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Pre-certified modules accelerate time to market, says Silicon Labs

Thu, Oct 29, 2020

Bluetooth, Zigbee, Thread and multi-protocol modules from Silicon Labs reduce time-to-market for secure smart home, building and industrial automation applications.

The pre-certified wireless modules are claimed to be the only modules in the industry with full stack support for multi-protocol solutions to enable commercial and consumer IoT applications. y offer package options and integrated device security.

“Silicon Labs has mastered the challenges that come with adding wireless connectivity to IoT devices,” said Matt Saunders, vice president of IoT marketing and applications at Silicon Labs. The modules allow IoT device makers to get pre-certified and secure wireless devices quickly to market.

The integrated modules are available in multiple package options including system in package (SiP) and traditional PCB versions. SiP modules contain miniaturised components that remove the need for complicated RF design and certification by opening space-constrained IoT designs to module-based solutions, says Silicon Labs. PCB modules enable flexible pin access and additional options to extend RF performance.

The xGM210PB features Secure Vault, the ARM PSA Level 2-certified IoT device security, as well as dynamic multi-protocol support for Bluetooth, Zigbee, and OpenThread and supports Wi-Fi co-existence. It is optimised for IoT applications, such as connected lighting, gateways, voice assistants and smart meter in-home displays, xGM210PB modules offer up to +20dBM output power and better than -104dBm sensitivity.

The BGM220 is one of the world’s smallest Bluetooth modules, says Silicon Labs, and the first to support Bluetooth Direction Finding. The integrated, pre-certified Bluetooth 5.2 module delivers up to 10 years’ operation on a coin cell battery, making it suitable for appliances, asset tags, beacons, portable medical, fitness, and Bluetooth mesh low-power nodes.

The MGM220 is a low-power, low-cost module for lighting controls, building and industrial automation sensors as well as Zigbee Green Power and energy harvesting applications.

Finally, the BGX220 Xpress includes an on-board Bluetooth stack, Xpress command interface and pre-programmed cable replacement firmware to deliver serial to Bluetooth LE with no need for firmware development. The modules are suitable for industrial applications including human machine interface (HMI) devices, addressing size, safety, and environmental challenges.

The modules are supported in the free-of-charge Silicon Labs Simplicity Studio 5 integrated development environment (IDE), which has software stacks, application demos and mobile apps, network analyser and patented energy profiler. Developers can also use simple APIs from Silicon Labs Xpress modules.

Samples, production quantities and development kits for all four modules are available now.

http://www.silabs.com

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Xilinx introduces Zynq RFSoC DFE for mass 5G radio deployments

Wed, Oct 28, 2020

Adaptive radio platforms are flexible for evolving 5G standards and with a hardened radio digital front end for performance, power, and cost effectiveness, says Xilinx.

The Zynq RFSoC DFE adaptive radio platform is designed to meet the evolving standards of 5G NR wireless applications. It combines hardened digital front end (DFE) blocks and adaptable logic to build low power, cost-effective 5G NR radio solutions for use cases ranging across 5G low-, mid-, and high- band spectrums. According to Xilinx, it offers the best balance of technologies between the cost economies of an ASIC which uses hardened blocks and the flexibility, scalability, and time-to-market benefits of a programmable and adaptive SoC.

5G radio must meet bandwidth, power, and cost challenges for widespread deployment, but must also adapt to the three key 5G use cases, i.e. enhanced mobile broadband, massive machine type communication, and ultra-reliable low-latency communication. They must also scale for evolving 5G standards such as OpenRAN (O-RAN) and new, disruptive 5G business models, Xilinx advises. Zynq RFSoC DFE integrates hardened DFE application-specific blocks for 5G NR performance and power savings yet also offers the flexibility to integrate programmable adaptive logic to enable a futureproof solution for evolving 5G 3GPP and O-RAN radio architectures.

“For the first time, Xilinx is providing a wireless radio platform with more hardened application-specific IP than adaptive logic to address low power and low cost 5G requirements,” said Liam Madden, executive vice president and general manager, Wired and Wireless Group at Xilinx. As the 5G landscape continues to evolve, it is imperative that integrated RF solutions are adaptable to address future standards. “Zynq RFSoC DFE provides the optimal balance between that adaptability and fixed function IP,” said Madden.

Zynq RFSoC DFE offers 2X performance-per-watt compared to the earlier generation of adaptive computing and scales from small cell to massive MIMO macrocells. It is claimed to be the industry’s only direct RF platform that enables carrier aggregation/sharing, multi-mode, multi-band 400MHz instantaneous bandwidth in all FR1 bands, and emerging bands up to 7.125GHz. When used as a mmWave intermediate frequency transceiver, it provides up to 1,600MHz of instantaneous bandwidth.

The Zynq RFSoC DFE architecture allows customers to either bypass or customise the hard IP blocks. For example, they can leverage Xilinx’s field-proven DPD that supports existing and emerging GaN power amplifiers or insert their own DPD IP.

