CML dives in to semiconductor microwave RF ICs at IMS2021

At next week’s Live IEEE International Microwave Symposium (IMS), CML will introduce its SuRF (Semiconductor Microwave RF) family.

The family is CML’s range of high frequency, high bandwidth RFICs and MMICs for RF and mmWave applications. Devices have been designed to help accelerate the design of RF products operating in the mmWave and GHz frequencies.

Among the devices that visitors will see are the CMX90A003 (1W) and CMX90A004 (2W) 860 to 960MHz power amplifiers. These two-stage, fully matched MMIC power amplifiers deliver +29.5dBm (CMX90A003) or +32.5dBm (CMX90A004) of saturated power. Both devices use GaAs HBT technology. The CMX90A003 can be used as a booster power amplifier in sub-1GHz applications to extend the range of low power RF transceivers. The CMX90A004 is optimised to operate as a high-power final stage PA in wireless ISM applications.

There will also be the CMX90G301 (+1dB) and CMX90G302 (+2 dB) 1.4 to 7.1GHz positive gain slope amplifiers, designed to compensate for frequency related gain loss. They are based on GaAS pHEMT and combine low DC power, low noise and high gain in a cascadable MMIC.

CML will also be offering visitors the chance to learn more about the recently introduced CMX940 low-power Frac-N RF synthesiser. The CMX940 addresses the demand coming from OEMs for a high-performance, highly configurable RF synthesiser that can operate from 49 to 2040 MHz. It is claimed to deliver best-in-class phase noise and low levels of spurious products due to a high level of integration, which includes a wideband voltage controlled oscillator (VCO).

Due to Covid-19 restrictions there will be no live demonstrations during the in-person event in Atlanta, GA. A video demonstration of the CMX940 will be available, and SµRF evaluation boards will be on display.

Live IEEE International Microwave Symposium (IMS) takes place in Atlanta, Georgia, USA, between 7th and 10th June. CML will be exhibiting at booth 1341.

http://www.cmlmicro.com

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Keil Studio Cloud accelerates IoT development says Arm

Two initiatives have been announced by Arm for embedded, IoT, ML, and MCU software developers. The Open-CMSIS-Pack project will deliver the infrastructure to integrate and manage software components and improve code reuse across projects, while Keil Studio Cloud provides a cloud-hosted platform with direct Git integration and modern CI workflows for rapid IoT device development.

Software compatibility for component re-use in the IoT presents a challenge as the IoT landscape is much more diverse at the hardware level compared to PCs or the data centre. In response, Arm offers the Common Microcontroller Software Interface Standard (CMSIS). This vendor-independent abstraction layer for microcontrollers, specifically for Arm Cortex-M processors, includes CMSIS-Pack, a packaging technology that supports nearly 9,000 different microcontrollers. It is designed to make project integration of drivers, middleware and other software components across multiple Arm-based devices much easier.

Arm is now moving parts of CMSIS into an open project called Open-CMSIS-Pack, which will deliver the infrastructure to integrate and manage software components and improve code reuse across projects. The Open-CMSIS-Pack project will begin its life as an incubation initiative under the Linaro IoT and Embedded Group, focusing on a standard for software component packaging and related foundation tools for validation, distribution, integration, management, and maintenance.

The initial focus of the Open-CMSIS-Pack project will be command-line tools and CMake workflows that enable the broader ecosystem to integrate CMSIS-Pack-based development flows. This project is the starting point for evolving the CMSIS-Pack technology into a true open standard for microcontroller software component packaging, targeting key interfaces for major IoT platforms and producing a framework that can be embraced across the ecosystem.

The second announcement is simplified cloud-based IoT development tools in Keil Studio Cloud. This is the first component of the next-generation Keil tool suite. This early access beta will allow developers to experience the Keil Studio workflow first hand with a limited set of supported development boards and features. The tool will evolve over several software releases, delivering a desktop and cloud experience that will provide developers with:

An integrated development environment runs in the browser and connects directly to boards on a desktop. There is no complicated tool installation, and example projects along with the related resources are always up to date so developers can have code running on a device within minutes, assures Arm.

Direct Git integration enables distributed teams, collaborative development, and modern CI workflows that leverage Arm modelling technology.

Flexible cloud-hosted development first introduced by the Mbed Online Compiler, with professional Keil capabilities such as CMSIS-Pack software components and run-control debug.

A portal for the broader software ecosystem to collaborate on, submit examples and share feedback will be available in a later release in 2021.

Combined with Keil MDK, Keil Studio will offer the best-in-class IoT, machine learning (ML) and embedded development environment even for the most demanding real-time and functional safety projects, says Arm.

https://www.keil.arm.com/

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1-Form-B photo relay offers 1.2A on-state current rating

Offered as an alternative to conventional mechanical relays, the TLP4590A is the latest photo relay from Toshiba Electronics Europe. It is supplied in a compact DIP6 package.

