Industrial camera is powered by deep learning for factory inspection

Believed to be the first smart camera powered by deep learning technology, the In-Sight D900 camera enables a vision system for inline factory inspections. Deep learning, a type of AI is examples-based in that it leverages neural networks which use labelled images to understand the nature of an object.  This examples-based approach to solving inspection challenges can be continually improved by feeding the existing algorithm with more example image data. This new data then enhances the system leading to more accurate results.

Manufacturers still rely on human inspectors throughout the production process because traditional machine vision systems cannot handle the complexity or variability within certain tasks. Humans however can be prone to inconsistent results, or can tire over the course of an eight hour shift and some areas of production are uninspected for one reason or another, says Cognex.

A vision system with integrated AI, for example, is able to combine the judgement of a human inspector with the robustness and consistency of an automated solution for inspection or quality control, explains Cognex of its smart camera, In-Sight D900.

The compact design embeds Cognex´s  deep learning software, known as In-Sight ViDi, inside an industrial-grade smart camera.  The In-Sight D900 industry-grade smart camera can be installed and deployed on the line without the need for a PC. The modular, IP67-rated vision system includes field-changeable lighting, lenses, filters and covers that can be customised to match the individual application requirements.

There is a range of options for adaption to individual applications. Firstly, there is the high dynamic range (HDR+) imaging which creates evenly exposed images, and there is an LED indicator which allows pass/fail monitoring at a distance. Inspection results can be stored locally on an SD card. The embedded inference engine was added to specifically run deep learning applications.

The In-Sight D900 works with the familiar and easy-to-use spreadsheet user interface which simplifies application development and factory integration. Application engineers have access to the full suite of traditional machine vision tools, like PatMax, edge finders, and measurement tools. There are three deep learning tools which all aim at specific and widespread applications: ViDi Read, ViDi Check and ViDi Detect. These new deep learning-based inspection tools help factory automation customers easily solve applications that are too time-consuming or complex to deploy with traditional, rule-based machine vision tools, explains Cognex.

For all three application tools, users can take advantage of the intuitive In-Sight spreadsheet interface allowing for a fast set up of deep learning applications without programming. The spreadsheet simplifies application development and streamlines factory integration with a full I/O and communications function set. It also allows the combination of traditional Cognex rules-based vision tools (like PatMax Redline) and deep learning tools in the same job.

Cognex points out that In-Sight ViDi requires smaller image sets and shorter training and validation periods than other deep learning solutions, for quick and easy set-up, teaching and deployment of applications.

With the In-Sight ViDi Read tool, the user is able to solve challenging OCR applications in minutes. This module deciphers badly deformed, skewed, and poorly etched codes using optical character recognition.

With the In-Sight ViDi Read tool, the user is able to solve challenging optical character recognition (OCR) applications in “next to no time” says Cognex.

The deep learning pre-trained font library ensures immediate use. The user simply defines the region of interest and sets the character size. In situations where new characters are introduced, this tool can be retrained to read application-specific characters that traditional OCR tools are not able to decode, says the company.

For verifying assemblies and part location, the ViDi Check tool allows manufacturers to perform fast and accurate assembly verification. The system is able to detect complex features and objects. It verifies whether parts and kits are assembled correctly based on their location within a user-defined layout. The tool can be trained to create an extensive library of components, which can be located in the image even if they appear at different angles or vary in size.

The ViDi Detect tool analyses complex defect detection tasks. It finds defects and other unwanted variations. It is able to learn from images of good parts in order to identify defective parts. In-Sight ViDi Detect is ideal for finding anomalies on complex parts and surfaces, even in situations where defects can be unpredictable in their appearance.

The In-Sight D900 can be used across a range of industries including automotive, consumer electronics, consumer products, packaging, food and beverage, medical devices, and logistics.

Cognex designs, develops, manufactures and markets products that incorporate sophisticated machine vision technology. Products include 3/4 barcode readers, machine vision sensors and machine vision systems that are used in factories, warehouses, and distribution centres around the world to guide, gauge, inspect, identify, and assure the quality of items during the manufacturing and distribution process.

http://www.cognex.com

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AI computing targets smart transportation and healthcare

The AN110-XNX edge AI computer developed by Aetina is based on the Nvidia Jetson Xavier NX. It is designed for applications in smart transportation, factories, retail, healthcare, AIoT and robotics.

The AN110-XNX combines the Nvidia Jetson Xavier NX and Aetina AN110 carrier board and measures just 87.4 x 68.2 x 52mm (with fan). It supports the MIPI CSI-2 interface for 1one 4k or two FHD cameras to handle intensive AI workloads from ultra-high resolution cameras to more accurate image analysis. It has 384 CUDA cores, 48 Tensor cores and cloud-native capability to deliver up to 21 Terra operations per second (TOPS).

Bundled with the latest Nvidia Jetpack 4.4 software development kit (SDK), the AN110-NX is an energy-efficient module for embedded edge-computing performance capabilities to support AI workloads which may be constrained by size, weight, power budget, or cost.

Aetina offers a full system, AN110-XNX-EN70 with fanless chassis and back up support in the form of board support packages and design to build configuration updates for both standard and customised platforms in their service policy. Aetina is developing Jetson Xavier NX-based edge computing platforms with 5G communications capability and full function browser-based edge device management.

