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Tyre sensor combines monitoring for smart tyres

Wed, Nov 25, 2020

Tyre status and loading monitoring is possible, together with pressure sensing in the MLX91805 smart tyre sensor from Melexis. OEMs can use the sensor to prepare for the extension of mandatory tyre pressure monitoring to include commercial vehicles and to enable future generations of smart tyres, says the Belgium-based engineering company.

Unlike conventional, rim-mounted tyre pressure monitoring sensors (TPMS), the MLX91805 has been specially designed to be embedded in the tyre. It integrates an 800g XZ-axis accelerometer that senses up to 10,000 samples per second. It also integrates a pressure sensor, together with temperature and voltage sensors.

The MLX91805 is suitable for tyres used on commercial vehicles, including heavy duty ones, as well as for passenger cars. EU regulations on tyre pressure monitoring for heavy duty commercial vehicles is due to come into force some time between 2022 to 2024. The multiple sensors in the MLX91805 will help ensure compliance and provide extra information, such as loading, that can extend tyre life and boost fuel economy and safety, says Melexis.

The sensor integrates a low power, 16-bit microcontroller and a 315/433MHz RF transmitter that draws just 5mA at 5dBm output power and with just 90nA sleep current. It can run from a tiny battery for the life of the tyre, says Melexis. In addition to built-in diagnostics and fault detection, a maths co-processor allows fast and energy-efficient digital signal processing.

Melexis also offers a library to help application-level software capture and interpret the key information, like accelerometer signals, of the tyre footprint area, to enhance design development.

The MLX91805 is available in a 5.0 x 4.0mm DFN14 package.

Ivan Zagan, product manager for tyre monitoring sensors at Melexis, observed: “This world-first device lets tyre manufacturers create the next generation of smart tyres to deliver extra value for owners and operators, enable new services to maximise fuel efficiency and safety, and contribute to the development of self-driving vehicles.”

http://www.melexis.com

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MCUs are validated for security, says NXP

Tue, Nov 24, 2020

Microcontrollers (MCUs) from NXP Semiconductors have received Level 2 certifications by both the PSA Certified scheme co-developed by Arm and the GlobalPlatform Security Evaluation Standard for IoT Platforms (SESIP) using the secure protection profile for embedded processors. The LPC55S16 MCU is intended for IoT and Industrial edge applications, device security and data protection.

The LPC55S16 MCU is part of the NXP EdgeVerse computing and security portfolio and a member of the general purpose LPC5500 MCU series based on the Arm Cortex-M33 core. The MCU series is based on 40nm NVM process technology, and offers advanced security and mixed-signal capabilities.

The LPC55S16 MCU achieved PSA Certified Level 2, based on an assurance framework to showcase robustness of the security. The certification enables device manufacturers to reduce additional security testing and improve time to market. The laboratory evaluation against the PSA Root of Trust (PSA-RoT) security claims to demonstrate that the device can protect against scalable software attacks.

To achieve GlobalPlatform SESIP 2, the LPC55S16 MCU underwent source code analysis and penetration testing and was validated by an independent certification body. SESIP certification helps assure product security claims are tested and verified, and provides evidence of the LPC55S16 MCU’s resistance to basic attack potential. SESIP allows for customers to re-use the LPC55S16 MCU validation results in the certification process for their end applications.

The LPC55S16 MCU integrated security features include Arm TrustZone technology, which enables system-wide software protection with the ability to securely isolate peripherals to reduce the risk of attack on critical components. There is also an AES-256 accelerator which provides confidentiality and a secure hash algorithm (SHA2) accelerator provides integrity of secure communications and secure boot. A Prince module offers real-time encryption and decryption of the on-chip flash to provide both secure storage of data and asset protection of software IP.

The Casper Crypto co-processor enables hardware acceleration of various asymmetric cryptographic algorithms to establish secure connections, while a physical unclonable function (PUF) uses dedicated on-chip SRAM to construct unique device root keys (64 to 4096 bits) for secure storage. Other protection features are a 128-bit unique device serial number for identification (UUID) and a true random number generator (TRNG). A code watchdog enables integrity checking of execution flow of the firmware and a debug authentication protocol is provided for secure debugging.

The LPC55S16 MCU is part of the Certified EdgeLock Assurance program. Both the SESIP and PSA Certified testing and certifications were conducted by the independent security evaluation laboratory, Brightsight.

The i.MX LPC55S16 MCU family is available now.

http://www.nxp.com

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Harwin introduces multi-contact, high current power connector

Tue, Nov 24, 2020

Raising the power levels supported by its product portfolio, Harwin introduces the Kona series of multi-contact, high current connectors that are robust enough to cope with harsh operating conditions.

