Reference design for ToF lidar supports range finding for precision robotics

Light detection and ranging (lidar) is increasingly popular in robotics and industrial proximity sensing where mm range accuracy is required. ON Semiconductor has introduced the a reference design based on its Silicon Photomultiplier (SiPM) technology.

The SiPM direct time of flight (dToF) lidar platform exploits the dToF method, which measures the time it takes for a pulse of light, normally in the near infrared (NIR) wavelength range, to travel to and from an object. This deceptively simple technology can incur challenges, such as high levels of ambient solar light. To determine range accurately, the receiver needs to capture as much of the signal as possible. ON Semiconductor says that the SiPM sensor overcomes the shortfall of traditional photodiodes by providing faster response times and high detection efficiency. The reference platform uses the RB-Series, second generation of SiPM sensors, which deliver improved performance in red and the NIR range.

The reference design includes the NIR laser diode, SiPM sensor and optics, as well as the digital processing necessary to convert the detected signals into elapsed time, and elapsed time into distance.  OEMs can adapt it for production of industrial range finding applications.

To accelerate customers’ time to market, ON Semiconductor has made all of the design data for the reference platform available, covering the schematics, BoM, Gerber files, and PCB design files. A PC-based GUI is also accessible, which provides a graphical representation of the measurements over time. The histograms generated provide further evidence of the system’s capabilities in applications such as range finding, collision detection and 3D mapping.

The SiPM dToF lidar platform can detect objects at distances between 100mm and 23m. The design is FDA Class 1 certified and compliant with IEC / EN 60825-1:2014 and 21 CFR 1040.10/ 1040.11 laser safety standards.

ON Semiconductor supplies semiconductor-based solutions, offering a portfolio of energy efficient, power management, analogue, sensors, logic, timing, connectivity, discrete, SoC and custom devices for automotive, communications, computing, consumer, industrial, medical, aerospace and defence applications.

ON Semiconductor operates a network of manufacturing facilities, sales offices and design centres in key markets throughout North America, Europe and the Asia Pacific regions.

http://www.onsemi.com

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Automotive GaN FETs can double power density, says Texas Instruments

Adding to its high voltage power management portfolio, Texas Instruments announces 600 and 650V GaN FETs for automotive and industrial applications. They have a fast switching, 2.2MHz integrated gate driver, which can allow designers to deliver twice the power density, achieve 99 per cent efficiency and reduce the size of power magnetics by 59 per cent compared to existing solutions, says TI.

The LMG3422R050, LMG3425R050, LMG3422R030 and LMG3425R030 FETs use its proprietary GaN materials and processing capabilities on a GaN-on-silicon (Si) substrate, which provides a cost and supply chain advantage over comparable substrate materials such as silicon carbide (SiC), maintains TI.

TI says the automotive GaN FETs can help reduce the size of electric vehicle (EV) onboard chargers and DC/DC converters by as much as 50 per cent compared to existing Si or SiC solutions. Including them in vehicles can extend battery range, increase system reliability and lower design cost to meet the increased desire for electrification in vehicles.

In industrial designs, the devices enable high efficiency and power density in AC/DC power delivery applications where low losses and reduced board space are important, for example in hyperscale and enterprise computing and 5G telecomms rectifiers.

As electronic systems are getting smaller, the components used must get smaller and sit closer together, explains TI. The GaN FETs integrate a fast switching driver, internal protection and temperature sensing, to reduce board space in high performance power management designs. The company says that this level of integration, coupled with the high power density of TI’s GaN technology, enables engineers to eliminate more than 10 components typically required for discrete solutions. Furthermore, each of the new 30mOhm FETs can support up to 4kW of power conversion when applied in a half bridge configuration.

To address the challenge of fast switching capability at the cost of higher power losses, the GaN FETs feature TI’s ideal diode mode to reduce power losses. TI reports, for example, in PFCs, ideal diode mode reduces third-quadrant losses by up to 66 per cent compared to discrete GaN and SiC MOSFETs. Ideal diode mode also eliminates the need for adaptive deadtime control, reducing firmware complexity and development time.

Offering 23 per cent lower thermal impedance than the nearest competitive packaging, the TI GaN FET packaging allows engineers to use smaller heat sinks while simplifying thermal designs. They also provide thermal design flexibility, with the ability to choose from either a bottom- or top-side-cooled package. The FETs’ integrated digital temperature reporting enables active power management, for engineers to optimise system thermal performance under varying loads and operating conditions.