As an Nvidia-preferred partner, Aetina focuses on delivering edge AI computing based on the Jetson platform for embedded applications. Nvidia Jetson is the leading AI-at-the-edge computing platform, with nearly half a million developers, says Aetina. Support for cloud-native technologies is now available across the Nvidia Jetson lineup, for manufacturers of intelligent machines and developers of AI applications to build and deploy software-defined features on embedded and edge devices targeting robotics, smart cities, healthcare and the industrial IoT.

The AN110-XNX is available now.

Aetina was founded in Taiwan in 2012 as a provider of high-performance general purpose graphics processor unit (GPGPU) and edge AI computing based on the Nvidia Jetson platform for embedded applications. We provide industrial components, system integration and services focused on the industrial and AIoT markets.

http://www.aetina.com

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Automotive wafer-level camera module monitors more vehicles

Believed to be the industry’s first automotive-grade, wafer-level camera, the OVM9284 CameraCubeChip module is an automotive-grade, wafer-level camera, developed by OmniVision Technologies. The one Mpixel module is compact, measuring 6.5 x 6.5mm, enabling it to be placed in more places with the cabin as part of the vehicle’s driver monitoring system (DMS), while being hidden from view. It is also claimed to be the lowest power consumption among automotive camera modules—over 50 per cent lower than the nearest competitor. This enables it to run continuously in the tightest of spaces and at the lowest possible temperatures for maximum image quality.

The OVM9284 is built on OmniVision’s OmniPixel 3-GS global-shutter pixel architecture, which is claimed to provide quantum efficiency at the 940nm wavelength for the highest quality driver images in near or total darkness. The integrated OmniVision image sensor has a three micron pixel and a 0.25 inch optical format, along with 1280 x 800 resolution.

“The accelerated market drive for DMS is expected to generate a 43 per cent CAGR between 2019 and 2025, said Pierre Cambou, principal analyst, imaging at Yole Développement. “DMS is probably the next growth story for ADAS cameras as driver distraction is becoming a major issue and has brought regulator attention,” he added.

“Most existing DMS cameras use glass lenses, which are large and difficult to hide from drivers to avoid distraction, and are too expensive for most car models,” said Aaron Chiang, marketing director at OmniVision. The OVM9284 CameraCubeChip module is designed to provide wafer level optics in a small, low power consumption and reflowable form factor.

The OVM9284’s integration of OmniVision’s image sensor, signal processor and wafer-level optics in a single compact package eliminates the complexity of multiple vendors and increases supply reliability while speeding development time, says the company. The CameraCubeChip modules, unlike traditional cameras, are reflowable. This means they can be mounted to a PCB simultaneously with other components using automated surface-mount assembly equipment to reduce assembly costs.

OVM9284 module samples are available now, and mass production is expected in Q4 of 2020.

OmniVision Technologies develops digital imaging and its award-winning CMOS imaging technology is claimed to enable superior image quality in many of today’s consumer and commercial applications, including mobile phones, security and surveillance, automotive, tablets, notebooks, webcams and entertainment devices, medical and AR, VR, drones and robotics imaging systems.

http://www.ovt.com

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Renesas adds to control plane options with I3C bus extension products

I3C multiplexers and I/O expanders from Renesas Electronics deliver 12.5MHz in a small footprint, claims the company.

There are four new I3C Basic bus extension products for control plane designs for data centre and server applications, as well as enterprise, factory automation and communications equipment. The IMX3102 2:1 bus multiplexer, IMX3112 1:2 bus expander, and IXP3114 and IXP3104 1:4 general-purpose I/O expanders support up to 12.5MHz speeds as well as integrated thermal sensor capability.

Engineers can use them when implementing I3C Basic as a system management bus in applications where there may be multiple masters, a large number of endpoint devices and long traces affecting bus complexity and signal integrity. The integrated thermal sensor allows the thermal management to be integrated into the bus design itself and can reduce the number of dedicated thermal sensor endpoints.

According to Renesas, next-gen compute architectures are leading the transition to I3C as the system management bus of choice, as a result of the JEDEC standard’s adoption of I3C Basic for the DDR5 memory sideband. The increase in memory subsystem complexity with distributed power management, telemetry and thermal management at the sub-channel level requires higher sideband bus bandwidth, observes the company.

Demand for advanced thermal control loops, security and component authentication, and more robust fault tolerance and recovery are driving the need for a high bandwidth interface across the entire server control plane. I3C Basic enables system management architectures to provide granular information about the server resource status during boot-up and runtime. This allows system managers to implement effective workload migration and server load balancing to “significantly optimise” server utilisation.

The IMX3102 2:1 bus multiplexer is suitable for designs where there may be two masters controlling a single peripheral or slave devices. The IMX3112 1:2 bus multiplexer supports designs where a single host is controlling two peripheral or slave devices. The general-purpose I/O expanders, IXP3114 (with temperature sensor) and IXP3104 1:4 (without temperature sensor), are designed for a host controller with up to four peripheral or slave devices.

The new I3C products feature integrated temperature sensors. Unexpected motherboard temperature increases can result in costly system failures. Positioning temperature sensors in multiple locations on the motherboard allows engineers to continuously monitor for potential temperature spikes and direct the CPU to take action to prevent a catastrophic event.

Additional features include a two-wire programmable I2C or I3C Basic bus serial interface, a single device load on the host bus and single 1.8V input power supply. The integrated temperature sensor accuracy is 0.5 degrees C with 0.25 degrees C resolution and the industrial operating temperature range is -40 to +125 degrees C.

The devices are supplied in a thermally enhanced, nine-pin PSON-8 package, measuring 2.0 x 3.0mm.

The I3C devices and evaluation boards are sampling now to qualified customers.

http://www.renesas.com

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