The 8.5mm pitch connectors’ contacts are capable of delivering 60A of current. This means that applications such as battery charging can be addressed without having to split the current across multiple contacts. Key applications targeted include electric vehicle battery monitoring/management, power control systems, robotics drives, servo controls, unmanned aerial vehicles (UAVs) and satellites.

The contacts in the Kona series connectors are arranged in a single row, with two-, three- and four- contact versions available. The current carrying capacity is such that very little PCB space is used as less contacts are needed to deliver the current. The mating pair consists of a male vertical through-board connector with board mount fixings, and a female cable connector which will accommodate 8AWG gauge cables.

Harwin’s mate-before-lock mechanism prevents any damage occurring during the locking process ensuring the mating elements are fully aligned first. Shrouding on each contact and a fully polarised construction, means that mis-mating is not a possibility, says Harwin.

Kona connectors have a 250 mating cycle lifespan. The design includes stainless steel thumbscrews, which are fitted to the female connector element, and which mean fixing is simple, with no tools required. A contact indicator is also part of the design, makes certain that the connector elements are correctly oriented.

With a maximum voltage rating of 3kV, and a working temperature ranging from -65 to +150 degrees C, Kona connectors are suitable for deployment in difficult environments. They can handle vibrational forces of 20G for a period of 12 hours. In addition, the six-finger beryllium copper contacts prevent any interruption in connectivity, Harwin says.

Explaining the reason for the introduction of the Kona connector series, Harwin’s Ryan Smart, NPI Product Manager, said: “Customers have approached us in need of even more current per contact. The parameters that the Kona series deliver will open up new potential markets for us, and Kona is our highest performing connector to date.”

http://www.harwin.com

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Trio to develop secure automotive platform

Mon, Nov 23, 2020

GuardKnox, NXP and Green Hills Software have announced a partnership to develop a secure automotive platform for the next generation of vehicle architecture.

GuardKnox’s consolidated, scalable, and high-performance solutions, based on NXP’s S32G vehicle network processors and the Green Hills INTEGRITY RTOS and development tools, will make up the automotive platform for global OEMs and Tier-1 suppliers.

GuardKnox claims to be the automotive industry’s first Cybertech Tier computing supplier and has partnered with NXP Semiconductors, which provides secure vehicle network processors, and Green Hills Software, which provides real time operating systems (RTOS).

The companies will collaborate to develop a secure automotive platform targeting next generation zonal E/E architecture, enabling commercial deployment for software-defined and service-oriented vehicles.

The platform is designed for global OEMs and Tier-1 suppliers to overcome current technological challenges such as integrating the hardware and software required for delivering advanced features and functionalities for the next generation of vehicles. The unified platform targets new zonal vehicle architectures that consolidate services that have traditionally been performed by multiple, dedicated functional domain platforms. This will simplify wiring harnesses, thereby lowering vehicle weight and cost and enable scalability and enhancements through software over the air updates.

“NXP’s collaboration with GuardKnox and Green Hills addresses key challenges of the automotive industry’s dramatic shift from horsepower to compute power to drive future software-centric vehicles,” said Brian Carlson, global marketing director for Vehicle Control and Networking Solutions at NXP. “This flexible automotive platform unleashes the innovation of the S32G vehicle network processor to meet the demanding processing and networking needs of domain and zonal vehicle architectures coupled with secure, service-oriented software that’s ready to accelerate automotive OEM and Tier 1 innovations.”

Based on NXP’s S32G vehicle network processor and the Green Hills Integrity safe and secure separation kernel and secure hypervisor (Multivisor), the platform will retain GuardKnox’s mixed-criticality features of service-oriented architecture (SOA) for a consolidated, scalable, dynamic, and secure-by-design platform, says the company.

Idan Nadav, co-founder and CSO of GuardKnox, commented: “By combining NXP’s . . . processor solutions and proven software and development tools from Green Hills, we are confident that our joint dynamic platform will empower OEMs with the freedom to evolve and usher in the next era of innovative automotive solutions”.

The platform is suited for a range of new vehicle services such as in-vehicle app stores, vehicle personalisation, immersive infotainment systems and advanced driver assistance systems (ADAS). It is designed to adapt to customer needs while remaining agnostic to network topology. Its flagship is a general purpose compute element with automotive network interfaces, serving as a baseline vehicle server. It can also serve as a high performance domain controller for today’s architectures, designed to host applications, provide extra services, additional functionality, and consolidation of other external hardware.

https://www.ghs.com

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Tyre sensor combines monitoring for smart tyres

MCUs are validated for security, says NXP

Harwin introduces multi-contact, high current power connector

Trio to develop secure automotive platform

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