This 1-Form-B (normally closed) photo relay has an on-state current rating of 1.2A, which represents a 140 per cent improvement on the company’s previous-generation TLP4176A device. It has a 60V off-state output terminal voltage rating and enhanced sensitivity due to the low trigger LED current of 2mA (maximum) exhibited.

Applications for the photo relay includes those relating to building automation – including heating, ventilation, air conditioning and security systems, as well as fire alarms. It can also be used in industrial equipment, such as programmable logic controllers (PLCs), I/O interfaces and sensor control hardware. The 5,000V rms (minimum) isolation voltage makes the TLP4590A suitable for use where elevated levels of insulation performance are required. Operating range is -40 to +110 degrees C, enabling the photo relay to be used in harsh environments.    

Toshiba Electronics Europe is the European electronic components business of Toshiba Electronic Devices and Storage. TEE offers European consumers and businesses a variety of innovative hard disk drive (HDD) products, semiconductors for automotive, industrial, IoT, motion control, telecomms, networking, consumer and white goods. The company’s broad portfolio encompasses integrated wireless ICs, power semiconductors, microcontrollers, optical semiconductors, ASSPs and discrete devices ranging from diodes to logic ICs.

TEE has headquarters in Düsseldorf, Germany, with branch offices in France, Italy, Spain, Sweden and the United Kingdom providing design, manufacturing, marketing and sales.

http://www.toshiba.semicon-storage.com 

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MicroSys Electronics bases automotive gateway SoM on NXP S32G274A

Believed to be the first system on module (SoM) with NXP Semiconductor’s S32G274A processor.   

The miriac MPX-S32G274A SoM features 1GHz quad Arm Cortex-A53 cores with Arm Neon technology organised in two clusters for applications and services. For real-time tasks, there are also triple dual-core lockstep Arm Cortex-M7 cores for which MicroSys offers support for dedicated FreeRTOS implementations beside NXP’s standard automotive support. Clustered and operated in lockstep mode, this set of heterogenous cores can support ASIL-D applications or any other functional safety standard comparable to IEC 61508. The ASIL D safety and hardware security has more than 10 times the real-time performance and networking throughput of NXP’s previous automotive gateway devices, reports MicroSys Electronics.

The SoM integrates 4Gbyte of soldered LPDDR4 RAM at 3200Mtransfers per second, 16Gbyte eMMC non-volatile memory and 64Mbyte QuadSPI flash. External SD card storage can be multiplexed with the on-board eMMC.

The SoM offers an extensive range of generic and communication interfaces including four SerDes interfaces configurable as PCIe Gen3 2×1 or 2×2, four Gigabit Ethernet, 18x CAN FD bus, two FlexRay, and four LIN. There are also 14 GPIOs, 12 analogue inputs (ADC), three SPI, two UART, one USB and three I2C interfaces.

For trace and debug tasks, the SoM supports Aurora and JTAG interfaces. MicroSys also offers a board support package including bootloader configuration and all required Linux drivers.

The SoM offers multiple native CAN interfaces as well as comprehensive FlexRay, LIN and Ethernet support. Target markets are real-time connected vehicles, mobile machinery and automotive test and measurement equipment. It can also be used for data loggers, edge gateways and fail-safe programmable logic controllers (PLCs).

There is native support for 18 CAN interfaces, making the MicroSys SoM particularly suitable for developing comprehensive vehicle networks. The SoM is an alternative to using generic expansion buses to connect CAN controllers which can generate high interrupt loads on the main processor. The other alternative is to use FPGAs but these can be expensive, requiring additional development resources for FPGA programming.

The NXP S32G2 processor was developed specifically for vehicle networks and the MicroSys miriac MPX-S32G274A is the world’s first SoM to integrate the processor, says the company. “OEMs benefit from an application-ready building block for their connected real-time controllers in automotive and other functional safety applications. They also benefit from high computing performance, faster Ethernet and automotive connectivity including massive native CAN support, plus comprehensive functional safety and security features,” explains Ina Sophia Schindler, CEO of MicroSys Electronics.

MicroSys Electronics offers application-ready hardware and function-validated hardware-related software. It also offers customer-specific carrier boards and system level design services. These extend to SIL certification for any markets where functional safety standards analogue to IEC 61508 are required, including railway technology (EN 50155), aviation (DO-160), stationary and mobile machinery (ISO 13849), as well as manufacturing robots (ISO 10218), control systems (IEC 62061), and drive systems (IEC 61800‑5‑2). Approvals in the aviation context (DO-254/DO-160) are also greatly simplified by the existing manufacturer documentation.

https://microsys.de/

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