Renesas and Syntiant develop voice-controlled multimodal AI solution combining advanced vision and voice technologies

Renesas Electronics and Syntiant have announced the joint development of a voice-controlled multimodal AI solution that enables low-power contactless operation for image processing in vision AI-based IoT and edge systems, such as self-checkout machines, security cameras, and video conference systems, and smart appliances such as robotic cleaning devices.

The new solution combines the Renesas RZ/V Series vision AI microprocessor unit (MPU) and the low-power multimodal, multi-feature Syntiant® NDP120 Neural Decision Processor™ to deliver advanced voice and image processing capabilities. The joint solution features always-on functionality with quick voice-triggered activation from standby mode to perform object recognition, facial recognition, and other vision-based tasks that are critical functions in security cameras and other systems. For example, while user-defined voice cues drive activation and system operation, vision AI recognition tracks operator behaviour and controls operation or issues a warning when suspicious actions are detected.

The multimodal architecture makes it easier to create contactless user experiences for vision AI-based systems. Using a dedicated, power-efficient chip for voice recognition reduces standby power consumption while speeding up system development because it is possible to develop software independently of the vision AI functionality.

“We anticipate that demand for multimodal systems that use multiple streams of input information – both image and voice – will increase moving forward as a way to improve both ease of use and safety,” said Hiroto Nitta, Senior Vice President and Head of SoC Business in the IoT and Infrastructure Business Unit at Renesas. “Through the collaboration between Renesas, a leader in low-power image AI technology, and Syntiant, a leader in voice AI technology, we will accelerate the adoption of low-power, ultra-small smart voice AI technology in embedded systems and deliver new combined solutions to customers globally.”

“Voice-based user interfaces will make it possible for customers to deliver new user experiences that bring the next generation of innovative ideas from concept to reality, said Syntiant CEO Kurt Busch. “We’ve already shipped more than 15 million of our deep learning NDPs globally to enable always-on voice in a wide variety of consumer and industrial IoT applications. Our collaboration with Renesas delivers a powerful, low-power voice and image solution that is certain to accelerate traction among a global customer base in a variety of devices and use cases.”

The Renesas RZ/V Series MPU for vision AI incorporates Renesas’ exclusive DRP-AI (Dynamically Reconfigurable Processor-AI) accelerator and combines high-precision AI inference with a power efficiency that is among the best in the industry. This superior power performance eliminates the need for heat dispersion measures such as heat sinks or cooling fans, which reduces the bill of materials (BOM) cost and makes it possible to integrate vision AI into a wide range of embedded applications.

The Syntiant NDP120 chip incorporates sophisticated AI capabilities that can be used to implement many high-precision, hands-free voice functions, including speaker recognition, keyword detection, multiple wake words, and local command recognition. Packaged with the Syntiant Core 2™ neural network inference engine, the NDP120 can also run multiple applications simultaneously while minimising power consumption to 1mW battery power.

The new voice-controlled multimodal AI solution uses multiple mutually compatible devices from broader Renesas portfolio to provide customers an elevated prototyping platform for faster time to market and reduced risk. The new solution is part of Renesas’ Winning Combinations, which feature compelling analog, power, and embedded processing product combinations that help customers accelerate their designs and get to market faster.

Availability

The reference design for the new multimodal AI solution is available now, including circuit diagrams and BOM lists. For more information, please visit multimodal AI solution.

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Xtensa processors meet ISO 26262 compliance to ASIL-D

Cadence Tensilica Xtensa processors with FlexLock capability meet the ISO 26262:2018 standard to ASIL-D, the highest level possible under the Automotive Safety Integrity Level rating. The functional safety certification spans from base microcontroller to high-performance DSP, each with a configuration option for FlexLock to provide increased random fault protection. The processor have been developed following a robust safety process to protect against systematic faults. Tensilica Xtensa processors with FlexLock are suitable for the automotive market and tailored for AI, vision, radar, lidar, audio, vehicle-to-everything (V2X), and control applications.

The Cadence Tensilica FlexLock processors optimised for automotive applications are among the first in the industry to achieve full compliance with ASIL-D functional safety standards, said Wolfgang Ruf, head of functional safety for semiconductors at SGS-TÜV Saar. “Certification to . . . . the ISO 26262:2018 standard for ASIL-D systematic and random fault avoidance is a testament to the high functional safety quality of Cadence’s IP. SoC designers are assured that their designs using functional safety-certified Tensilica processor IP can achieve compliance with the automotive industry’s stringent safety-critical requirements,” he added.

Key to ASIL-D compliance is the new FlexLock capability, which adds lockstep support to the flexible and extensible Xtensa processor architecture. Lockstep is a proven method for increasing safety in software execution by providing redundancy of the core logic at the hardware level. In addition to ASIL-D certification, FlexLock also gives design teams the ability to accommodate two cores running independently in ASIL-B solutions and the option of running local memories and caches of two cores in lockstep, achieving even greater levels of protection against memory faults.

