6/10W power modules from XP Power are for industrial and ITE applications

Two wide input range chassis and DIN rail mount DC/DC converters introduced by XP Power are claimed to offer simple and rapid installation into a variety of industrial and ITE applications.

The DTE06 and DTE10 DC/DC converters provide 6.0 and 10W of power and offer a 4:1 input range, giving a wide tolerance for fluctuating supplies. Nominal inputs are 12/24V DC and 24/48V DC; the converters cover inputs between 9.0 and 75.0V DC.

The converters are supplied fully-potted in chassis mount format with screw terminals to save time when mounting and for reliable connection. A DIN rail mount is optionally available for use in control cabinets and household consumer units.

A power-good LED indicator confirms correct operation.

All DC/DC converters in both series are IEC/UL/cUL 62388-1 safety approved and offer 3.0kV DC isolation between the supply and load. They also comply with EN55032 Class A emissions with no external components, meaning that no additional filtering is required for EMC compliance.

The device has input under-voltage, short circuit and over-load protection. To control the DC/DC converters there is a remote on/off feature.

The rugged DTE06 and DTE10 series operate over a -40 to +105 degrees C temperature range and deliver full rated power at temperatures up to +80 degrees C.

The DTE06 & DTE10 series are offered with a three-year warranty and are available directly from XP Power or from Digi-Key, element14, Farnell, Mouser, RS Components and approved regional distributors.

XP Power provides AC/DC power supplies, DC/DC converters, high voltage power supplies and RF power supplies.

Qualified to ISO9001:2008, XP Power offers in-house design through to manufacturing facilities around the world with 27 sales offices throughout Europe, North America and Asia.

XP Power has design centres in Fyfield (UK), Orange County (California, USA), and Singapore, which also serves as the company’s headquarters. Manufacturing is carried out near Shanghai, China and Ho Chi Minh City, Vietnam. Dedicated in-house Engineered Solutions teams provide customer specific solutions, with rapid response times. The applications team provide expert technical support to help customers integrate and use XP power products worldwide.

http://www.xppower.com

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Wide-angle thermal MEMS sensor contactless offers Omron’s widest field of view

Omron Electronic Components Business Europe has added a wide angle 32 x 32 element version of its D6T MEMS thermal sensor. It offers the widest field of view that Omron has ever delivered, says the company.

The Omron D6T-32L-01A can view across 90.0 x 90.0 degrees, enabling it to encompass a wide area, such as a whole room, from a single point. The sensor offers contactless measurement of temperatures of 0 to 200 degrees C in ambient temperatures of -10 to + 70 degrees C.

Omron D6T MEMS thermal sensors are based on an IR sensor which measures the surface temperature of objects without touching them using a thermopile element that absorbs radiated energy from the target object. They incorporate a MEMS thermopile, custom designed sensor ASIC and signal processing microprocessor and algorithm in a tiny package. According to Omron, the D6T offers the highest signal-to-noise ratio (SNR) in the industry. It converts the sensor signal to a digital temperature output giving a straightforward interface to a microcontroller. The design of the D6T, which measures only 14 x 8 x 8.93mm for the largest 32 x 32 element version, makes it well-suited to temperature detection in a range of IoT and other embedded applications.

The D6T-32L is one of three D6T variants by Omron, joining the 1×8 D6T-8L-09H and the 4×4 D6T-44L-06H, offering 54.5 x 5.5 and 44.2 by 45.7 degrees respectively. These two devices offer contactless temperature measurement between 5.0 to 200 degrees C at ambient temperatures of 5.0 to 45 degrees C.

The D6T sensors can be used to detect abnormal temperatures in industrial equipment on the production line to monitoring of food and other temperatures in the kitchen. This can save costs, allowing preventative maintenance to be undertaken in a timely manner, points out Omron, and can even save lives. They can also detect the presence and location of people in a space accurately and reliably.

http://components.omron.eu  

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Rohde & Schwarz validates 5G NR protocol conformance tests

Rohde & Schwarz has carried out 5G NR protocol conformance testing with the R&S CMX500 radio communication tester. The Global Certification Forum GCF has accepted these 41 test cases, defined by 3GPP, in different FR1 and LTE band combinations. Accredited test houses, cell phone and chipset manufacturers can add the CMX500 to existing LTE test set ups, to smoothly upgrade path from LTE to 5G NR testing.

Mobile network operators worldwide rely on the certification schemes of the GCF and PTCRB certification forum for mobile devices in their networks. The CMX500 adds 5G NR signalling and RF testing by measuring the RF parameters of 5G NR transmissions and performing protocol tests. As most network operators will implement 5G NR as an extension of an LTE mobile network, the CMX500 can be seamlessly integrated into existing LTE test environments. It is also ideal for 5G NR testing in standalone (SA) mode. Developers using the R&S CMW500 wideband radio communication tester or R&S CMWflexx test system can continue to use them for LTE measurements and add the CMX500 as an extension to perform tests on 5G NR signals.

