TVS diodes protect in smaller packages

The latest generation of transient voltage suppression (TVS) diodes from STMicroelectronics deliver higher protection in smaller packages, says the company.

The TVS diodes are claimed to deliver market-leading power density, handling 600W and 1500W transient power in SMB Flat, and 400W and 600W in SMA Flat packages that have a low profile of just 1.0mm.

In addition to the lower profile, ST’s 1500W SMB Flat package has transient-power capability equivalent to that of conventional devices in SMC packages, in a footprint more than 50 per cent smaller. The 400W and 600W SMA Flat and SMB Flat devices are footprint-compatible with alternatives in conventional SMA and SMB packages, adds ST. Leakage current is five times lower compared with other TVS diodes on the market, to minimise the impact on system operation and power consumption.

The low-profile, high-power protection diodes cover a range of standoff voltages from 5.0V to 188V, suitable for use in applications such as telecomms equipment, e-bikes, drones, robots, automotive electronics, consumer products and power tools.

Industrial-grade and AEC-Q101 automotive-qualified parts are available.

The 400W and 600W devices are in production now, 1500W diodes are available in sample quantities and will enter production in early 2020.

All packages feature wettable flanks that facilitate automatic optical inspection (AOI) for production quality control.

http://www.st.com/tvs

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Ready-to-use development kits jumpstart LPWAN connectivity

LoRa development packs from STMicroelectronics enable users, from large corporations to smaller companies, independent designers, hobbyists and schools, to use long-range, low power wireless IoT connectivity.

ST offers two packs to provide a LoRaWAN (LoRa wide area network) development chain including gateway and end-node boards, firmware and tools, and using ST’s STM32 Nucleo evaluation boards.

The packs cater for regions with 868, 915M or 923MHz and sub-550MHz industrial, scientific, medical (ISM) frequency bands. Each as proprietary gateway software and ST’s I-Cube-LRWAN end-node software. The node and gateway boards come with an antenna and on-board debugger.

The P-Nucleo-LRWAN2 pack is for high-frequency (868MHz/915MHz/923MHz) ISM bands. It comes with the I-Nucleo-LRWAN1 node expansion board designed by USI, which combines an STM32L0-powered module with ST’s sensor devices including the LSM303AGR MEMS e-compass (accelerometer/magnetometer), LPS22HB pressure sensor, and ST HTS221 temperature and humidity sensor.

The P-NUCLEO-LRWAN3 pack for low-frequency (433/470MHz) ISM regions comes with a node expansion board embedding the STM32L0-powered RisingHF module RHF0M003, together with an ST LSM6DS33D accelerometer, ST LPS22HB pressure sensor, and HTS221 temperature and humidity sensor.

Each pack has a gateway, built with an STM32 Nucleo-144 development board (Nucleo-F746ZG) which contains an STM32F746ZGT6 microcontroller. According to ST, this gateway has an advantage over a commercial version, because users can access device pins to assist development. The gateway acts as a basic packet forwarder to enable data coming from the development node to reach LoRaWAN network servers.

ST has established agreements with LoRaWAN network-server providers LORIOT, Actility, and The Things Network to let users connect gateways to basic network-server capabilities, free of charge. Users can also visualise sensor data and control devices with the myDevices Cayenne for LoRa IoT Builder dashboard.

Nodes are based on the Nucleo-L073RZ Nucleo-64 board that features the STM32L073RZT6 low power microcontroller. A battery socket is provided for mobility. Each pack includes a LoRa node expansion board, which contains a low-power STM32-powered module running an AT-command stack. There is also a selection of motion and environmental sensors provided on-board.

Both development packs are available now. ST’s ecosystem includes LoRaWAN protocol stacks, free integrated development environments (IDEs) such as Keil MDK-ARM and software toolsets, including the STM32CubeMX MCU initialiser and configurator.

http://www.st.com/stm32-lrwan

 

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GaN-based FET supports lidar systems

Efficient Power Conversion (EPC)’s campaign to introduce enhanced-mode gallium-nitride on silicon (eGaN) FETS as replacements for power MOSFETs continues with the announcement that its EPC2216 GaN transistor has been qualified to AEC Q101 for automotive use.

The 15V EPC2216 is designed for lidar applications in self-driving cars and other time-of-flight (ToF) applications including facial recognition, warehouse automation, drones and mapping.

It is a 26 mOhm eGaN FET with a 28A pulsed current rating. It is used for firing the lasers in lidar systems to improve positioning accuracy. The FET can be triggered to create high-current with extremely short pulse widths. According to EPC, the short pulse width leads to higher resolution. Its 1.02mm2 footprint is small and inexpensive, suitable for an array of ToF applications from automotive to industrial, healthcare to smart advertising, gaming and security, advises EPC.

The AEC Q101 testing involves rigorous environmental and bias-stress testing, including humidity testing with bias (H3TRB), high temperature reverse bias (HTRB), high temperature gate bias (HTGB) and temperature cycling (TC).

The WLCS package passed the same test standards created for conventional packaged parts, demonstrating that the chip-scale packaging does not compromise ruggedness or reliability, according to EPC.

The eGaN devices are produced in facilities certified to the Automotive Quality Management System Standard IATF 16949.

The automotive-qualified FET joins an expanding family of EPC transistors and ICs designed to enable autonomous driving, improve resolution and reduce cost in ToF applications, commented CEO, Alex Liddow.

The EPC2216 eGaN FET is available for immediate delivery from Digi-Key.

http://www.epc-co.com

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Meter-level positioning technology enhances GNSS, claims u-blox

For automotive and high-end telematics, u-blox has introduced the NEO-M9N module, based on its M9 global positioning technology. The meter-level M9 global positioning technology platform is designed for demanding automotive, telematics, and unmanned aerial vehicle (UAV) applications.

The GNSS chip, UBX-M9140 and the NEO-M9N can receive signals from up to four GNSS constellations (GPS, Glonass, Beidou, and Galileo) concurrently, for high positional accuracy even in difficult conditions, such as deep urban canyons, says u-blox. M9 offers a position update rate of up to 25Hz, enabling dynamic applications, like UAVs, to receive position information with low latency.

The M9 technology has a special filtering against RF interference and jamming, spoofing detection and advanced detection algorithms that enable it to report fraudulent attacks quickly. A surface acoustic wave (SAW) filter, with a low noise amplifier (LNA) in the RF path, is integrated in the NEO-M9N module. According to u-blox, this guarantees normal operations even under strong RF interferences, for example when a cellular modem is co-located with the NEO-M9N.

u-blox advises that users can design a single PCB and migrate to a different positioning technology, such as dead reckoning augmenting GNSS technology, with very little change to the board design.

In support of the M9, the company offers the Explorer Kit M9 (XPLR-M9) development board. The miniature device is supplied with u-start software, which includes a number of pre-set scenarios to enable users to explore the performance of the new device.

The M9 technology complies with the ISO/TS 16949, ISO 16750, AEC-Q100 standards. The NEO-M9N is the first module based on the M9 platform. It is sampling now. The UBX-M9140 high performance chip and the Explorer Kit are available now.

u‑blox provides positioning and wireless communication technologies for the automotive, industrial, and consumer markets for people, vehicles, and machines to determine their precise position and communicate wirelessly over cellular and short range networks. The company’s portfolio of chips, modules, and a growing ecosystem of product supporting data services are designed to help customers develop solutions for the IoT.

http://www.ublox.com

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