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ams adds laser detection auto-focus that sees through smudges

Thu, Sep 26, 2019

Laser detection auto-focus for a smartphone camera that can accurately zero in on the target when the cover glass is smudged or dirty is possible with TMF8801 time of flight (ToF) sensor from ams.

The sensor is claimed to be the world’s smallest integrated module for direct ToF distance measurement, providing accurate measurements from 20 to 25mm.

The TMF8801 is more than 30 per cent smaller than competing ToF sensors, claims ams, for compact designs. Unlike competing ToF sensors which struggle to accurately measure distance below dirty or smudged cover glass, the TMF8801 maintains high accuracy through use of its on-chip histogram processing, ams says.

The TMF8801 direct ToF sensor complements the TMF8701 short range ToF sensor released in 2018 and provides extended distance range sensing for smartphones. Dave Moon, senior product marketing manager in the Integrated Optical Sensors business line at ams, said: “The TMF8801 is ideally suited to provide support for improving world-facing mobile phone camera performance using laser detection auto-focus (LDAF), enabling mobile phone users to take pin-sharp photos and selfies.”

The ToF performance is achieved through use of an integrated VCSEL infra red emitter, multiple single photon avalanche photo-diode (SPAD) light detectors, time-to-digital converter, and on-chip microcontroller for processing histograms. Compared to distance averaging employed with an indirect ToF system, the direct ToF time measurement methodology used in the TMF8801 delivers higher accuracy true-distance measurements, claims ams.

High accuracy distance measurements, combined with LDAF, improve camera performance, with sharper, in-focus images under any ambient lighting conditions, and accurate adjustment of the camera flash brightness to improve picture quality.

The small size and low power consumption of the TMF8801 is suitable for fast-ranging collision avoidance detection used in autonomous vacuum cleaners, and industrial robotics. For display-based products, such as mobile computing, the TMF8801 can be used for user presence detection to automatically wake up or put the system into a low-power sleep mode based on the presence or absence of a user.

The TMF8801 is housed in a 2.2 x 3.6 x 1.0mm package and is in volume production.

https://www.ams.com

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HD LCD video controller has MIPI-CSI2 input for parking assist

Wed, Sep 25, 2019

Claimed to be the first full HD 1080p LCD video controller to include a four-lane MIPI-CSI2 input, the RAA278842 LCD video controller’s four-lane (or dual two-lane) MIPI-CSI2 input supports up to 1Gbit per second per lane. This allows it to interface with the latest generation of automotive cameras, application processors and graphics processors, explains Renesas Electronics. The controller also supports a 150 MHz single-channel OpenLDI interface and a variety of video interfaces and LCD panel sizes with resolutions up to 1920 x 1080.

The RAA278842 can be used for automotive central infotainment displays (CIDs) and head units, instrument clusters, head-up displays (HUDs) and mirror replacement display applications for advanced driver assistance systems (ADAS).

“The RAA278842 LCD video controller helps automotive system manufacturers develop versatile and reliable display systems that provide superior HMI graphics for analogue and digital video content,” said Niall Lyne, senior director, automotive mixed-signal/power and video, Renesas Electronics. “Our strong heritage in video signal processing for backup cameras along with highly differentiated new technology is valued by automakers and Tier-1 suppliers worldwide,” he said.

The RAA278842 LCD video controller has 10-bit per colour processing built into the image enhancement engine to provide near-zero latency, high quality video. Integrated video diagnostics detect if the incoming video is frozen or corrupted and can provide a direct path for the rear camera video to be displayed on the LCD. This significantly improves rear camera display reliability, explains Renesas, claiming that it virtually eliminates the possibility of a software-related problem causing the rear camera video to be displayed incorrectly or not at all. The RAA278842 can display the camera image on an LCD in less than 500 milliseconds, addressing the fast boot requirement of many OEMs. The EEPROM/SPI flash fast boot allows register programming without requiring an external microcontroller

The RAA278842 with MIPI-CSI2 output and the RAA278843 with traditional BT.656 output, work with the system’s main processor to monitor the camera and the video data coming from the SoC or graphics processor unit (GPU). After vehicle ignition, while the instrument cluster boots up, the RAA27884x controller can display the carmaker’s logo or live camera video. The controller’s on-screen display feature can also simulate warning lamp checks in an instrument cluster application.

Both controllers enable compliance with FMVSS-111, requiring the blind spot area behind the vehicle is displayed in less than two seconds after the driver places the vehicle in reverse gear.

Proprietary input switching eliminates flicker when switching between sources, claims Renesas and the AEC-Q100 Grade-2 qualified devices are specified for operation from -40 to +105 degrees C

The RAA278842 and RAA278843 can be combined with Renesas’ R-Car SoC family, RH850 MCU family, and RL78 MCU family, as well as the ISL78302 dual LDO, ISL78322 dual 2A/1.7A synchronous buck regulator, and ISL78228 dual 800mA synchronous buck regulator to provide power rails for the RAA27884x and other ICs on the automotive infotainment system board.