The Rohde & Schwarz technology group develops, produces and markets communications, information and security products for professional users. The group’s test and measurement, broadcast and media, aerospace, defence, security, networks and cybersecurity business fields address many different industry and government-sector market segments.

The company has its headquarters in Munich, Germany. It subsidiaries in more than 70 countries, with regional hubs in Asia and America.

http://www.rohde-schwarz.com

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GigaDevice claims a first for open source RISC-V based 32-bit mcu

Believed to be the world’s first open source RISC-V based GD32V series 32-bit general purpose microcontroller (MCU), the GD32 family is announced by GigaDevice. The company says it offers tool chain support from MCU to software libraries and development boards, creating a strong RISC-V development ecosystem.

The first product line in the family is the GD32VF103 series RISC-V MCU. It is designed for mainstream development, says GigaDevice. There are 14 models, including QFN36, LQFP48, LQFP64 and LQFP100, compatible with existing GD32 MCUs in software development and pin packaging.

According to GigaDevice, the design accelerates the development cycle between GD32’s Arm core and RISC-V core products, making product selection and code porting flexible and simple. The GD32VF103 devices are specifically targeted for embedded applications ranging from industrial control, consumer electronics, IoT, edge computing to artificial intelligence and deep learning.

The GD32VF103 MCU series adopts the Bumblebee processor core based on the open source RISC-V instruction set architecture, jointly developed by GigaDevice and Nuclei System Technology. The Bumblebee core uses a 32-bit RISC-V open source instruction set architecture and supports custom instructions to optimise interrupt handling. It is equipped with a 64-bit wide real-time timer and can also generate timer interrupts defined by the RISC-V standard, with support of dozens of external interrupt sources, while possessing 16 interrupt levels and priorities, interrupt nesting and fast vector interrupts processing mechanism.

The low-power management unit can support two-levels of sleep mode. The core supports standard JTAG interfaces and RISC-V debug standards for hardware breakpoints and interactive debugging. The Bumblebee core supports the RISC-V standard compilation tool chain, as well as Linux/Windows graphical integrated development environment.

The core is designed with a two-stage variable-length pipeline microarchitecture with a streamlined dynamic branch predictor and instruction pre-fetch unit. The performance and frequency of the traditional architecture three-stage pipeline can be achieved at the cost of the two-stage pipeline, achieving industry-leading energy efficiency and cost advantages, claims GigaDevice.

The GD32VF103 MCU operates at up to 153DMIPS at the highest frequency and under the CoreMark test achieves 360 performance points. This is a 15 per cent performance improvement compared to the GD32 Cortex-M3 core. Dynamic power consumption is reduced by 50 per cent and the standby power consumption is reduced by 25 per cent, adds the company.

The GD32VF103 series RISC-V MCUs provide a processing frequency of 108MHz, 16kbyte to 128kbyte of on-chip flash and 6 to 32kbyte of SRAM cache, equipped with the gFlash patented technology, which supports high-speed core accesses to flash in zero wait time. The core also includes a single-cycle hardware multiplier, hardware divider and acceleration unit for advanced computing and data processing challenges.

The chip is powered by 2.6 to 3.6V and the I/O ports can withstand 5V voltage level. It is equipped with a 16-bit advanced timer supporting three-phase PWM complementary outputs and Hall acquisition interface for vector control. It also has up to four 16-bit general-purpose timers, two 16-bit basic timers, and two multi-channel DMA controllers. The interrupt controller (ECLIC) provides up to 68 external interrupts and can be nested with 16 programmable priority levels to enhance the real-time performance of high-performance control.

Peripheral resources include up to three USART, two UART, three SPI, two I2C, two I2S, two CAN2.0B, one USB 2.0 FS OTG and an External Bus Expansion Controller (EXMC). The I2C interface supports Fast Plus (Fm+) mode with frequencies up to 1MHz (1Mbits per second), which is two times faster than the previous speed, says GigaDevice. The SPI also supports four-wire system and more transmission modes, including the easy expansion to Quad SPI for high-speed NOR Flash accesses. The USB 2.0 FS OTG interface provides multiple modes such as device, host, and OTG, while the EXMC connects to external memory such as NOR Flash and SRAM.

The GD32VF103 series RISC-V MCUs also integrate two 12-bit high-speed ADCs with sampling rates up to 2.6Msamples per second, provides up to 16 reusable channels, supports 16-bit hardware oversampling filtering and resolution configurability and it has two 12-bit DAC. Up to 80 per cent of GPIOs have optional features and support port remapping.

http://www.gigadevice.com

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