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Lidar demo boards see farther, faster, says EPC

Wed, Mar 17, 2021

Driver demonstration boards, based on Efficient Power Conversion (EPC)’s fast transition EPC2034C eGaN FETs, allow a lidar system to see farther and faster, says the company.

The 200V, 12 sq mm EPC2034C eGaN FETs enable the EPC9150 to generate a 220A laser pulse peak in a pulse width that is only 2.9 nanoseconds wide. The high current increases the range of the lidar system, while the short pulse width leads to higher resolution. The small size and low cost make eGaN FETs and ICs ideal for lidar applications from automotive to industrial robotics and security, confirmed EPC.

A lidar system can be used to create 3D maps for autonomous vehicles, to determine speed and detect objects as part of its safety system. eGaN FETs and ICs provide the high current pulses, narrow pulse widths and small form factor that make high performance lidar practical for the constrained spaces of automotives, and affordable.

Engineers and driver assistance developers can use the EPC9150 to demonstrate the rapid transition capability of the EPC2034C eGaN FETs which provide power pulses to drive the laser diodes, VCSELs or LEDs up to 10 times faster than an equivalent MOSFET, said EPC. The company also pointed out that the eGaN FETs are in packages that are a small fraction of the area, energy, and cost of MOSFETs. The FETs can therefore, said EPC, enhance overall performance, including accuracy, precision, and processing speed as well as the price of a lidar system.

The EPC9150 ships with an interposer board. The interposer board is a collection of break-away 5.0 x 5.0mm square interposer PCBs with footprints to accommodate different lasers, RF connectors, and a collection of other footprints designed for experimentation with different loads. The use of the interposers allows many different lasers or other loads to be mounted, allowing users to test the performance with the load requirements that are appropriate to their application.

The EPC9150 demonstration board is available for immediate delivery from distributor, Digi-Key and EPC.

http://www.epc-co.com

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PCB connectors by Samtec suit microwave applications

Wed, Mar 17, 2021

Able to reach up to 65GHz compression mount PCB connectors are able to reach up to 65GHz for microwave applications.

The solderless vertical connector allows engineers to replace components in the field for cost-effective assembly to the board, said Samtec. Connector interfaces include 1.85mm (65GHz), 2.40mm (50GHz) and 2.92mm (40GHz). Microstrip and stripline options are available.

The PCB connectors have threaded coupling which is claimed to provide “superior repeatability” with high mechanical stability. Samtec also offers mating cable assemblies and announced that 1.35mm (90GHz) connectors will be introduced soon.

Samtec was founded in 1976. The company manufactures a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, precision RF, two-piece board-to-board, and micro or rugged components and cables.

Samtec Technology Centers are dedicated to developing and advancing technologies, strategies and products to optimise performance and cost of a system from the bare die to an interface 100m away, and all interconnect points in between.

Samtec has over 40 international locations, with products sold in more than 125 different countries.

http://www.samtec.com

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AMD launches EPYC 7003 CPUs for secure cloud data performances

Tue, Mar 16, 2021

Delivering up to 19 per cent more instructions per clock, the EPYC 7003 series processors have been released by AMD. They are designed for high performance computing (HPC), cloud and enterprise customers and have Zen 3 cores and security features.

“With the launch of our 3rd Gen AMD EPYC processors, we are incredibly excited to deliver the fastest server CPU in the world,” says Forrest Norrod, senior vice president and general manager, Data Center and Embedded Solutions business group at AMD.

The EPYC 7003 series processors have up to 64 Zen 3 cores per processor and introduce new levels of per-core cache memory. They also continue to offer the PCIe 4 connectivity and memory bandwidth that defined the EPYC 7002 series CPUs.

They also have modern security features through AMD Infinity Guard, supporting Secure Encrypted Virtualization-Secure Nested Paging (SEV-SNP). The SEV-SNP feature adds strong memory integrity protection by creating an isolated execution environment to help prevent malicious hypervisor-based attacks.

For throughput computing capabilities to do more simulations in a given time period, or use bigger data sets or more complex models, AMD EPYC 7003 series processors enable faster time to discovery with more I/O and memory throughput, and powerful Zen 3 cores that deliver up to twice the performance for HPC workloads compared to any competing alternatives, says AMD.

For cloud providers who need compute density and security capabilities, AMD EPYC 7003 series processors offer the highest core density, claims AMD, with advanced security features and up to twice the integer performance compared to any competing devices.

The processors also increase transactional database processing by up to 19 per cent, improve Hadoop big data analytic sorts by up to 60 per cent and offer superior performance for a flexible Hyperconverged Infrastructure to help turn data into actionable insights faster, says AMD.