Mass production quantities of the RAA278842 with MIPI-CSI2 output are available now in a 14 x 14mm, 128-lead LQFP package.

Mass production quantities of the RAA278843 with BT.656 output are available now in a 14mm x 14mm, 128-lead LQFP package.

http://www.renesas.com

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RS Components introduces compact IR temperature sensor for smart factories

Wed, Sep 25, 2019

Designed for space-sensitive factory maintenance, repair and operations (MRO) in smart manufacturing environments, the RS Pro infra red temperature sensor by RS Components is a low-cost non-contact voltage-output temperature sensor.

It has been designed to fit into tight spaces and show the measured temperature in- situ, so maintenance engineers do not have to return to the control room to check it.

The RS Pro infra red temperature sensor measures just 30mm deep and 31mm in diameter. It has a side-entry cable making it easy to mount in small spaces. The temperature is displayed on a built-in backlit OLED display, without the need for contact with the target surface. The sensor can be used where it is not possible to use contact probes, for example when the target is moving or inaccessible; it will fit between a wheel and the rim or hub of a disc brake.

The RS Pro infra red temperature sensor can measure surface temperatures from 0 to 1,000 degrees C to an accuracy of ±1.5 per cent of reading or ±1.5 degrees C, whichever is greater, and repeatability of ±0.5 per cent of reading or ±0.5 degrees C. Response time is just 250ms, allowing continuous monitoring by industrial process instrumentation via the DC voltage output.

The sensor provides simultaneous voltage and alarm outputs. The voltage output can be configured as 0 to 5V DC, 1.0 to 5V DC or 0 to 10V DC, with adjustable temperature range scaling, configured using built-in controls on the sensor. The open-collector alarm output offers adjustable temperature threshold and hysteresis.

The sensor is supplied set up to measure non-reflective surfaces such as paper, plastics, rubber, wood, tarmac, food, pharmaceuticals, organic materials and painted metal. To measure the temperature of reflective solid or liquid surfaces, the user can adjust emissivity settings between 0.20 and 1.00.

The RS PRO infra red temperature sensor is fitted with a 1m long cable, as standard. This can be extended using terminal blocks or connectors. An optional air purge collar helps keep the lens clean from smoke, fumes, dust, steam or other potential contaminants.

The device is IP65-rated.

https://uk.rs-online.com

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HBI+ PHY supports 2.5D interconnect for SoC partitioning

Wed, Sep 25, 2019

7nm high bandwidth interconnect (HBI+) PHY for die-to-die interconnects from eSilicon supports 2.5D applications such as silicon interposers and silicon bridges for system on chip (SoC) to chiplets and SoC partitioning.

The 7nm HBI+ physical interface (PHY) IP is available for license for customer designs. The hard IP block delivers a high-bandwidth, low-power and low-latency wide-parallel, clock-forwarded PHY interface for 2.5D applications including SoC to chiplets and SoC partitioning for complex sub-systems. Silicon interposer and silicon bridge technologies are supported, adds eSilicon.

The HBI+ PHY delivers a data rate of up to 4.0Gbits per second per pin. Flexible configurations include up to 80 receive and 80 transmit connections per channel and up to 24 channels per PHY, with one redundant lane per channel to improve production yields. The part also supports built-in self-test (BIST), internal loopback and external PHY-to-PHY link tests. It supports IEEE 1149.1 (JTAG) and 1149.6 (AC JTAG) boundary scan standards.

Hugh Durdan, vice president, strategy and products at eSilicon, said: “This new HBI+ PHY will help to enable a growing chiplet ecosystem that is supported by many new and innovative technologies.”

The earlier version of this PHY (HBI, 2.5 Gbits per second per pin) was used successfully on a customer ASIC at 14nm. eSilicon is currently in design with a major customer ASIC in 7nm using the HBI+ PHY.

eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Its ASIC-proven, differentiating IP includes configurable 7nm 56G/112G SerDes plus networking-optimised 16, 14 or 7nm FinFET IP platforms featuring HBM2 PHY, TCAM, specialised memory compilers and I/O libraries. The company’s neuASIC platform provides AI-specific IP and a modular design methodology to create adaptable, efficient artificial intelligence (AI) ASICs. eSilicon serves the high-bandwidth networking, high-performance computing, AI and 5G infrastructure markets.

http://www.esilicon.com

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ams adds laser detection auto-focus that sees through smudges

HD LCD video controller has MIPI-CSI2 input for parking assist

RS Components introduces compact IR temperature sensor for smart factories

HBI+ PHY supports 2.5D interconnect for SoC partitioning

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