“Higher levels of autonomy require more intelligent computing at the edge in automotive applications, which is driving the need for higher levels of functional safety,” said Larry Przywara, senior group director, Tensilica marketing at Cadence. “With the introduction of FlexLock capability, users of Tensilica controllers and DSPs can achieve the highest level of certification, ASIL-D, and the protection it brings against random hardware faults. Designers choosing Tensilica IP to accelerate their ADAS [advanced driver assistance systems], radar, lidar, V2X and vision processing can do so with the confidence that they can meet their customers’ functional safety requirements.”

As with other Xtensa processors, the ASIL-D certified cores can be customised using the Tensilica Instruction Extension (TIE) language. This allows the IP to be optimised for the specific application, combining the right level of performance with the highest levels of safety.

The Tensilica Xtensa processors with FlexLock capability are available now.

http://www.cadence.com

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Neural network detects faces in 12milliseconds

Faces can be detected in video and still images at 12 milliseconds per inference in the Detectum neural network created by Xailient. The IoT face detection system uses Maxim Integrated’s MAX78000 AI microcontroller.

Xailient’s neural network draws 250 times  lower power (at just 280 microJoules) than conventional embedded solutions, and at 12 milliseconds per inference, the network performs in real time and is faster than the most efficient face-detection system available for the edge, claims Maxim.

Battery-powered AI systems that require face detection, such as home cameras, industrial grade smart security cameras and retail solutions, require a low power operation to provide the longest possible time between charges. In addition to supporting standalone applications, Maxim Integrated’s microcontroller paired with Xailient’s neural network improves overall power efficiency and battery life of hybrid edge / cloud applications that use a low power ‘listening’ mode which wakes up the more complex systems when a face is detected.

Xailient’s Detectum neural network includes focus, zoom and visual wake word technologies to detect and localise faces in video and images at 76 times faster rates than conventional software, at similar or better accuracy, says Maxim. The ability to localise a face means that it can be used for advanced applications which determine where a face is in the image’s field of view. Examples include person, vehicle and object counting, presence or obstruction detection, as well as path mapping and footfall heatmaps.

The network can be extended to other applications such as livestock inventory and monitoring, parking spot occupancy and retail or warehouse inventory levels.

Xailient’s neural network combined with the computational efficiency and low power sleep modes of the MAX78000 microcontroller extend the operating time of coin cell battery-powered, hybrid edge/cloud applications for many years, says Maxim.

“AI is on track to be the second largest carbon emitting industry,” said Dr. Shivy Yohanandan, Xailient chief technology office (CTO) and inventor of Xailient’s Detectum neural network technology. “Replacing 14 legacy internet protocol cameras that use traditional cloud AI with edge-based cameras equipped with the Maxim Integrated MAX78000 paired with Xailient’s neural network has the equivalent carbon impact of taking one gasoline powered car off the road,” he said.

The MAX78000 is available now and Maxim also offers the MAX78000EVKIT# evaluation kit.

The Detectum neural network, series models, tools, services as well as focus, zoom and visual wake word technologies are available directly from Xailient.

http://www.maximintegrated.com

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Eight-channel ReDriver has PCIe 4.0 interfaces

Extending its linear ReDriver ICs, Diodes has added the PI3UPI1608 with internal coupling capacitors. The IC can “significantly” extend PCB trace lengths while minimising power consumption and associated bill of materials costs, says the company.

It supports speeds of up to 20Gbits per second and is UPI 2.0 and PCIe 4.0- compliant with eight differential channels. Integral coupling capacitors save board area by reducing the number of external components required. can be avoided.

Key applications include AI servers, data storage equipment, 5G networking infrastructure and high-performance PCs as well as CPU-to-CPU and CPU-to-storage interconnects.

The PI3UPI1608 ReDriver compensates for channel losses at the transmitter and improves signal integrity at the receiver. It is also optimised for high-performance systems operating at elevated frequencies.

The programmable linear equalisation, output swing, and flat gain capabilities enable the PI3UPI1608 to reduce bit error rates (BERs) and lower intersymbol interference. Programmability can be carried out via the pin strap and I2C interface.

The PI3UPI1608 ReDriver IC runs off a 3.3V supply and has an operating temperature range of -40 to +85 degrees C. It is supplied in a 116-pin QFN package which measures 13 x 7.0mm.

Diodes delivers semiconductor products to companies in the consumer electronics, computing, communications, industrial, and automotive markets. Its product portfolio includes discrete, analogue and mixed-signal products and packaging technology to meet customers’ needs. There are 31 sites around the world, including engineering, testing, manufacturing, and customer service.

http://www.Diodes.com

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