edge computing platforms are designed for extended temperature ranges, with optional conformal coating to protect against the effects of salt water or condensation caused by large temperature fluctuations. They also offer comprehensive server class reliability, availability, serviceability (RAS) features that enable OEMs to reliably manage thousands of devices remotely. As multi-core designs with currently up to six cores and a particularly low 25W thermal dynamic performance (TDP), they are suitable for completely fanless – and therefore maintenance-free  – 24/7 operation in hermetically sealed housings with the highest IP protection classes, says congatec. Virtual machines based on Real-Time Systems’ hypervisor technologies allow optimal use of existing computing resources by partitioning the various tasks – including local real-time control requirements.

Virtualisation also means that the new platforms are tailored to build cost-efficient universal customer premises Equipment (uCPE). Such open standard hardware equipment is characterised by hosting telecomms network functions at the customers edge IT including software defined networks (SDN) and network functions virtualisation (NFV).

Visit congatec at SPE Offshore Europe, Aberdeen, Scotland, 3 to 6 September, Hall 1, stand 1AA62.   

http://www.congatec.com

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“World’s largest chip” has more compute cores for data access

Claimed to be the largest chip in the world, the Cerebras wafer scale engine (WSE) measures 216 x 216mm (8.5 x 8.5 inch). At 46,225mm2 the chip is 56x larger than the biggest graphics processing unit (GPU) ever made, claims Cerebras.

It has 400,000 cores and 18Gbyte on-chip SRAM. The large silicon area, more than the largest graphics processing unit, enables the WSE to provide more compute cores, tightly coupled memory for efficient data access, and an extensive high bandwidth communication fabric for groups of cores to work together, claims Cerebras.

The WSE contains 400,000 sparse linear algebra (SLA) cores. Each core is flexible, programmable, and optimised for the computations that underpin most neural networks. Programmability ensures the cores can run all algorithms for constantly changing machine learning operations.

The cores on the WSE are connected via the Swarm communication fabric in a 2D mesh with 100 petabytes (Pbytes) per second of bandwidth. The Swarm on-chip communication fabric delivers breakthrough bandwidth and low latency at a fraction of the power draw of traditional techniques used to cluster GPUs, says Cerebras. It is fully configurable. Software configures all the cores on the WSE to support the precise communication required for training the user-specified model. For each neural network, Swarm provides an optimised communication path.

The 18Gbyte of on-chip memory is accessible within a single clock cycle, and provides 9 Pbytes per second memory bandwidth. This is 3,000 times more capacity and 10,000 times greater bandwidth than the leading competitor, claims Cerebras. The WSE provides moree cores, more local memory and enables fast, flexible computation, at lower latency and with less energy than other GPUs, concludes Cerebras.

https://www.cerebras.net/technology/

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Optiga Trust M secures automated, cloud connected devices

To improve the security and performance of cloud connected devices and services, Infineon has launched the Optiga Trust M.

It helps manufacturers to enhance the security of their devices, says Infineon, and improves overall system performance. The single chip securely stores unique device credentials and enables devices to connect to the cloud up to 10 times faster than software-only alternatives, claims the company. It is intended for industry and building automation, smart homes and consumer electronics and anywhere that hardware-based trust anchors are critical for connected applications and smart services, from a robotic arm in the smart factory to automated air conditioning in the home.

The growth of cloud connectivity and AI-based applications means that zero-touch provisioning of devices to the network or cloud is gaining more and more traction. Optiga Trust M injects critical assets, such as certificates and key pairs which identify a device, into the chip at the factory premises. The turnkey set-up minimises design, integration and deployment of embedded systems by providing a cryptographic toolbox, protected I2C interface and open source code on GitHub. The high-end security controller is certified according to CC EAL6+ (high) and provides advanced asymmetric cryptography. It has a lifetime of 20 years and can be securely updated in the field.

Infineon’s Optiga family combines hardware security controllers with software to increase the overall security of embedded systems, including IoT end nodes, edge gateways and cloud servers, from basic device authentication to Java card-based programmable components.

The Optiga Trust M is available now. Evaluation kits are also available.

http://www.infineon.com

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