Arrow Electronics partners with Exor Embedded for IoT edge SoM

A system on module (SoM) for IoT edge deployment in smart applications has been developed by Exor Embedded and Arrow Electronics. The Exor nanoSOM nS02 features STMicroelectronics’ 800MHz STM32MP1 micrprocessor.

The nanoSOM nS02 is described as a high-performance, energy-efficient system, based on the 800MHz version of STMicroelectronics’ STM32MP1 microprocessor. The module serves as a full production design and Arrow is also offering a supporting development kit.

The STM32MP1 has dual Arm Cortex -A7 cores and a Cortex-M4 core as well as a 3D graphics processing unit (GPU) that supports advanced human machine interface (HMI) development.

The nS02 is suitable for applications requiring IoT connectivity, multimedia capabilities and high security in connectivity, for example, industry 4.0 embedded systems.

The nS02 is rugged and soldered directly onto the main carrier board, without the need for separate connectors that could reduce the reliability of the system, says Arrow.

It is compact, with dimension of 25.4 x 25.4 x 3.0mm, and is claimed to provide flexibility for developers of smart IoT products, which can be designed as extremely compact and ultra-slim products, Arrow continues. Target applications include smart IoT controllers and gateways, cloud edge interfaces, and building automation.

The nanoSOM nS02 includes a production-ready Linux RT board support package (BSP) and fully supports the Exor XPlatform, which includes Exor Embedded Open HMI software, Corvina Cloud IIoT platform and IEC61131 CODESYS or Exor xPLC runtime.

An optional OpenHMI software platform supports the design of high quality, user-friendly SVG and HTML5 graphical user interfaces (GUIs), and connectivity with over 200 communication protocols. MQTT and OPC-UA interfaces are also available together with cloud connectivity for telemetry and remote assistance using OpenVPN software.

Several configurations are available, offering choices of memory capacity and a security option including 256Mbyte or 512Mbyte DDR RAM with 4Gbyte eMMC flash disk or 1Gbyte DDR RAM with 8Gbyte eMMC flash disk.

Exor’s product longevity program ensures a stable supply of products. nanoSOM nS02 products are available for a minimum of 10 years from time of product launch.

http://www.arrow.com

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MEMS clock SoC family is more reliable for 5G than quartz, says SiTime

The Cascade family of MEMS clock ICs have been introduced by SiTime for 5G, wireline telecomms and data centre infrastructure. The SiT9514x is a clock-system-on-a-chip (ClkSoC) family of clock generators, jitter cleaners, and network synchronisers that deliver multiple clock signals in a system. The devices use SiTime’s third-generation MEMS resonators for low power, high performance operation.
The Cascade ClkSoCs can replace clock ICs which have external quartz references, used by communications systems to integrate multiple timing functions and to distribute clock signals. The SiT9514x’s all-silicon clock architecture integrates a MEMS resonator reference inside the package.
The integrated MEMS resonator eliminates issues with quartz such as capacitive mismatch, activity dips, susceptibility to shock, vibration, and EMI, says SiTime.
Based on SiTime’s MEMS technology, the Cascade clock-SoC is claimed to deliver up to 10 times higher reliability and resilience, to enable zero downtime. This is particularly relevant for 5G networks.
5G is expected to deliver 10 times faster speeds and 10,000 times more data, with 50 times lower latency and zero downtime. To make this vision a reality, SiTime explains, 10 to 30 times more devices will be deployed, many of them in uncontrolled environments close to the consumer. Each of these connectivity gains is dependent on the accuracy, resilience and reliability of the timing heartbeat of the system. Silicon MEMS timing technology inherently provides better
Used as a standalone device or with SiTime’s MEMS TCXOs and OCXOs, the SiT9514x can be used for timing in a variety of applications such as 5G remote radio units (RRUs), small cells, edge computers, switches and routers.
The Cascade family joins SiTime’s Elite Platform Super-TCXOs and Emerald OCXOs. The Cascade devices offer a complete clock SoC which allows our customers to simplify their designs and reduce time to market. SiTime believes it is the only provider of MEMS resonators, oscillators, and clock ICs.
The SiT9514x clock SoCs feature four independent PLLs, with the flexibility to support time synchronisation applications where multiple independent clock domains are required. There are up to 11 outputs with an operating frequency range of 8kHz to 2.1GHz, as well as a one pulse per second (PPS) output, for maximum frequency agility.
The programmable PLL loop bandwidth is down to 1mHz for maximum filtering of wander or network noise in IEEE 1588 and synchronous Ethernet. Another feature is fail-safe operation in case of input clock failures through faster hitless switching between four independent inputs. In such a situation, the device automatically switches to different input clock sources with minimum phase transient at the output, allowing the downstream PLL to remain locked, and the system to continue to operate reliably
Rich programmable features and configuration options are blank in-system programmable (ISP) devices and pre-programmed versions which enable system boot up without software configuration for maximum simplicity
EVBs and TimeMaster software enable users to map clock configurations and generate the scripts for software integration, which speeds development
The SiT9514x clock-system-on-a-chip family is sampling now. High volume production quantities will be available in Q4 2020.

