Infineon unveils in-cabin monitoring systems for safe vehicles and roads

Radar sensors and microcontrollers from Infineon enable short range automotive applications in in-cabin monitoring systems (ICMS) which is reshaping passenger safety, says Infineon.

The Xensiv 60GHz BGT60ATR24C AEC-Q100 radar sensors, Aurix microcontrollers and Optireg power management ICs (PMICs) contribute to ultra-wideband (UWB), low power and cost-performance scalable architecture for ICMS sub-systems. The devices support the use of new signal processing techniques which are robust but also balance computational costs, the degree of information as well as the power consumption of the system, claims Infineon.

The Xensiv BGT60ATR24C radar sensor is a cognitive sensing device with multiple transmit/receive for virtual array configurations. There is also an agile modulation generation mechanism, automatic power mode configurability and simplified interfaces between RF and the processing side.

The Aurix TC3xx MCU family integrates a fast radar signal processing unit and enhanced security with the second-generation of the hardware security module (HSM). This includes asymmetric cryptography accelerators and full EVITA support. (The EVITA project is an EU project to design, verify and prototype suitable architectures for secure automotive on-board networks.)

Infineon has partnered with bisening, a South Korean imaging radar technology start-up, and Caaresys, an Israeli start-up to accelerate the development cycle using Infineon’s 60GHz automotive portfolio.

For example, bitsensing’s 60GHz MOD620 is enabled by advanced signal processing techniques using Infineon’s chipset. The pairing “offers a new level of confidence in safety for the automotive industry that demands excellence, reliability and unmatched intelligence,” said Dr. Jae-Eun Lee, bitsensing’s CEO.

Partner Caaresy has used Infineon’s Xensiv 24GHz and 60HHz radar sensors and Aurix MCUs in its CabinCare and BabyCare radar-based systems. It uses algorithms and radar signal processing to create aesthetic and contactless vital sign monitoring in automotives, explained CEO, Ilya Sloushch.

http://www.infineon.com

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700V buck regulators have low power consumption for smart home sensing

700V buck regulators in the RAA2230XX family are claimed to deliver superior power consumption, noise and EMI suppression, as well as reduced overall system cost compared with competing alternatives. The devices can be used in a range of applications, including home appliances, sensing systems such as smoke alarms and gas sensors, white goods, power meters and industrial controls.

The RAA2230XX buck regulators consume only 10 to 30mW when idle, helping system designers meet standby power regulations. A switching algorithm minimises electromagnetic interference (EMI) and eliminates audible noise, such as ‘humming’ or ‘whining’, says Renesas. The regulators also can supply as low as 3.3V output, enabling designers to eliminate a second-stage low dropout regulator (LDO), saving bill of materials (BoM) cost and board space.

The buck regulators connect to the AC line to power Renesas MCUs, sensors and other digital ICs. Renesas has developed Winning Combinations, consisting of complementary analogue, power, timing devices and embedded processing, simplifying the design process. There is, for example the household smoke detector with a turnkey architecture for a residential smoke alarm, which is suitable for smart industrial control terminals.

The RAA2230XX buck regulators are available in TSOT23-5, SOIC-8 and SOIC-7 package options. They are pin-to-pin compatible with competitors’ products for easy replacement

The new 700V RAA2230XX buck regulators (2.0, 4.0 and 8.0W versions) are available today. Renesas also offers evaluations boards for different package and output combinations.

Renesas Electronics delivers embedded design with microcontrollers, analogue, power, and SoC products for a broad range of automotive, industrial, infrastructure, and IoT applications.

http://www.renesas.com

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Ultra-wideband platform IP makes waves for mobile and consumer designs

Entry barriers for ultra-wideband (UWB) IP in mobile, automotive, consumer and IoT applications are lowered with the RivieraWaves UWB IP claims CEVA. It can be combined with Bluetooth-UWB IP to target new use cases using both standards in emerging high-volume applications, says the company.

The RivieraWaves UWB platform IP delivers secure, centimeter-level accuracy and robust location information through time-of-flight (ToF) ranging and angle-of-arrival (AoA) processing. The MAC and PHY IP complies with the IEEE 802.15.4z standard to support enhanced ranging and security based on IEEE 802.15.4z HRP in accordance with the FiRa Consortium requirements

It is suitable for a range of low power applications and products such as tags for pinpoint asset finding, secure digital key functionality for door locks, real-time location services (RTLS) and payment systems.

Aimed at lowering the entry barrier and accelerating time-to-market for semiconductor and IoT companies looking to develop UWB-enabled devices, the RivieraWaves UWB platform IP consists of a power-optimised hardware PHY and a flexible, low latency hardware and software MAC layer. The MAC layer software can be implemented on the CEVA-BX1 DSP when deployed in combination with other connectivity workloads or modes such as direction finding, localisation or radar, or as a standalone UWB MAC on commercial Arm and RISC-V MCUs.

A flexible radio interface enables the IP to be deployed with customers’ own RF technology or with CEVA partners’ RF IP.

The RivieraWaves UWB is available for licensing now.

CEVA licenses wireless connectivity and smart sensing technologies for a smarter, safer, connected world. It provides digital signal processors (DSPs), AI engines, wireless platforms, cryptography cores and complementary software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence. The company also offers Intrinsix turnkey chip design services, helping customers address complex and time-critical IC design projects. Its technologies and chip design skills are used by semiconductor, system companies and OEMs to create power-efficient, intelligent, secure and connected devices for the mobile, consumer, automotive, robotics, industrial, aerospace and defence markets and the IoT.

https://www.ceva-dsp.com

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An FPGA EDA tool suite based on machine learning (ML) optimisation algorithms has been launched by Xilinx.

The Vivado ML Editions deliver compile time that is five times faster than current Vivado HLx Editions. It also improves “breakthrough quality of results (QoR) improvements” of, on average, 10 per cent on complex designs, says Xilinx.

Vivado ML Editions also has team-based design flows, for significant design time and cost savings.

Vivado ML Editions accelerate design closure with ML-based logic optimisation, delay estimation and intelligent design runs, which automates strategies to reduce timing closure iterations.

According to Robert Atkinson, principal hardware engineer, National Instruments: “By offering a push-button method for aggressively improving timing results, [Vivado ML Editions] generates QoR suggestions that bring maximum impact and deliver expert quality results with a reduction in user analysis – especially for tough to close designs.”

Xilinx is also introducing the concept of an Abstract Shell, which allows users to define multiple modules within the system to be compiled incrementally and in parallel. This enables an average compile time reduction of five to 17 times, compared to traditional full system compilation, claims Xilinx. Abstract Shell also helps protect a customer’s IP by hiding the design details outside of the modules, critical for applications like FPGA-as-a-Service and value-added system integrators.

Vivado ML Editions also improves collaborative design with Vivado IP Integrator, which enables modular design using the new “block design container” feature. This capability promotes a team-based design methodology and allows a team to divide a project for multi-site, simultaneous co-operation.

Adaptability features like Dynamic Function eXchange (DFX) enable more efficient use of silicon resources by loading custom hardware accelerators, dynamically at runtime over-the-air. DFX can load design modules in a few milliseconds, which opens up new use cases such as a car swapping different vision algorithms during processing of a frame, or a genomic analysis swapping different algorithms in real-time as it sequences DNA.

Vivado ML Editions is available now in a Standard Edition at no charge and an Enterprise Edition starting at $2,995 MSRP.

http://www.xilinx.com/vivado-ml

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