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Kioxia delivers PCIe 4.0 solid state drives

Tue, Feb 25, 2020

The line-up of PCIe 4.0 NVMeTM enterprise and data centre solid state drives (SSDs) from Kioxia Europe GmbH (formerly Toshiba Memory Europe GmbH) is now shipping to customers.

PCI Express 4.0 was designed to enable doubling the performance of client, server and storage systems, pushing speeds up to 16.0GT/s (gigatransfers per second throughput per lane), driving new performance levels for cloud and enterprise applications.

Dual-ported for high-availability, Kioxia’s CM6 Series of PCIe 4.0, Gen4 4lane (or Dual-port, 2lane), and NVMe 1.4 Enterprise SSDs are said to deliver best-in-class sequential and random read/write performance of up to 6.9 GB/s and up to 1.4M IOPS. These represent improvements of up to two times over its PCIe 3.0 predecessors and are said to be 12 times faster than typical SATA drives.

Designed for enterprise applications and use cases, including high-performance computing, artificial intelligence, caching layer, financial trading and data analytics, the CM6 Series is available in capacities of up to 30.72TB.

Kioxia’s CD6 Series of PCIe 4.0, Gen4 4lane and NVMe 1.4 data centre SSDs are single-ported for servers, and targeted to hyperscale data centre and general purpose applications, such as database, cloud/container environments, web servers and media streaming. The CD6 Series will be available in capacities of up to 15.36TB, with up to 6.2GB/s throughput and 1.0 M IOPS random access performance.

Both, the CM6 and CD6 Series have a lineup of 1 DWPD (Drive Write per Day) and 3 DWPD[6] devices, and include a range of security and encryption options. The new SSDs have successfully passed PCI-SIG Workshop compliance and are on the UNH-IOL Integrator’s list for NVMe 1.4 device compatibility.

“As established leader in developing PCIe 4.0 NVMe Express SSDs, Kioxia continues to push the limits of flash storage performance”, said Paul Rowan, vice-president SSD marketing and engineering at Kioxia Europe GmbH. “We were the first company to publicly demonstrate PCIe 4.0 SSDs and are now the first to commence shipment of these next-generation drives.”

https://business.kioxia.com/en-jp/ssd/data-center-ssd.html

https://business.kioxia.com/en-jp/ssd/enterprise-ssd.html

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iMotion IMC300 adds Arm MCU for variable speed drive flexibility

Mon, Feb 24, 2020

Infineon Technologies AG has released the IMC300 motor controller series combining the iMotion Motion Control Engine (MCE) with an additional microcontroller based on the Arm Cortex-M0 core.

IMC300 complements the IMC100 series and is aimed at variable speed drives that require high application flexibility. Both families, IMC100 and IMC300, share the same implementation of MCE 2.0 providing ready-to-use motor and optional PFC control.

Applying the MCE for controlling the motor, customers can focus on their system application that runs fully independently on the embedded Arm microcontroller.

Infineon’s field-proven MCE 2.0 implements efficient field oriented control of permanent magnet synchronous motors. The MCE integrates all required hardware and software building blocks as well as all necessary protection features resulting in a reduced bill of material. It undergoes continuous improvements with typically two releases per year.

The autonomous MCU offers a flexible peripheral set and can serve a multitude of purposes such as system functions, specific communication or drive monitoring. IMC300 devices are pre-certified for applications requiring functional safety according to UL/IEC 60730 (‘Class B’).

IMC300 derivatives are offered for motor drives with and without PFC control. Devices in LQFP-64 packages are in mass production, and LQFP-48 types will be released in the second quarter 2020.

Rapid prototyping of a drive inverter is enabled via two new control boards for the iMotion modular application design kit (MADK). MADK is a modular and flexible development platform providing a range of control and power board options for motor drive applications up to 1kW.

Infineon will showcase the new IMC300 series at Embedded World in Nuremberg, February 25 to 27, booth 225, hall 3A.

Highlights include solutions for automated driving and in-vehicle health monitoring, wireless charging, drones as well as automotive and industrial motor control.

http://www.infineon.com

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Secure SoC devices aid IoT in mesh networks

Mon, Feb 24, 2020

New to market is a family of secure, ultra-low-power Zigbee system-on-chip (SoC) devices designed for eco-friendly Internet of Things (IoT) products deployed in mesh networks. The EFR32MG22 (MG22) series is based on Silicon Labs’ Wireless Gecko Series 2 platform and suits Zigbee devices powered by coin cell batteries or energy-harvesting sources. Target applications include smart home sensors, lighting controls, and building and industrial automation.

Zigbee Green Power technology can help address environmental concerns by reducing residential, commercial and industrial energy footprints. Using the same 802.15.4 PHY and MAC of the Zigbee 3.0 protocol, Zigbee Green Power helps reduces power consumption by decreasing the amount of data required for wireless transmission.