http://www.sitime.com

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Renesas introduces low quiescent current RF amplifier

The company says the F1490 RF amplifier has low quiescent current of just 75mA to save power in 4G/5G infrastructure systems. This is much lower than competitive amplifiers, says Renesas Electronics.

The F1490 is a second-generation high-gain, two-stage RF amplifier that covers the key sub-6GHz 5G frequency bands from 1.8 to 5.0GHz. It delivers high gain with selectable modes and low power consumption. It also maintains high OP1dB performance and 2.4dB noise figure, to meet the system-level requirements of a MIMO 5G pre-driver, said Naveen Yanduru, vice president of RF Communications, Industrial and Communications division at Renesas. “We are excited to continue driving LTE and 5G innovation with our RF amplifier solutions for active antenna systems (AAS), 4G/5G base stations, and other wireless communications equipment,” he added.

The amplifier is designed to operate within the 1.8 to 5.0GHz frequency range and has high gain, high linearity, and wide bandwidth. It is suitable for use with both frequency division duplex (FDD) and time division duplex (TDD) sub-6GHz 5G applications. The F1490 is pin-to-pin compatible with current devices which contributes to lower design cost, says Renesas.

The F1490 has two selectable gain modes – 39.5dB high gain or 35.5dB low gain. It has high performance OIP3 of 38dBm and OP1dB of 24dBm and an operating temperature of +115 degrees C.

Today’s higher data rates drive the need for better radio signal-to-noise ratios, explains Renesas. The company’s patented RF product portfolio addresses the evolving needs of a range of applications, including cellular 4G/5G base stations, communications systems, microwave (RF/IF), CATV, and test and measurement equipment. Renesas’ AAS range includes interface amplifiers, low noise amplifiers, switches and pre-drivers to address the high performance transmit and receive requirements of massive MIMO with the highest efficiencies in the smallest form factors, according to Renesas.

Samples of the F1490 are available now in a 3.0 x 3.0mm, 16-pin QFN package. Mass production will be available in September 2020.

http://www.renesas.com

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Binder unveils printing technique that gives sensors a new dimension

Functional electronic layers can be laid directly on a component, says binder. The binder Innovation & Technology Center has developed the direct printing technique.

As digitisation increases and smart systems proliferate, there is a need for a balance between more complex sensor networks with data processing and simpler, more user friendly operator support, says binder. The trend toward miniaturisation makes it difficult to equip parts due to a limited amount of space with conventional sensors. The binder method of direct printing is claimed to overcome all these challenges. Dr Stefan Ernst, one of the co-developers of the new printing technique, explains: “The printed electronics need less space. In addition, they are more flexible in application and more cost efficient,” he said.

Using a recently developed transfer printing technique, binder was able, for the first time, to apply planar functional electronic layers with a thickness of maximum precision to textured, three-dimensional surfaces in only one printing pass.

Circuit traces, sensors and displays, for example, can be printed without the need for foils or other substrate materials. A protective layer can be overprinted and specially developed nano pastes provide stable parameters for the printing process.

Intended uses in the industrial area range from flexible circuit traces and heating elements to sophisticated sensors. By printing capacitive sensor elements, for example, touch displays of almost any shape can be implemented on three-dimensional and/or textured surfaces. The same approach can also be used for an intuitive gesture control system. Temperature sensors or strain gauges can be implemented by measuring the change in the resistance values of the printed functional layers. The flexible printing technique allows the sensor to be quickly adapted to the application-specific task.

The newly created binder electronic solutions group provides custom-made solutions for connectors, contacts, circuit layout and automatic placement. Services range from design and prototype to series production.

http://www.binder-connector.de

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