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Renesas introduces 64-bit RZ/G3E MPU for high-performance HMI systems

Tue, Jul 29, 2025

Renesas has announced the launch of its new 64-bit RZ/G3E microprocessor (MPU), a general-purpose device optimised for high-performance Human Machine Interface (HMI) applications. Combining a quad-core Arm® Cortex-A55 running at up to 1.8GHz with a Neural Processing Unit (NPU), the RZ/G3E brings high-performance edge computing with AI inference for faster, more efficient local processing. With Full HD graphics support and high-speed connectivity, the MPU targets HMI systems for industrial and consumer segments including factory equipment, medical monitors, retail terminals and building automation.

At the heart of the RZ/G3E is a quad-core Arm Cortex-A55, a Cortex-M33 core, and the Ethos-U55 NPU for AI tasks. This architecture efficiently runs AI applications such as image classification, object recognition, voice recognition and anomaly detection while minimising CPU load. Designed for HMI applications, it delivers smooth Full HD (1920×1080) video at 60fps on two independent displays, with output interfaces including LVDS (dual-link), MIPI-DSI, and parallel RGB. A MIPI-CSI camera interface is also available for video input and sensing applications.

The RZ/G3E is equipped with a range of high-speed communication interfaces essential for edge devices. These include PCI Express 3.0 (2 lanes) for up to 8Gbps, USB 3.2 Gen2 for fast 10Gbps data transfer, and dual-channel Gigabit Ethernet for seamless connectivity with cloud services, storage, and 5G modules.

Starting with the third-generation RZ/G3S, the RZ/G series includes advanced power management features to significantly reduce standby power. The RZ/G3E maintains sub-CPU operation and peripheral functions while achieving low power consumption around 50mW and around 1mW in deep standby mode. It supports DDR self-refresh mode to retain memory data, enabling quick wake-up from deep standby for running Linux applications.

Renesas continues to offer the Verified Linux Package (VLP) based on the reliable Civil Infrastructure Platform, with over 10 years of maintenance support. For users requiring the latest versions, Renesas provides Linux BSP Plus, including support for the latest LTS Linux kernel and Yocto. Ubuntu by Canonical and Debian open-source OS are also available for server or desktop Linux environments.

Renesas has also introduced system-on-module (SoM) solutions featuring the RZ/G3E. A broad range of SoM solutions will be available from Renesas’ ecosystem partners such as a SMARC module from Tria, an OSM (Size-M) from ARIES Embedded, and an OSM (Size-L) from MXT.

https://www.renesas.com/rzg3e

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Infineon’s CoolSiC MOSFET package enable higher power density for industrial applications

Tue, Jul 29, 2025

Infineon has launched the CoolSiC MOSFETs 1200 V G2 in a top-side-cooled (TSC) Q-DPAK package. The new devices deliver optimised thermal performance, system efficiency, and power density. They were specifically designed for demanding industrial applications that require high performance and reliability, such as electric vehicle chargers, solar inverters, uninterruptible power supplies, motor drives, and solid-state circuit breakers.

The new CoolSiC 1200 V G2 technology offers significant improvements over the previous generation, enabling up to 25 percent lower switching losses for equivalent RDS(on) devices, thereby increasing system efficiency by up to 0.1 percent. Utilising Infineon’s improved .XT die attach interconnection technology, the G2 devices achieve more than 15 percent lower thermal resistance and an 11 percent reduction in MOSFET temperature compared to G1 family products. The outstanding RDS(on) values, ranging from 4 mΩ to 78 mΩ, along with a broad product portfolio enable designers the flexibility to optimise system performance for their target applications. Furthermore, the new technology supports overload operation up to a junction temperature (Tvj) of 200°C and features high robustness against parasitic turn-on, ensuring reliable operation under dynamic and demanding conditions.

The CoolSiC MOSFETs 1200 V G2 are available in two Q-DPAK configurations: a single switch and a dual half-bridge. Both variants are part of Infineon’s broader X-DPAK top-side cooling platform. With a standardised package height of 2.3 mm across all TSC variants – including Q-DPAK and TOLT – the platform offers design flexibility and enables customers to scale and combine different products under a single heatsink assembly. This design flexibility simplifies advanced power system development, making it easier for customers to customise and scale their solutions.

The Q-DPAK package enhances thermal performance by enabling direct heat dissipation from the device’s top surface to the heatsink. This direct thermal path delivers significantly better heat transfer efficiency compared to traditional bottom-side cooled packages, enabling more compact designs. Additionally, the Q-DPAK package layout design allows for minimised parasitic inductance, which is critical for higher switching speeds. This enhances system efficiency and reduces voltage overshoot risk. The small footprint of the package supports compact system designs, while its compatibility with automated assembly processes simplifies manufacturing, ensuring cost-efficiency and scalability.

https://www.infineon.com/coolsic-mosfet-discretes

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element14 Community launches global LED design challenge with Würth Elektronik

Tue, Jul 22, 2025

element14, an Avnet Community, has launched a new global design challenge in collaboration with Würth Elektronik. This new competition invites engineers, makers and hobbyists to develop a prototype or test rig using Würth Elektronik’s cutting-edge SMD LEDs with Integrated WL-ICLED Controller.

The challenge encourages participants to demonstrate the WL-ICLED Controller’s capabilities through applications such as:
• Home appliances
• Industrial control systems
• Smart lighting
• Gaming peripherals
• Decorative lighting
• Smart home monitoring or notification systems

Ten applicants will be selected to receive a free design kit, including a variety of Würth Elektronik WL-ICLEDs, an Arduino Zero, a power supply, and additional accessories to support their builds. All challengers must incorporate WL-ICLED technology into their project and document their progress through a series of blog posts.

Please note that this challenge may require SMD soldering, reflow soldering and PCB design.

Applications are open now through 8 August. Selected participants will have until 26 October to complete their projects, with winners announced shortly after.

To be eligible for prizes, selected challengers must post at least five updates on the element14 Community and a final project blog showcasing their build and the WL-ICLED’s capabilities. Entries will be judged on creativity, technical execution, and effective use of the controller’s features.

For more information on the design challenge and to register, please visit: https://community.element14.com

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Ibase announces new outdoor computer for extreme environments

Tue, Jul 22, 2025

Ibase has launched the ARS200, a rugged, waterproof all-in-one outdoor computer engineered for high-reliability performance in extreme conditions. Purpose-built for mission-critical applications, the ARS200 combines durable industrial-grade hardware with environmental resilience, making it ideal for smart transportation, traffic monitoring, industrial automation, outdoor digital signage, and energy infrastructure deployments.

Powered by Intel 14th/13th Gen Core U-series processors and supporting up to 64GB of DDR5-5600 memory, the ARS200 offers computing performance with energy efficiency. Its modular design supports multiple M.2 slots for wireless and storage expansion, and includes rich I/O options such as dual 2.5GbE LAN, dual CANbus, and a SIM slot for 4G/5G LTE connectivity.

Built with an IP65-rated fanless enclosure, the ARS200 is protected against water, dust, and harsh weather conditions. It operates across wide temperature ranges from -20°C to 70°C, ensuring 24/7 performance in both hot and cold outdoor environments. To support deployment in diverse field applications, it accepts a wide-range 12V~24V DC input and is equipped with built-in protections against over-voltage, under-voltage, and reverse polarity.

The ARS200 is engineered for rugged edge computing applications requiring long-term durability and uninterrupted operation. It enables industries to bridge the gap between reliable computing infrastructure and real-world operational challenges, driving smart city initiatives, supporting mission-critical transportation and logistics systems, and empowering operators with the confidence to deploy in the harshest environments, knowing their systems are built to endure the toughest conditions.

https://www.ibase.com.tw

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