Zigbee Green Power was designed to be a highly efficient protocol enabling IoT devices, whether powered by batteries or by “battery-less” energy harvesting options. Silicon Labs has optimised the MG22 SoCs to provide a best-in-class connectivity solution for these power-sensitive wireless applications.

“As the leading Zigbee provider, Silicon Labs is uniquely positioned to lead the way in Zigbee Green Power mesh networking solutions,” said Matt Johnson, senior vice-president and general manager of IoT products at Silicon Labs. “Our new MG22 SoC solution offers an industry-leading combination of energy efficiency, security capabilities, wireless performance, and software tools and stacks to meet the growing market demand for eco-friendly, ultra-low-power IoT products.”

The MG22 SoCs incorporate a high-performance, low-power 76.8 MHz Arm Cortex-M33 core with TrustZone. The SoCs’ combination of ultra-low transmit and receive power (8.2 mA TX at +6 dBm, 3.9 mA RX), 1.4-microA deep-sleep mode power and low-power peripherals helps provide exceptional energy efficiency.

Silicon Labs delivers a suite of security features implemented in Series 2 products including the new MG22 SoCs.

The EFR32MG22 SoCs are planned to start shipping in March in a choice of 5 mm x 5 mm QFN40, 4 mm x 4 mm QFN32 and 0.3 mm x 4 mm x 4 mm TQFN32 packages. The EFR32MG22 SoC starter kit is also scheduled to be available in March, with end device kit pricing starting at $99.

http://silabs.com/mg22

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Modem-RF system enhances 5G performance says Qualcomm

Fri, Feb 21, 2020

Boasting many first, the Snapdragon X60 5G Modem-RF system has been introduced by Qualcomm. It is claimed to be the first with a 5nm 5G baseband and first to aggregate 5G mmWave and sub-6 bands, to provide “unprecedented spectrum flexibility”.

This is the third-generation 5G modem-to-antenna solution. The Snapdragon X60 also supports spectrum aggregation across all key 5G bands and combinations, including mmWave and sub-6 using frequency division duplex (FDD) and time division duplex (TDD). The 5G modem-to-antenna device is designed to enhance the performance and capacity for operators worldwide while increasing average 5G speeds in mobile devices, says Qualcomm. Snapdragon X60 is engineered to accelerate network transition to 5G standalone mode through support for any key spectrum band, mode or combination, along with 5G voice-over-new radio (VoNR) capabilities.

The Snapdragon X60 also features the new Qualcomm QTM535 mmWave antenna module. This is the company’s third-generation 5G mmWave module for mobile, and features a more compact design than the previous generation for thinner, sleeker smartphones.

Mobile operators and OEMs are introducing 5G services and mobile devices globally, prompting Cristiano Amon, president of Qualcomm, to observe: “As 5G standalone networks are introduced in 2020, our third-generation 5G modem-RF platform brings extensive spectrum aggregation capabilities and options to fuel the rapid expansion of 5G rollouts while enhancing coverage, power efficiency and performance for mobile devices”.

Snapdragon X60 allows for fibre-like internet speeds and low latency, delivered wirelessly over 5G, which will help unlock the next generation of connected applications and experiences, from highly responsive multi-player gaming and immersive 360-degree video to connected cloud computing with power efficiency sufficient for all-day battery life in some cases, depending on the device and useage.

The Snapdragon X60’s support for mmWave-sub6 aggregation allows operators to maximise spectrum resources to combine capacity and coverage. Additionally, the Snapdragon X60 contains the world’s first 5G FDD-TDD sub-6 carrier aggregation solution. It also has dynamic spectrum sharing (DSS), allowing operators a wide range of deployment options, including the ability to repurpose LTE spectrum for 5G. This allows operators to effectively deliver higher average network speeds and accelerate 5G expansion, adds Qualcomm.

The 5G modem-to-antenna device can deliver up to 7.5Gbits per second download speeds and 3Gbits per second upload speeds. The aggregation of sub-6 GHz spectrum in standalone mode allows peak data rates to double in 5G standalone mode compared to those with no carrier aggregation support, Qualcomm reports. VoNR support in Snapdragon X60 will be an important step in the global mobile industry’s transition from non-standalone to standalone mode, because it will allow mobile operators to provide high-quality voice services on 5G NR.

Qualcomm Technologies is scheduled to ship samples of Snapdragon X60 and QTM535 in the first quarter of 2020, with commercial premium smartphones using the new Modem-RF System expected in early 2021.

http://www.qualcomm.com

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Kioxia delivers PCIe 4.0 solid state drives

iMotion IMC300 adds Arm MCU for variable speed drive flexibility

Secure SoC devices aid IoT in mesh networks

Modem-RF system enhances 5G performance says Qualcomm

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