MEMS accelerometer reduces space needed in challenging environments

A miniature, one-axis, closed loop MEMS accelerometer from TDK has a 24-bit digital SPI and SMD package. The Tronic AXO315 is claimed to match the performance of quartz sensors and outperforms commercial MEMS sensors.

The force-rebalance accelerometer delivers a one year composite bias repeatability of 1mg and composite scale factor repeatability of 600 ppm under severe temperature and vibration conditions common in industrial, land, railway, naval and construction applications. TDK says these characteristics enable significant reduction in size, weight and cost of materials for industrial motion control units, inertial measurement units (IMU) and inertial navigation systems (INS).

The AXO315 is a ±14g range, in-plane linear accelerometer. It has been designed and developed to provide high precision and reliability in challenging environments. It achieves a 1 mg composite bias repeatability over one year at temperatures ranging from -55 to +105 degrees C, and 4 g vibrations with vibration rejection. Performance is augmented by Allan variance characteristics and bias instability of 4 micro g, a velocity random walk of 0.006 m/s/√h, and very low noise of 15 micro g/√Hz, for high resolution and low error.

The AXO315’s performance is equivalent to the incumbent analogue quartz accelerometers and mechanical inclinometers, but at a fraction of their size, weight, and price. They also remain free from dual-use export control according to Annex 1 of Council Regulation (EC) No 428/2009. AXO315 exhibits higher performance levels than any current commercially available MEMS sensors components, says TDK. It delivers an 80 per cent gain in temperature stability compared to Tronics’ AXO215 accelerometer. The AXO315 accelerometer comes in a lightweight 1.4 g hermetic SMD J-lead ceramic package (measuring 12 x 12 x 5.0mm), enabling low-cost assembly and reliability on PCB, even in fast-changing temperature conditions.

The AXO315 can be used for applications requiring high accuracy and stability in demanding environments, such as servo inclinometers and dynamic inclinometers in industrial motion control units, IMUs and INS for GNSS-aided positioning, and navigation of manned and unmanned ground vehicles and trains.

The AXO315 accelerometers are manufactured, tested and calibrated at Tronics Microsystems’ facility in Grenoble, France.

Pre-production and customer sampling have begun. Evaluation of the sensors can also be made through an Arduino-based evaluation kit that is specifically designed to provide developers with improved testing functionalities such as output reading and recording, recalibration and digital self-tests. Full production of the sensors and availability through its network of distributors are scheduled for summer 2021.

Tronics Microsystems SA is a division of TDK’s Temperature & Pressure Sensors Business Group that manufactures custom MEMS products and standard inertial sensors. It provides custom and standard products especially to the industrial, aeronautics, security, and medical markets. Founded in 1997, Tronics is located in Crolles, near Grenoble (France) and in Dallas, Texas (United States).

http://www.tdk.com

> Read More

O-RAN radio unit is optimised for indoor 5G

Compact O-RAN radio units from Benetel are cost-effective and optimised for indoor deployment. The BNTL-RAN550 O-RAN radio unit (O-RU) delivers 100MHz of instantaneous bandwidth, with up to 250mW of output power per transmitter path.

The combination of performance parameters, small form factor and low total cost of ownership, means that the 5G radio unit is prepared for indoor deployments, for use in access points and private networks, predicts Benetel.

The BNTL-RAN550’s adaptable modular architecture complies with the latest O-RAN interface specification, supporting 7.2 split front haul network configurations. It comes equipped with two 10Gigabit Ethernet ports for front haul network interfacing, and the built-in antennae supports four transmit/four receive (4T4R) multiple input/multiple output (MIMO) operation. The initial version will support the 5G band n78 (3.3 to 3.8GHz), with additional frequencies (upper band n77 and band n79) already under development.

The BNTL-RAN550 O-RUs will be available from January. They are designed for ceiling-mount and wall-mount implementations. The CE/FCC-certified units support an operational temperature range of 0 to +45 degrees C and are powered by a 12V DC supply (or via PoE++).

The BNTL-RAN550 offers a deployment-ready O-RAN solution, says Benetel, for implementing small network trials.

Benetel is headquartered in Dublin, Ireland and its team is driving innovation in the roll-out of a small cell infrastructure. The company develops leading-edge radio solutions for 5G and 4G/LTE small cells. Benetel is committed to supporting the evolving radio access networks around the world by producing hardware and related services. The company’s radio units are available in a variety of frequency bands and output powers, to support customers to increase speed to market of the network infrastructure.

http://www.benetel.com

> Read More

Controller provides safety functions for widescreen automotive displays

Two display controllers from Socionext have enhanced security support for high resolution, wide format displays.

The SC1702 display controller meets the automotive market’s demand for high-resolution widescreen automotive displays. Socionext has added a display controller to its SC1701 series, providing low-cost, optimal safety functions for meter clusters. Both display controllers deliver scalable in-vehicle remote display systems with high levels of safety, says the company.

