Development tool focuses on automotive gateway prototyping

For prototyping automotive smart gateway and domain controller applications, STMicroelectronics offers the Smart Gateway Platform.

As automotive architectures have evolved to include high throughput in-vehicle networking and high data-rate connectivity to the cloud, the demand for high-performance smart gateway and domain controller electronic control units (ECUs) has also increased, observed ST.

Its modular Smart Gateway Platform (SGP) is built on gigabit Ethernet (GbE) communication between the secure ASIL-B Telemaco3P microprocessor and the ASIL-D SPC58/Chorus microcontroller. This delivers powerful processing capability to handle firewall functionalities, predictive maintenance, over-the-air (OTA) upgrades and high data-rate communication among different ECUs and to the cloud.

The Chorus microcontroller provides real-time, low power, and secure in-vehicle connectivity through its multiple CAN-FD interfaces, explains ST. The Telemaco3P microprocessor delivers dual Arm Cortex A7 processing power with Posix OS support to extend gateway computational capabilities and an embedded Security Module handles OTA updates, firewall and predictive-maintenance functions.

The SGP reference design has in-vehicle network interfaces including multiple Ethernet and CAN ports as well as support for LIN and FlexRay connections. A comprehensive starter package includes hardware design files, hardware/software documentation, software utilities (drivers and flashers) and sample applications.

The SGP also integrates expansion connections to Wi-Fi and LTE modules for full prototyping of use cases requiring cloud-connectivity simulation. The modular architecture provides a framework for scalability in performance, networking, and software, adds ST.

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Please visit http://www.st.com/smart-gateway-platform for further information.

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Optiga Connect 5G authenticates mobile consumer devices

Infineon has extended its embedded SIM (eSIM) portfolio, adding the Optiga Connect eSIM for mobile consumer devices. It supports all GSMA standards from 3G to 5G and securely authenticates the device to the chosen subscribed carrier network of choice. It has a small imprint, making it suitable for smartphones, tablets and wearable devices (smart watches or fitness trackers).

Based on Infineon’s SLC37 security chip, the new Optiga Connect meets the GSMA’s security requirements and is tested according to Common Criteria CC EAL4+ high. The SLC37 secures sensitive keys and data against fraudulent use. The Optiga Connect eSIM complies with the latest 5G specifications from the GSMA (SIMAlliance Profile Interoperability 2.3 Spec) and the 3GPP. It supports the profiles of major mobile network providers with Remote SIM Provisioning capabilities and offers up to 1.2Mbyte of free user memory for network operator profiles, data and additional applications. The package measures just 2.9 x 2.5 x 0.4mm for the restricted PCB space of many new consumer applications.

ABI Research predicts that global shipments of eSIM enabled smartphones will reach over 225 million in 2020 and it expects a minimum of 500 million eSIM-capable smartphones to ship gloabally in 2024.

The Optiga Connect eSIM consumer chip be available from March 2020.

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STM32L4+ microcontrollers bring Cortex-M4 performance to smart devices

Two microcontrollers from STMicroelectronics, the STM32L4P5 and STM32L4Q5 microcontrollers bring the performance of the Arm Cortex-M4 core to cost-sensitive and power-conscious smart connected devices, says the company. Target applications include utility meters, industrial and medical sensors, fitness trackers, and smart home products.

The STM32L4+ microcontrollers have memory density down to 512kbyte flash and 320kbyte SRAM. They are available in a choice of package options: 10 x 10mm, 64-pin and 7.0 x 7.0mm, 48-pin versions designed to meet applications limited by size constraints such as wearable form factors.

They have independent power connections for circuitry such as USB and analogue peripherals, independent clock domains, and octal and quad serial peripheral interfaces (SPIs) for external memory expansion. They also feature a 5Msample/s smart ADC that can operate at full speed to minimise acquisition time, or at reduced speed with lower current.

The STM32L4+ microcontrollers exploit ST’s low-power microcontroller technologies and feature seven main low-power modes, enabling designers to creatively manage power consumption and wake-up times to minimise energy demand. The microcontrollers also support FlexPowerControl, which ensures energy-efficient handling of processing loads, as well as batch acquisition mode for energy-efficient data capture while the CPU is stopped.

To preserve system reliability and safety in industrial and medical applications, the STM32L4+ microcontrollers have flash error-correcting code (ECC) support and hardware parity checking for SRAM.

Cyber-protection features include a true random number generator and IP protection through limited access to code stored in internal memory. STM32L4Q5 devices feature additional cryptographic accelerators that support AES, RSA, DH and ECC acceleration.

The STM32 development ecosystem now includes the Nucleo-L4P5ZG Nucleo-144 board and STM32L4P5G-DK Discovery kit, each containing an STM32L4P5 microcontroller.

In the STM32Cube ecosystem, the STM32L4P5 and STM32L4Q5 are supported by the STM32CubeL4 microcontroller package, which contains hardware abstraction layer and low-layer (HAL/LL) peripheral drivers, middleware components and examples projects, and by the STM32CubeMX initialisation-code generator and configurator, which has a power consumption calculator.

ST reports EEMBC benchmark scores of 409 CoreMark and 285 ULPMark-CP for performance and energy efficiency.

Samples are available immediately and full production is ramping up, says ST.

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Renesas Electronics adds RL78/G1H to Wi-SUN FAN-compliant portfolio

Renesas Electronics’ RL78/G1H-based sub-GHz wireless solution has been certified under the Wireless Smart Ubiquitous Network for Field Area Network profile (Wi-SUN FAN) communication standards.

The Wi-SUN Alliance is an international industry group that specifies wireless communication standards used within the Sub-GHz band. 

Tessera Technology TK-RLG1H+SB2 evaluation board incorporates the Renesas 16-bit RL78/G1H microcontroller with integrated wireless functionality and a Wi-SUN FAN communication control software stack. The combination enables customers to develop Wi-SUN FAN-compliant devices quickly and easily, says Renesas, reducing the time required for certification in the development process by approximately one year.

“Wireless frequencies in the sub-GHz band are relatively unaffected by obstacles such as  walls and buildings, which makes it possible to transmit data over longer distances in urban settings, and Wi-SUN FAN is gaining popularity as a wide-area wireless network standard with mesh network support,” said Toru Moriya, vice president, Emerging Market business division at Renesas. “Our certified RL78-based wireless solution will alleviate the development burden associated with sensor network applications such as logistics and infrastructure management, and accelerate the widespread adoption of Wi-SUN FAN to realize smart cities and smart grids,” he added.

In addition to the certified RL78 wireless solution, Renesas offers a dual-chip solution combining the 32-bit RX651 microcontroller and the RAA604S00 wireless communications IC. This solution was Wi-SUN FAN certified in 2019.

Customers can develop gateway applications, such as border routers between FAN and wide area network (WAN) or terminal applications, such as routers, using products from Renesas’ Wi-SUN FAN portfolio, according to required specifications, such as microcontroller processing performance, memory capacity, or power efficiency.

Intended end applications are smart meter power usage visualisation, smart illumination, sensor management in factories or office buildings, and equipment operation monitoring.

A communication control software for the Wi-SUN certified RL78/G1H solution will be available by September 2020.

https://www.renesas.com

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