Keil Studio Cloud accelerates IoT development says Arm

Two initiatives have been announced by Arm for embedded, IoT, ML, and MCU software developers. The Open-CMSIS-Pack project will deliver the infrastructure to integrate and manage software components and improve code reuse across projects, while Keil Studio Cloud provides a cloud-hosted platform with direct Git integration and modern CI workflows for rapid IoT device development.

Software compatibility for component re-use in the IoT presents a challenge as the IoT landscape is much more diverse at the hardware level compared to PCs or the data centre. In response, Arm offers the Common Microcontroller Software Interface Standard (CMSIS). This vendor-independent abstraction layer for microcontrollers, specifically for Arm Cortex-M processors, includes CMSIS-Pack, a packaging technology that supports nearly 9,000 different microcontrollers. It is designed to make project integration of drivers, middleware and other software components across multiple Arm-based devices much easier.

Arm is now moving parts of CMSIS into an open project called Open-CMSIS-Pack, which will deliver the infrastructure to integrate and manage software components and improve code reuse across projects. The Open-CMSIS-Pack project will begin its life as an incubation initiative under the Linaro IoT and Embedded Group, focusing on a standard for software component packaging and related foundation tools for validation, distribution, integration, management, and maintenance.

The initial focus of the Open-CMSIS-Pack project will be command-line tools and CMake workflows that enable the broader ecosystem to integrate CMSIS-Pack-based development flows. This project is the starting point for evolving the CMSIS-Pack technology into a true open standard for microcontroller software component packaging, targeting key interfaces for major IoT platforms and producing a framework that can be embraced across the ecosystem.

The second announcement is simplified cloud-based IoT development tools in Keil Studio Cloud. This is the first component of the next-generation Keil tool suite. This early access beta will allow developers to experience the Keil Studio workflow first hand with a limited set of supported development boards and features. The tool will evolve over several software releases, delivering a desktop and cloud experience that will provide developers with:

An integrated development environment runs in the browser and connects directly to boards on a desktop. There is no complicated tool installation, and example projects along with the related resources are always up to date so developers can have code running on a device within minutes, assures Arm.

Direct Git integration enables distributed teams, collaborative development, and modern CI workflows that leverage Arm modelling technology.

Flexible cloud-hosted development first introduced by the Mbed Online Compiler, with professional Keil capabilities such as CMSIS-Pack software components and run-control debug.

A portal for the broader software ecosystem to collaborate on, submit examples and share feedback will be available in a later release in 2021.

Combined with Keil MDK, Keil Studio will offer the best-in-class IoT, machine learning (ML) and embedded development environment even for the most demanding real-time and functional safety projects, says Arm.

https://www.keil.arm.com/

> Read More

1-Form-B photo relay offers 1.2A on-state current rating

Offered as an alternative to conventional mechanical relays, the TLP4590A is the latest photo relay from Toshiba Electronics Europe. It is supplied in a compact DIP6 package.

This 1-Form-B (normally closed) photo relay has an on-state current rating of 1.2A, which represents a 140 per cent improvement on the company’s previous-generation TLP4176A device. It has a 60V off-state output terminal voltage rating and enhanced sensitivity due to the low trigger LED current of 2mA (maximum) exhibited.

Applications for the photo relay includes those relating to building automation – including heating, ventilation, air conditioning and security systems, as well as fire alarms. It can also be used in industrial equipment, such as programmable logic controllers (PLCs), I/O interfaces and sensor control hardware. The 5,000V rms (minimum) isolation voltage makes the TLP4590A suitable for use where elevated levels of insulation performance are required. Operating range is -40 to +110 degrees C, enabling the photo relay to be used in harsh environments.    

Toshiba Electronics Europe is the European electronic components business of Toshiba Electronic Devices and Storage. TEE offers European consumers and businesses a variety of innovative hard disk drive (HDD) products, semiconductors for automotive, industrial, IoT, motion control, telecomms, networking, consumer and white goods. The company’s broad portfolio encompasses integrated wireless ICs, power semiconductors, microcontrollers, optical semiconductors, ASSPs and discrete devices ranging from diodes to logic ICs.

TEE has headquarters in Düsseldorf, Germany, with branch offices in France, Italy, Spain, Sweden and the United Kingdom providing design, manufacturing, marketing and sales.

http://www.toshiba.semicon-storage.com 

> Read More

MicroSys Electronics bases automotive gateway SoM on NXP S32G274A

Believed to be the first system on module (SoM) with NXP Semiconductor’s S32G274A processor.   

The miriac MPX-S32G274A SoM features 1GHz quad Arm Cortex-A53 cores with Arm Neon technology organised in two clusters for applications and services. For real-time tasks, there are also triple dual-core lockstep Arm Cortex-M7 cores for which MicroSys offers support for dedicated FreeRTOS implementations beside NXP’s standard automotive support. Clustered and operated in lockstep mode, this set of heterogenous cores can support ASIL-D applications or any other functional safety standard comparable to IEC 61508. The ASIL D safety and hardware security has more than 10 times the real-time performance and networking throughput of NXP’s previous automotive gateway devices, reports MicroSys Electronics.

