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Arm Cortex-M7 core performance, high memory density and power saving operation are combined in the STM32H7 microcontrollers, released by STMicroelectronics.

The STM32H7A3, STM32H7B3 and STM32H7B0 Value Line microcontrollers have low power consumption and start from economical 64-pin QFP packages and have levels of integration and real-time performance to handle functionalities like rich user interfaces, natural language interaction, RF mesh networking, and artificial intelligence (AI) for next-generation smart devices.

Support for embedded graphics includes up to 1.4Mbyte RAM that enables cost-effective support of advanced user interfaces on display resolutions up to HVGA with 24-bit colour without external SRAM, says STMicroelectronics.

Energy efficiency and increased DSP capability efficiently handle audio front-end and output generation for voice and audio processing, adds the company.

For applications that require advanced connectivity, the CPU performance and flash density handle evolving RF-communication protocols. The 4.57 x 4.37mm wafer-level chip-scale package (WLCSP) option is suitable for integration in wireless modules.

The STM32H7 microcontrollers also deliver the power efficiency needed for machine learning, STMicroelectronics says, and the performance to support future generations of neural networks.

For security-conscious IoT applications, cyber-protection includes secure boot / Root of Trust and hardware cryptographic/hash accelerators. On-the-fly decryption (OTFDEC) extends protection to code stored in external serial memories by allowing encrypted content to be decrypted in real-time.

Embedded secure-loading services allow users to order standard products anywhere in the world and deliver encrypted firmware to the programming partner. Once the product is authenticated and securely programmed, the Root of Trust mechanism supports all secure firmware services including field update.

Dual power domains allow flexible power management while voltage scaling enables optimum efficiency in run and stop modes. An on-chip switch mode power supply (SMPS) helps reduce the bill of materials (Bo) and can power the MCU circuitry and external components. There is a 32microA Stop mode with SMPS active and full RAM retention. Standby current is just four microA.

The STM32H7 microcontrollers have up to two octal SPI external memory interfaces, an RGB interface for up to XGA displays, ST’s Chrom-ART Accelerator to offload the CPU from 2D graphics operations, the Chrom-GRC to optimise support for non-rectangular displays, and hardware JPEG codecs.

The STM32 development ecosystem includes the STM32H7B3I-EVAL dedicated evaluation board, STM32H7B3I-DK discovery kit, and NUCLEO-H7A3ZI-Q Nucleo-144 board. The STM32CubeH7 software package includes application and demonstration examples with source code available, including graphical solutions based on TouchGFX technologies. There are also toolkits for motor control, AI application development, and the STM32Trust cyber-security ecosystem.

Samples of the STM32H7A3 and STM32H7B3, are available now. Full production for most derivatives has begun and the full portfolio will be available by June 2020.

http://www.st.com

Offering low standby current for infotainment and telematics boxes, the PT7C4363BQ and PT7C4563BQ are two real-time clocks from Diodes that are automotive-compliant.

The wide temperature range makes them suitable for automotive applications, including infotainment systems, dashboard displays, and telematics boxes, says Diodes.

The PT7C4363BQ and PT7C4563BQ are qualified to AEC-Q100 Grade 1, covering the temperature range of -40 to +125 degrees C. The PT7C4563BQ has an adjustable timer. They are production part approval process (PPAP) -capable and are manufactured in IATF16949-certified facilities. The operating voltage range is 1.3 to 5.5V and low-backup current is just 400nA at 3.0V.

The devices interface directly to an external 32.768kHz crystal with an equivalent series resistance of up to 100kOhm. In addition to a real-time clock, they can also deliver a square-wave output with a selectable frequency of 1.0, 32, 1024 or 32,768Hz. Accurate time and date data is accessed through the I²C interface. Adjustments for the number of days in the month are automatic, and an alarm function is also included.

The PT7C4363BQ and PT7C4563BQ are available in an SOIC-8 package.

Diodes is a manufacturer and supplier of application specific standard products within the broad discrete, logic, analogue and mixed-signal semiconductor markets. Diodes serves the consumer electronics, computing, communications, industrial, and automotive markets. Its products include diodes, rectifiers, transistors, MOSFETs, protection devices, function-specific arrays, single gate logic, amplifiers and comparators, Hall-effect and temperature sensors, power management devices, including LED drivers, AC/DC converters and controllers, DC/DC switching and linear voltage regulators and voltage references along with special function devices, such as USB power switches, load switches, voltage supervisors, and motor controllers. Diodes also has timing, connectivity, switching, and signal integrity solutions for high-speed signals.

The company’s headquarters and Americas’ sales office are located in Plano, Texas and Milpitas, California, USA. Design, marketing, and engineering centres are located in California, Taiwan, UK and Germany. Wafer fabrication facilities are located in Manchester and Greenock, UK, and Shanghai, China. Diodes has assembly and test facilities located in Shanghai, Jinan, Chengdu, and Yangzhou, China, as well as in Hong Kong, Neuhaus, and Taipei. Additional engineering, sales, warehouse, and logistics offices are located in Taipei, Hong Kong, UK, China, South Korea, Germany and Japan.

http://www.diodes.com

Kioxia Europe has developed its fifth-generation BiCS FLASH, three-dimensional (3D) flash memory with a 112-layer vertically stacked structure. Samples of the 512Gbit (64Gbyte) capacity devices with three-bit-per-cell (triple-level cell, TLC) technology, for specific applications will begin shipping Q1 2020.

The memory addresses a variety of applications, including traditional mobile devices, consumer and enterprise SSDs as well as emerging applications enabled by the new 5G networks, artificial intelligence and autonomous vehicles.

The process technology will be applied to larger capacity devices, such as 1Tbit (128Gbytes) TLC and 1.33Tbit four-bit-per-cell (quadruple-level cell, QLC) devices in due course, confirms Kioxia.

The company’s 112-layer stacking process technology combines with its circuit and manufacturing process technology to increase cell array density by approximately 20 per cent over the 96-layer stacking process. The technology reduces the cost per bit and increases the manufacturability of memory capacity per silicon wafer, adds Kioxia. It also improves interface speed by 50 per cent and offers higher programming performance and shorter read latency.

Fifth-generation BiCS FLASH was developed jointly with technology and manufacturing partner Western Digital Corporation. It will be manufactured at Kioxia’s Yokkaichi plant and the newly built Kitakami plant.

Kioxia Europe (formerly Toshiba Memory Europe) is the European subsidiary of Kioxia, a supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH 3D technology, Kioxia says it continues to pioneer memory solutions and services. The company’s 3D flash memory technology, BiCS FLASH, is shaping the future of storage in high-density applications, says Kioxia, including advanced smartphones, PCs, SSDs, automotive and data centres.

http://www.kioxia.com