Zynq RFSoC DFE design documentation and support is available to early access customers, with shipments expected during the first half of 2021.

http://www.xilinx.com

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Integrated ToF module is multi-zone

Wed, Oct 28, 2020

Offering an increased camera field of view (FoV) coverage and spatial resolution, the VL53L5 FlightSense time of flight (ToF) sensors are believed to be the first 64-zone devices. The sensors from STMicroelectronics breaks a scene into separate areas to help an imaging system build the most detailed spatial understanding of a scene, the company says.

It has a 940nm vertical cavity surface emission laser (VCSEL) light source, an SoC sensor integrating a VCSEL driver, the receiving array of 40nm single photon avalanche diodes (SPADs), and a low-power 32-bit MCU core and accelerator running firmware.

The SPAD array can be set to favour spatial resolution, where it outputs all 64 zones at up to 15 frames per second, or to favour maximum ranging distance, where the sensor outputs 4×4/16 zones at a frame rate of 60 frames per second.

The miniature module contains optical elements in the receive aperture to create the 64 ranging zones. Range is 4m.

Eric Aussedat, general manager of ST’s imaging division, said that the VL53L5 delivers “64x more ranging zones than previously available . . . [and] performance improvement in laser auto focus, touch-to-focus, presence detection, and gesture interfaces while helping developers create even more innovative imaging applications.”

ST’s ToF technology includes human-presence detection to control the wake up and hibernation of laptops or monitors and laser autofocus in hybrid focusing algorithms for smartphone cameras. The auto focus feature is embedded in most of the highest-ranking smartphone cameras according to DXOMARK, an independent benchmark that assesses image quality.

Laser auto focus assures quick, accurate focusing in low-light scenes or when capturing low-contrast targets.

ST says that key smartphone and PC platform suppliers have pre-integrated the sensor onto platforms. Android and Windows device drivers are widely available for the FlightSense modules.

The VL53L5 is packaged in a 6.4 x 3.0 x 1.5mm module and integrates both transmit and receive lenses and has and expanded FoV of 61 degrees diagonal. This wide FoV is especially suited to detect off-centre objects and ensure perfect auto focus in the corners of the image.

For laser auto focus, the VL53L5 gathers ranging data from up to 64 zones across the full FoV.

ST’s architecture can automatically calibrate each ranging zone and direct ToF technology allows each zone to detect multiple targets and reject reflection from the cover-glass. FlightSense also gathers the raw data collected by the SPAD array and performs post processing, via a proprietary, embedded MCU and accelerator before transferring the ranging data to the system host over an I2C or a SPI bus. This removes the need for a specific camera interface and powerful receiver MCU.

The VL53L5 retains the Class 1 certification of all ST’s FlightSense sensors and is fully eye-safe for consumer products. It is in mass production with millions of units already shipped to leading wireless and computer manufacturers, says ST.

http://www.st.com

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MegiQ’s RF and microwave development tools are exclusive to Farnell

Wed, Oct 28, 2020

For the design and verification of wireless communication and IoT devices, MegiQ RF and microwave development tools are now exclusively available from Farnell.

The distributor has added the development tools to its test and measurement portfolio which includes the full MegiQ range of vector network analysers and antenna measurement systems.

MegiQ products are the most affordable professional RF development tools in the market, says Farnell, making them accessible to IoT start-ups and universities which want to fit out a teaching lab with multiple units. The measurement tools and accessories are suitable for most wireless systems and cover microwave frequencies up to 6GHz. MegiQ tools and accessories can be used for research, development, product verification and production testing with applications ranging from education and research to manufacturing, including semiconductor, automotive and telecomms equipment design.

The RF tools are designed by engineers for engineers, and are claimed to provide RF tools provide users with everything needed to design and verify wireless communication and IoT devices in an affordable package. The toolset is especially suited to the implementation of antenna and enables engineers to measure and optimise impedances and measure antenna radiation patterns, which can be a difficult, and often obscure, process, points out Farnell. All software required for use with MegiQ’s tools is included license-free and compatible for installation on any standard computer.

MegiQ’s full range of RF development tools now available from Farnell includes vector network analysers (VNAs), all with PC software to measure, store and produce graphic output. A built-in match circuit calculator and simulator for antenna circuit development is also included.

There is also a balanced calibration kit which is an interface kit for UFL and balanced VNA measurements containing SMA-UFL adapters and adapters ranging from SMA and UFL to balanced pin headers.

Also included are radiation measurement systems to measure the radiated energy from the ‘outside’ of the antenna. This measures the gain and the total radiated power (TRP) or antenna efficiency.

VNAs in the MegiQ range come with the option to add a bespoke VNA sandbox kit, suitable for students and first-time engineers. These include all necessary accessories and a step-by-step tutorial guide for first-time users to quickly learn how to use VNAs.

James McGregor, global head of Test & Tools at Farnell, said: “With the addition of MegiQ, we continue to ensure the engineering community is supported at every level, from beginners and educators looking for competitively priced, easy-to-use tools right through to experienced professionals seeking a simple solution to their RF and microwave test needs.”

http://www.farnell.com

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Pre-certified modules accelerate time to market, says Silicon Labs

Xilinx introduces Zynq RFSoC DFE for mass 5G radio deployments

Integrated ToF module is multi-zone

MegiQ’s RF and microwave development tools are exclusive to Farnell

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