The use of automotive displays is rapidly expanding in instrumentation and vehicle control operations, including meters, climate controls and other dashboard indicators integrated into graphics, as well as head-up displays (HUDs) and e-mirror displays, ranging from conventional small displays to large format, wide screens with some spanning across the entire dashboard.

The SC1702 is capable of transferring data at rates of up to 12Gbits per second, using APIX 3 technology. It is equipped with a newly developed panel interface port (PIP) that supports advanced, high-resolution, wide landscape format displays, such as 8K x 1K, which cannot be supported with conventional interfaces. It is also designed to conform to the HDCP 2.3 encryption technology, making it possible to effectively use rich, 4K-resolution content for multi-displays in a vehicle.

The SC1702 can detect display abnormalities that are unobservable with current technology, advises Socionext. In addition to the conventional safety features, displays can now recognise panel link loss, inconsistencies of CRC of pixel data and other behaviours at the source drivers and gate drivers, enhancing the capabilities to meet further safety requirements.

The SC1701BH5-300 has been added to the SC1701 family, providing additional functions to existing meter systems. Safety features include multi-window signature unit, picture freeze detection, and watchdog, as well as the 2D rendering capability of Deep Color (30 bpp) built-in graphics engine, at a competitive price, says Socionext.

The SC1701BH5-300 is available in an EP-LQFP-216 package, measuring 24 x 24mm and the SC1702AK3 is available in an HS-BGA-319 package, measuring 23 x 23mm.

The join the SC1701BK3-100 and SC1701BH5-100 display controllers.

Samples of the SC1701BH5-300 are now available. Sample shipment of the SC1702AK3 will start in February 2021.

http://www.socionext.com

> Read More

SGET announces postage stamp CoM standard

Credit card sized embedded computer modules have a new footprint that reduces the size of a computer on module (COM) to a postage stamp. Technical consortium, SGET, has announced release 1.0 of the Open Standard Module (OSM) COM standard. OSM defines one of the first standards for directly solderable and scalable embedded computer modules.

The new specification aims to standardise the footprint and interface set of low-power application processors based on MCU32, Arm and x86 architectures across different sockets, manufacturers and architectures. Target applications of the new module standard include IoT-connected embedded, IoT, and edge systems that run open-source operating systems and are used in harsh industrial environments.

“OSM modules give ODMs and OEMs a miniature form factor with high scalability” explained Martin Unverdorben, chairman of the SGET STD.05 Standard Development Team. The modules are application-ready and supplied with all necessary software drivers and board support packages. The specification is open source, both in terms of the hardware and software, he added.

Like all CoM standards, OSMs simplify and accelerate the design-in of processors. At the same time, applications become processor-agnostic, which makes them scalable and future-proof, says SGET. They also protect NRE investments and extend the long-term availability, to increase RoI and sustainability of embedded systems. The OSM specification offers an extra level of ruggedness due to the BGA design and automated surface mount technology (SMT), which can further reduce production costs in series production, advises SGET.

OSMs are also published and licensed under Creative Commons Plus (CC+) dual license. This allows an open licensing model, such as the Creative Commons Attribution-ShareAlike license (CC B-SA 4.0) for a defined set of materials, components and software, and a commercial license for everything not included in this set. This ensures that development data, such as block diagrams, libraries and BOMs resulting from the development of OSMs, will be publicly available. It is also possible to license the IP of a carrier board design commercially without violating the open source idea.

The new OSM specification expands the portfolio of SGET module specifications with solderable BGA mini modules that are “significantly smaller” than previously available modules. The largest OSM measures 45 x 45mm, making it 28 per cent smaller than the µQseven module (40 x 70mm) and 51 per cent smaller than SMARC (82 x 50mm).

Other sizes are OSM Size-0 (30 x 15mm) with 188 BGA pins, OSM Size-S (30 x 30mm) with 332 pins, OSM Size-M (30 x 45mm) and 476 pins and Size-L (45 x 45mm) with 662 BGA pins. SMARC, by comparison, specifies 314 pins and Qseven 230. The BGA design makes it possible to implement significantly more interfaces on a smaller footprint, points out SGET, both in terms of miniaturisation and the increasing complexity of requirements.

The interfaces vary in type and design depending on the size of the OSM modules. Modules from Size-S upwards offer video interfaces for up to one RGB and four-channel DSI. Size-M modules can additionally support two eDP/eDP++, and Size-L adds an LVDS interface for graphics.

The OSM specification provisions up to five Ethernet for system-to-system communication. In addition, all modules have what is called a communication area, providing 18 pins for antenna signals for wireless communication or the integration of field buses. There are four USB 2.0 or two USB 3.0 (only in Size-L), up to two CAN, and four UART. Flash storage media can be connected via UFS. Up to 19 pins are available for manufacturer-specific signals. There are 39 general purpose I/Os, SPI, I2C, I2S, SDIO and two analogue inputs. Up to 58 pins are reserved for future purposes.

https://sget.org

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration