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Lattice supports embedded vision with solutions stack

Mon, Mar 02, 2020

To accelerate low power, embedded vision development such as image sensor bridging, aggregation, splitting and processing, Lattice Semiconductor has introduced the mVision solutions stack with support for the Nexus platform and CrossLink-NX FPGAs.

It includes the modular hardware development boards, design software, embedded vision IP portfolio, reference designs and demos needed to implement sensor bridging, sensor aggregation, and image processing applications found in machine vision, advanced driver assistance systems (ADAS), drones and augmented reality / virtual reality (AR/VR) for the industrial, automotive, consumer, smart home and medical markets.

Initially used in manufacturing, today embedded vision is used in automated assembly and inventory, explained Jeff Bier, founder of the Edge AI and Vision Alliance. “Many of these applications demand small, low cost, low power solutions,” he continued, adding “Solutions stacks, such as sensAI and mVision . . . help developers more easily integrate smart vision capabilities into their product designs.”

Key features of the Lattice mVision solutions stack are the Video Interface Platform (VIP) modular hardware development boards with support for a variety of video and I/O interfaces commonly used in embedded vision applications (including MIPI, LVDS, DisplayPort, HDMI, USB, and others). The VIP development boards currently support Lattice FPGAs including CrossLink, ECP5 and CrossLink-NX, based on the Lattice Nexus platform.

There is also a comprehensive IP Library. The Lattice mVision solutions stack includes ready-to-implement IP cores for interfacing to MIPI and LVDS image sensors, image signal processing pipelines, common connectivity standards like USB and Gigabit Ethernet, and display standards such as HDMI, DisplayPort, and GigE Vision.

The stack supports both of Lattice’s FPGA design tools, Lattice Diamond and Lattice Radiant. The tools automate many common design tasks.

There are also complete reference designs for common embedded vision applications including sensor bridging, sensor aggregation and image processing.

Customers can also access a network of design service partners, developed by Lattice, for support ranging from developing individual functional design blocks to complete turn-key solutions.

http://www.latticesemi.com/mvision

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Microcontroller with built-in PUF tech offers multiple layers of security

Fri, Feb 28, 2020

The MAX32520 ChipDNATM secure Arm Cortex-M4 microcontroller from Maxim Integrated Products is a secure microcontroller with built-in physically unclonable function (PUF) technology for financial- and government-grade security. The technology allows for multiple layers of protection to provide advanced key-protection technology for use in Internet of Things (IoT), health care, industrial and computing systems.

The MAX32520 with ChipDNA offers multiple layers of protection through its PUF technology, a key-protection technology for safeguarding secrets used in cryptographic operations. It uses a tamper-proof PUF key for flash encryption, secure boot for root-of-trust and serial flash emulation. Additionally, the physical security inherent in the PUF key eliminates the need for a battery to actively destroy secret-key materials when under attack. Until now, the most-sensitive applications have always required a battery to provide this highest level of secret-key protection.

The secret keys generated by the ChipDNA PUF circuitry are resistant to physical attacks, ensuring the keys that protect data and systems are out of the reach of attackers. Flash-encryption using PUF protects sensitive information with encryption keys that can withstand advanced physical inspection and prying, as well as providing robust IP security. The DeepCover secure microcontroller can protect all user data, as it is equipped with SP 800-90A and SP 800-90B compliant TRNG and hardware accelerators for AES-256, ECDSA P-521 and SHA-512.

Delivering up to 2MB of secure flash memory means advanced applications can run in a highly secure environment. Built on an advanced process node, this secure microcontroller provides advanced security features, a 120 MHz ARM Cortex M4 processor and plenty of memory. It eliminates several components like a battery, a tamper monitor IC and system management micros that are often found in security-sensitive applications.

“Enabling developers to incorporate PUF-encrypted flash and secure boot loading without system redesign or in-house code development will help them reduce time-to-market dramatically,” said Tanner Johnson, senior analyst, IoT cybersecurity at Omdia.

Kris Ardis, executive director, micros, security and software business unit at Maxim Integrated said: “The threats to IoT systems are getting more advanced all the time, and tools to attack systems move from the realm of academia to the realm of open source every day. MAX32520 with ChipDNA is a step forward.”

http://www.maximintegrated.com

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40A output model boosts Puls DIN-Rail power supply series

Thu, Feb 27, 2020

Extending Puls Power’s remote-controlled DIN-Rail power supply family is the 40A output model.

The remote-control feature comes into its own in smart buildings and industrial systems where centralised control of multiple system components is required. It allows system administrators and building automation controllers to switch power supplies on or off via the use of an external signal switch or transistor gate.