The SoM integrates 4Gbyte of soldered LPDDR4 RAM at 3200Mtransfers per second, 16Gbyte eMMC non-volatile memory and 64Mbyte QuadSPI flash. External SD card storage can be multiplexed with the on-board eMMC.

The SoM offers an extensive range of generic and communication interfaces including four SerDes interfaces configurable as PCIe Gen3 2×1 or 2×2, four Gigabit Ethernet, 18x CAN FD bus, two FlexRay, and four LIN. There are also 14 GPIOs, 12 analogue inputs (ADC), three SPI, two UART, one USB and three I2C interfaces.

For trace and debug tasks, the SoM supports Aurora and JTAG interfaces. MicroSys also offers a board support package including bootloader configuration and all required Linux drivers.

The SoM offers multiple native CAN interfaces as well as comprehensive FlexRay, LIN and Ethernet support. Target markets are real-time connected vehicles, mobile machinery and automotive test and measurement equipment. It can also be used for data loggers, edge gateways and fail-safe programmable logic controllers (PLCs).

There is native support for 18 CAN interfaces, making the MicroSys SoM particularly suitable for developing comprehensive vehicle networks. The SoM is an alternative to using generic expansion buses to connect CAN controllers which can generate high interrupt loads on the main processor. The other alternative is to use FPGAs but these can be expensive, requiring additional development resources for FPGA programming.

The NXP S32G2 processor was developed specifically for vehicle networks and the MicroSys miriac MPX-S32G274A is the world’s first SoM to integrate the processor, says the company. “OEMs benefit from an application-ready building block for their connected real-time controllers in automotive and other functional safety applications. They also benefit from high computing performance, faster Ethernet and automotive connectivity including massive native CAN support, plus comprehensive functional safety and security features,” explains Ina Sophia Schindler, CEO of MicroSys Electronics.

MicroSys Electronics offers application-ready hardware and function-validated hardware-related software. It also offers customer-specific carrier boards and system level design services. These extend to SIL certification for any markets where functional safety standards analogue to IEC 61508 are required, including railway technology (EN 50155), aviation (DO-160), stationary and mobile machinery (ISO 13849), as well as manufacturing robots (ISO 10218), control systems (IEC 62061), and drive systems (IEC 61800‑5‑2). Approvals in the aviation context (DO-254/DO-160) are also greatly simplified by the existing manufacturer documentation.

https://microsys.de/

> Read More

STMicroelectronics claims first prize in race for G3-PLC hybrid comms chipset

The G3-PLC Hybrid specification is intended for seamless connectivity over powerline and wireless media. STMicroelectronics claims that its ST8500 and S2-LP chipset is the first to be certified according to the G3-PLC Hybrid communication standard.

The G3-PLC Hybrid specification allows smart-grid, smart-city, industrial, and IoT equipment to select the best available wireless or powerline channel at any time, automatically and dynamically, according to network conditions. As well as ensuring superior coverage, reliability, and scalability, it also allows cost-efficient system operation and enables new use cases, explains ST.

The hybrid chipset was introduced in 2020 and has completed the latest G3-PLC certification scheme, published in March 2021, which incorporates the Hybrid profile tests.

The certified chipset combines the ST8500 programmable multi-protocol powerline communication system on chip (SoC) and STLD1 line driver with ST’s S2-LP low-power sub-GHz radio transceiver.

Based on 6LowPAN and IPv6 and combining RF connectivity with the native G3-PLC protocol stack, the ST8500 SoC consumes less than 100mW in receive mode, in line with specifications to minimise the grid load imposed by new smart meters. It contains a high-performance DSP for real-time protocol processing and an Arm Cortex-M4F core for upper-layer processing and system management. Both the DSP and Arm core have their own code and data SRAM on-chip. Peripherals include an integrated 128/256-bit AES cryptographic engine. The analogue front end (AFE) for connecting to the STLD1 line driver is also integrated. The STLD1 communicates reliably, even across noisy power cables and with low impedance, with high drive capability and high linearity, says ST.

The S2-LP is a low power RF transceiver, intended for RF wireless applications in the sub-1GHz band. It is designed to operate in both the license-free ISM and SRD frequency bands at 433, 512, 868, and 920MHz, and can be programmed to operate at additional frequencies in the 413 to 479MHz, 452 to 27MHz, 826 to 958MHz, and 904 to1055MHz bands. The transceiver allows an RF-link budget greater than 140dB for long communication ranges and meets radio equipment regulations in territories worldwide including Europe, North America, China, and Japan. ST provides companion integrated balun/filter chips for the S2-LP that simplify antenna-connection circuitry and save PCB area in space-constrained applications.

The SoC’s programmability enables a software-defined implementation capable of supporting a broad portfolio of powerline protocol stacks, in worldwide frequency bands such as CENELEC and FCC, ST adds.

The ST8500 powerline communication SoC platform is used in smart metering, smart industrial and infrastructure applications. In addition to the chipset’s use in the smart grid market, ST’s hardware and firmware solution has been selected to power the official G3-PLC Alliance RF certification testing equipment.

The ST8500 SoC is packaged as a 7.0 x 7.0 x 1.0mm QFN56. The STLD1 and S2-LP are each packaged as 4.0 x 4.0 x 1.0mm QFN24. All devices are in full production.

https://www.st.com

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration