ON Semiconductor’s digital image sensor enables AI vision systems

Intelligent vision systems for viewing and artificial intelligence (AI) can be implemented using the low power 0.3Mpixel image sensor announced by ON Semiconductor.

The ARX3A0 digital image sensor has 0.3Mpixel resolution in a 1:1 aspect ratio. It can perform like a global shutter in many conditions, with up to 360 frames per second (fps) capture rate, yet with the size, performance and response levels that relate to being a back-side illuminated (BSI) rolling shutter sensor, explains ON Semiconductor. It has a small size, square format and high frame rate, making it particularly suitable for emerging machine vision, AI and augmented reality/virtual reality (AR/VR) applications, as well as small supplemental security cameras.

To meet the demands of applications that provide still or streaming images, the ARX3A0 is designed to deliver flexible, high-performance image capture with minimal power. It consumes less than 19mW when capturing images at 30 frames per second, and just 2.5mW when capturing one frame per second.

The 1/10 in square format enables low height modules and the 3.5 mm die size helps maximise the sensor’s field of view. It can therefore be used in emerging applications where orientation is not fixed but space is limited, such as AR/VR goggles, monitoring the wearer’s eye movement. Eye movement data can be used to adjust the image viewed and possibly mitigate motion sickness. Another application is simultaneous localisation and mapping (SLAM), which can also capitalise on the ARX3A0’s size and low power.

The monochrome sensor is based on a 560 by 560 active-pixel array featuring ON Semiconductor’s NIR+ technology, giving it high sensitivity at near IR wavelengths for performance in no-light conditions or when lighting is used that is non-detectable by the human eye.

Power management features include the ability to automatically wake from a low power mode when detecting motion or lighting changes in the scene. This allows the sensor to become the main source of wake for an entire camera system saving even more system power.

Gianluca Colli, vice president and general manager, Consumer Solution Division of Image Sensor Group at ON Semiconductor said: “As we approach an era where AI is becoming an integral part of vision-based systems, it becomes clear that we now share this world with a new kind of intelligence. The ARX3A0 has been designed for that new breed of machine, where vision is as integral to their operation as it is ours.”

The ARX3A0 is available in both chip scale package and reconstructed wafer die. Evaluation boards running on ON Semiconductor’s industry leading PC-based DevWare system and prototype modules are also available through ON Semiconductor and authorised distributors.

http://www.onsemi.com

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congatec mixes FinFET with NXP i.MX Mini in SMARC COM module

The conga-SMX8-Mini offers higher performance at significantly fewer watts due to the new 14nm FinFET structure, claims congatec. The SMARC 2.0 computer-on-module (COM) with NXP i.MX 8M Mini processor offers visualisation capabilities, such as 3D graphics with full-HD resolution and a low thermal and system cost, congatec adds.

The processor integrated GC NanoUltra 3D GPU convinces with comprehensive 1080p video decoding (H.265, H.264, VP8/9) and encoding (H.264, VP8) capabilities for one embedded display that can be connected via dual Channel LVDS, eDP or MIPI-DSI. Up to 4Gbyte of low-power LPDDR4 and an eMMC 5.1 non-volatile memory with up to 128Gbyte provide extensive memory capacity on the module. Embedded cameras are connected via the MIPI-CSI-2 interface, while five USB 2.0 and three UART ports are for industrial use. For intersystem connect, the module offers Gbit Ethernet as well as optional M2 WiFi/Bluetooth extension.

The SMARC 2.0 platform is designed for established markets – such as industrial and medical HMIs, kiosk, vending and infotainment systems – as well as new markets, including situational awareness, machine learning or voice controlled and video enabled residential gateway devices. For mobile and transportation applications, the conga-SMX-Mini SMARC modules offer extended temperature support from -40 to +85 degrees C and an extended longevity of up to 15 years.

Smart vision-based applications benefit from the hardware-accelerated MIPI CSI-2 camera interface.

The modules offer 2GHz performance, less TDP, and lower costs compared to the 1.5 GHz NXP i.MX 8M variants and can be used with SMARC MIPI CSI-2 starter kits, offering vision camera logic from congatec’s co-operation with Basler. As a result, highly integrated embedded vision platforms are available from a single source that support the development of cost-efficient vision devices for sparse modelling-based AI in the industrial and medical technology sectors, in retail checkout systems or for smart home or facility access control systems, explains congatec.

The conga-SMX8-Mini SMARC modules are application-ready sub-systems with an ecosystem that includes ready-to-go boot loader implementation, pre-qualified Linux, Yocto and Android BSPs and fully featured evaluation carrier boards. congatec’s personal integration support and individually selectable technical services are designed to simplify the integration of this new NXP processor for customers.

https://www.congatec.com

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Phihong showcases EV charging options

At the 2019 Electric & Hybrid Vehicle Technology Expo, Phihong will highlight its high-efficiency EV charging systems, including portable, wall-mounted, and pedestal AC and DC chargers for all types of electric vehicle (EV) bus and passenger car applications.

The company will exhibit high-efficiency AC and DC EV charging systems, as well as integrated software for front-end, back-end, central office, and cloud-based management and data analysis systems.

Phihong will highlight an ergonomically-designed, IP54-rated weatherproof casing for its AC chargers which can be wall-mounted or on free-standing pedestals for indoor or outdoor use. The charger is available with wired or wireless connectivity for communication with a central office to provide operator assistance, trouble-shooting, software updates, and charging status updates. Optional features are an RFID card reader for user authentication and charging facility monitoring for fleet management, service station, or parking garage applications.

Another exhibit will be free-standing DC chargers, with an output power range of 120, 150 or 180kW. The charging stations feature GB/T compatible interfaces and fast charging times. A 10.4-inch touchscreen, intelligent RFID card reader and an integrated Ethernet connection, provide a user-friendly interface with a central office for remote assistance and trouble-shooting. They also feature an electronic lock function to ensure safety during the charging process.

Portable DC chargers have an output power range of 20, 40 or 60kW for rapid charging, and a locking GB/T interface for safety. For user interface they have either a seven- or 10.4-inch touchscreen, an integrated Ethernet connection and an intelligent RFID card reader. Narrow-range voltage (200 to 500V) and low voltage (30 to 100V) options are also available.

There will also be a 360kW liquid-cooled DC EV charging station for high volume fast charging in bus or fleet operations.

Phihong will be exhibiting at Booth 419 at the 2019 Electric & Hybrid Vehicle Technology Expo, (10 to 12 September) at the Suburban Collection Showplace, Novi, Michigan.

https://www.phihong.com

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Power Integrations introduces GaN to LYTSwitch drivers

The latest members of Power Integrations’ LED driver ICs, the LYTSwitch-6 family, use PowiGaN technology to enable designs that deliver up to 110W with 94% conversion efficiency using a simple, flexible flyback topology.

The high efficiency eliminates the need for heatsinks, reducing ballast size, weight and cooling airflow requirements, says Power Integrations. The 750V PowiGaN primary switches provide very low RDS (on) and reduced switching losses, increasing power conversion efficiency by up to three per cent compared to conventional solutions and reducing wasted heat by more than one-third.

LYTSwitch-6 ICs with PowiGaN technology employ lossless current sensing. They retain existing LYTSwitch-6 characteristics, such as fast transient response for cross regulation for parallel LED strings without the need for additional regulator hardware, and flicker-free system operation, says the company. This allows simple implementation of a pulse width modulation (PWM) dimming interface.

The LYTSwitch-6 ICs with PowiGaN technology enable designs up to 110W for smart residential and commercial fixtures and low-profile ceiling troffers. The high power density enables reduced height and weight, which is vital for space-constrained and sealed ballast applications.

The GaN-based LYTSwitch-6 LED-driver ICs are available now. A reference design (DER-801) is also available, describing a 100W three-way dimming LED ballast.

Power Integrations specialises in semiconductor technologies for high-voltage power conversion, with products that are key building blocks in the clean-power ecosystem, enabling the generation of renewable energy as well as the efficient transmission and consumption of power in applications ranging from mW to MWs.

http://www.power.com

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