The AMD EPYC processor ecosystem is expected to grow significantly by the end of 2021 with more than 400 cloud instances using all generations of EPYC processors and 100 new server platforms using 3rd Gen EPYC processors. AMD EPYC 7003 Series processor-based solutions are available now through OEMs, ODMs, cloud providers and channel partners around the world.

Companies in the large AMD ecosystem have already responded and implemented the AMD EPYC 7003 series processors, including AWS, Google cloud and Microsoft Azure, Cisco, Dell Technologies, Lenovo and VMware are just some examples.

http://www.amd.com

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Server accelerates breakthrough in data centre processing, says MiTac Computing

Tue, Mar 16, 2021

Based on AMD’s EPYC 7003 processor, Tynan Transport CX data centre servers raise efficiency and performance enhancements in hardware, security and memory density for modern data centres, says MiTac Computing Technology.

“Tynan’s . . . server platforms powered by 3rd Gen AMD EPYC processors enable businesses to make more accurate decisions with higher precision,” said Danny Hsu, vice president of MiTac Computing Technology.

The EPYC 7003 series processors provide the performance needed in the heart of the enterprise to help IT professionals drive faster time to results, comments Ram Peddibhotla, corporate vice president, EPYC product management, at AMD.

The high memory capacity, multi-node and data cache servers power the cloud servers. The Transport CX GC79-B8252 and Transport CX GC79A-B8252 are 1U dual-socket server platforms for high-density data centre deployment with a variety of memory-based computing applications.

Two systems feature 32 DDR4 DIMM slots, two standard PCIe Gen 4 x16 expansion slots, and an OCP 3.0 LAN mezzanine slot. The GC79-B8252 platform provides four 3.5-inch SATA drive bays and four 2.5-inch NVMe drive bays with tool-less carriers, while the GC79A-B8252 platform offers 12 2.5-inch drive bays with up to 12 NVMe U.2 support.

The Transport CX GC68-B8036-LE and Transport CX GC68A-B8036are cost-optimised single-socket cache server platforms featuring 16 DDR4 DIMMs, a pair of PCIe Gen.4 x16 expansion and an OCP 2.0 LAN mezzanine slot in 1U. The GC68-B8036-LE supports four 3.5-inch SATA and four 2.5-inch tool-less NVMe drive bays for large storage capacity while the GC68A-B8036 accommodates 12 2.5-inch tool-less drive bays with support for up to 12 NVMe U.2 devices for applications with high storage performance requirements.

Also included in the announcement is the Transport CX TN73-B8037-X4S. This a 2U multi-node server platform with four front-serviced compute nodes. Each node supports one AMD EPYC 7003 Series processor, four 2.5-inch tool-less NVMe/SATA drive bays, eight DDR4 DIMM slots, three internal cooling fans, two standard PCIe Gen.4 x16 expansion slots, two internal NVMe M.2 slots and one OCP 2.0 LAN mezzanine slot. The platform is suited for high-density data centre deployments and targets scale-out applications with large numbers of nodes.

For accelerate computational workloads in high performance computing (HPC), artificial intelligence (AI) and deep learning, there is the Transport HX range. The

Transport HX TN83-B8251 is a 2U four-GPU server with two CPUs, two PCIe 4.0 x16 high-speed networking cards, and eight 3.5-inch hot-swap SATA or NVMe U.2 tool-less drive bays. The platform supports up to four double-width GPU cards that can be used to scale up the number of GPUs to improve HPC and deep learning performance, advises MiTac.

The Transport HX TS75-B8252 and Transport HX TS75A-B8252 are 2U dual-socket server platforms with support for 32 DIMM slots and up to nine PCIe 4.0 slots. The HX TS75-B8252 accommodates 12 hot-swap, tool-less 3.5-inch drive bays with up to four NVMe U.2 support; TS75A-B8252 accommodates 26 hot-swap, tool-less 2.5-inch drive bays with up to eight NVMe U.2.

Hybrid software-defined storage servers in the Transport SX range deliver large I/O and memory bandwidth for storage applications. The Transport SX TS65-B8253 is a 2U hybrid software storage server for various data centre and enterprise deployment supporting the dual-socket AMD EPYC 7003 series processor, 16 DDR4 DIMM slots and seven standard PCIe 4.0 slots. The platform is equipped with up to two 10GbE and two GbE onboard network connections, 12 front 3.5-inch tool-less SATA drive bays, up to four NVMe U.2 devices, and two rear 2.5-inch tool-less SATA drive bays for boot drive deployment.

There is also drop-in AMD EPYC 7003 series processor support for existing EPYC 7002 series processor-optimised servers via a BIOS update.

http://www.tyan.com

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Lidar demo boards see farther, faster, says EPC

PCB connectors by Samtec suit microwave applications

AMD launches EPYC 7003 CPUs for secure cloud data performances

Server accelerates breakthrough in data centre processing, says MiTac Computing

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