The new 24VDC, 40A output QS40.241 DIN-rail power supply joins the CP20.241-V1 24VDC, 20A model and both belong to the Puls Dimension series, which provides solutions for designers and systems integrators requiring powerful and space-saving DIN rail power supplies.

The new QS40.241 DIN-rail power supply has a compact footprint by using the latest synchronous rectification technology, a bridgeless PFC circuit and a number of other proprietary design details. Large power reserves of 150 per cent and built-in large sized output capacitors support the starting of heavy loads such as DC motors or capacitive loads. In many cases this allows the use of a unit from a lower wattage class.

High immunity to transients and power surges, as well as low electromagnetic emissions aid installation in a wide range of environments. The integrated input fuse as well as the near zero input inrush current also help simplify installation and usage.

Power supply status is indicated by a DC-OK relay, a green DC-OK LED and a red overload LED. A large package of international safety approvals makes the QS40.241 suitable for a range of applications.

Key features of the QS40.241 DIN-rail power supply include remote control of output voltage, 100-240VAC wide-range input voltage, width of 125mm and weight of 1.9kg.

The power supply offers 94.6 per cent full load and, says Puls, “excellent partial load efficiencies”. There is 50 per cent BonusPower (1440W for up to 4s), 110A high peak current for 10ms for easy fuse tripping, safe HiccupPlus overload mode, active power factor correction and negligible low input inrush current surge.

Other features listed are full power between -25 degrees C and +60 degrees C, a current sharing feature for parallel use, internal data logging for troubleshooting, DC-OK relay contact and shut-down input.

It is ATEX and IECEx approved and comes with a three-year warranty. Accessories available include a wall mount bracket, buffer unit and a redundancy module

Typical applications for these power supplies include, smart buildings and building automation, industrial and process control, panel-building, test and measurement, instrumentation and communications systems.

Versions are available approved for railway systems and ruggedised for harsh environments.

http://www.pulspower.com

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MSC HCC-CFLS client module series is first in Avnet’s new line-up

Thu, Feb 27, 2020

Based on the new PICMG COM-HPC Client standard, Avnet Integrated has launched the first of the company’s Computer-On-Module for High Performance Computing (COM-HPC) product line, the MSC HCC-CFLS client module series.

The MSC HCC-CFLS client module family suits a range of applications, including human machine interface systems, complex industrial controls, monitoring systems with numerous sensors, artificial intelligence solutions, industrial Internet of Things applications, medical devices and gaming systems.

The client interface offers a large selection of graphic interfaces, 1G and 10G Ethernet ports, PCI Express interfaces and USB ports. In addition, Avnet Integrated provides the appropriate COM-HPC client carrier board MSC HC-MB-EV, including comprehensive design support, for a first evaluation of the high-performance computing modules in the new standard for rapid prototyping and for fast application development.

The MSC HCC-CFLS COM-HPC client module family is based on the 9th generation socketed Intel Core S processor family, which the company says ensures high scalability – from cost-effective, entry-level variants to high-end processors with up to eight cores and 16 threads.

The new COM-HPC Computer-On-Module standard was optimised by PICMG for powerful high-performance computing applications that focus on high computing and graphics performance with high data throughput. In contrast to the server form factors, the client variants also offer a selection of graphics interfaces.

Available in a range of module variants, the MSC HCC-CFLS COM-HPC client product family ranges from Intel Celeron processors to high-performance Intel Xeon and Intel Core i7 processors with thermal design power from 35 W to 80 W.

For data-intensive applications, the modules can be equipped with up to 64 GB DDR4-2666 SDRAM with optional error checking and correction.

The modules’ graphics support graphics acceleration and hardware-based video encoding/decoding. Up to three independent display units, with a maximum resolution of 4k x 2k, can be connected via three DDI interfaces and one eDP interface.

The PCI Express Graphics x16 port based on PCIe Gen3 enables the integration of external graphics and artificial intelligence accelerators. In addition, further interfaces including 16 PCI Express x1 lanes, USB 3 Gen1 and 2, SATA 3.0, 1G and 10G Ethernet as well as GPIOs are available on the COM-HPC boards.

The MSC HCC-CFLS module family corresponds to the COM-HPC size C form factor and has dimensions of 160 x 120 mm. The module height is determined by the cooling solutions, which depend on the thermal requirements.

http://www.avnet.com

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Lattice supports embedded vision with solutions stack

Microcontroller with built-in PUF tech offers multiple layers of security

40A output model boosts Puls DIN-Rail power supply series

MSC HCC-CFLS client module series is first in Avnet’s new line-up

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