Pre-production versions of the four industrial-grade, 600V GaN FETs are available now in a 12 x 12mm, quad flat no-lead (QFN) package. Volume production is expected to begin in Q1 2021.

Evaluation modules are each FET available now.

Pre-production versions of the LMG3522R030-Q1 and LMG3525R030-Q1 650V automotive GaN FETs and evaluation modules are also scheduled for Q1 2021. Engineering samples are available upon request.

http://www.TI.com

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EdgeReady provides touchless access control via face recognition

Based on its i.MX RT106F crossover microcontroller, NXP offers EdgeReady for the IoT, with a license for facial recognition software to provide touchless access control.

OEMs can use EdgeReady to quickly, easily and inexpensively add vision-based touchless access control, says NXP. The microcontroller and AI/ML-based face recognition software makes possible face recognition with liveness checking using infra red and RGB cameras, flash and SDRAM at a total cost of less than US$10, says the company.

It can be used to implement face recognition for authenticating and operating secure machines, equipment, and access points for hotels, public buildings and homes, for example, doors, locks, amenities, lifts, garage doors and security systems.

The infra red camera operates with a visible light (RGB) camera to distinguish a real person from a photograph. This prevents unauthorised access without the need for an expensive 3D structured light or time of flight (ToF) camera, says NXP.

It responds in 0.5 seconds. Face detection, quality check, liveness detection and face recognition are all conducted in less than 500 milliseconds at the microcontroller-based edge instead of the cloud, to make access systems convenient.

It also enhances data privacy by allowing all personal biometric data to remain on the device at the edge. This helps address privacy regulations as well as the concerns of consumers to protect data.

The battery life is maximised with a fast microcontroller boot up time. The device enters power saving mode when not in use. A fast recognition time is combined with the microcontrollers low active power, says NXP, to further meet low power system requirements.

A customisable smartphone or PC application can enable biometric models to be sent to remote locks and other devices for controlled access in hospitality, smart building and smart home applications.

NXP also offers the i.MX RT106F-based development kit (SLN-VIZNAS-IOT) to accelerate time to market. It contains all the software and hardware information to complete designs in as little as six months, says NXP. In addition to negating integration and coding, the NXP EdgeReady IoT for secure face recognition based on the i.MX RT106F development kit includes schematics, bill of materials (BoM), board layout and ready-to-use face biometric registration application.

The SLN-VIZNAS-IOT secure face recognition development kit is available now from NXP and authorised distributors.

The i.MX RT106F microcontroller is available now. It includes a license to use the NXP face recognition SDK. The device is available in consumer and industrial temperature grades.

http://www.nxp.com

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Wall-mount enclosures smarten up smart buildings

The Smart-Panel wall mount enclosures from OKW are designed to blend seamlessly into residential, commercial and industrial environments. They are for use with intelligent building control and monitoring technology.

The ergonomic Smart-Panel enclosure range is designed to house modern control consoles in a wide range of settings, including building services systems, electrical installations, smart home, IoT/industrial IoT, wireless communications, measuring and control, medical and laboratory technology, security and access control.

The elegant design means that there are no visible fixing screws because the top snaps into place. This also speeds up installation and servicing, says OKW. The top can be re-opened using a set of push-in opening tools. The large recess in the top can accommodate a touchscreen, display or membrane keypad.

The bottom part fits standard flush-mounted or cavity wall boxes, with a maximum opening of 61mm and larger international installation boxes up to 150mm high and 61mm wide.

Electronic components are mounted in the top part. A snap-in phenolic resin hardboard protection plate, available as an accessory, safeguards the electronics in the control system from the risk of damage during installation and servicing.

Smart-Panel enclosures are available in two sizes: 84 x 84 x 21.3mm and 155 x 84 x 21.3mm. They are moulded from UV-stable ASA+PC-FR (UL 94 V-0) with a highly polished bottom part and a fine-textured top. The standard colour is traffic white (RAL 9016). There is a flat, recessed area in one end for USB and Mini-USB connectors.

Accessories include a glass panel (which can be printed on the rear) for touchscreens and displays, a set of opening tools, hardboard protection plates, adhesive foils and anti-slide feet for desktop use.

OKW can supply Smart-Panel enclosures fully customised. Services include CNC machining, printing, laser marking, EMC shielding and installation/assembly of accessories.

https://www.okw.co.uk

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