Renesas adds new MCU groups to RA8 series with 1GHz performance and embedded MRAM

Renesas has introduced the RA8M2 and RA8D2 microcontroller (MCU) groups. Based on a 1 GHz Arm Cortex-M85 processor with an optional 250 MHz Arm Cortex-M33 processor, the new MCUs are the latest Renesas offerings to deliver an unmatched 7300 Coremarks of raw compute performance, the industry benchmark for MCUs. The optional Cortex-M33 processor enables efficient system partitioning and task segregation.

Both RA8D2 and RA8M2 devices are ultra-high performance MCUs as part of the second generation of the RA8 Series – the RA8M2 are general-purpose devices, and the RA8D2 MCUs are packed with a variety of high-end graphics peripherals. They are built on the same high-speed, low-power 22-nm ULL process used for the RA8P1 and RA8T2 devices introduced earlier this year. The devices include single and dual core options, and a specialised feature set to address the needs of a broad base of compute intensive applications. They take advantage of the high performance of the Arm Cortex-M85 processor and Arm’s Helium technology to offer a significant performance boost for digital signal processor (DSP) and machine learning (ML) implementations.

The RA8M2 and RA8D2 devices offer embedded MRAM that has several advantages over Flash technology – high endurance & data retention, faster writes, no erase needed, and byte addressable with lower leakage and manufacturing costs. SIP options with 4 or 8 MB of external flash in a single package are also available for more demanding applications. Both the RA8M2 and RA8D2 MCUs include Gigabit Ethernet interfaces and a 2-port TSN switch to address industrial networking use cases.

Both of the MCU Groups provide a combination of the performance of the Cortex-M85 core, together with large memory and a rich peripheral set, making them particularly suitable for a wide range of IoT and industrial use cases. The lower power CM33 core can act as a housekeeping MCU, executing system tasks while the high performance CM85 core stays in sleep mode, to be woken up only as needed for high compute tasks, thus lowering the system power consumption.

The new RA8M2 and RA8D2 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS (FreeRTOS and Azure RTOS) with FSP, thus providing full flexibility in application development. In addition, Zephyr support is now included. Using the FSP will ease migration of existing designs to the new RA8 Series devices.

www.renesas.com/RA8M2

www.renesas.com/RA8D2

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Microchip adds single-chip wireless platform designed for advanced connectivity

Microchip has released the highly integrated PIC32-BZ6 MCU that serves as a common, single-chip platform to reduce development cost, complexity and time-to-market for multi-protocol products featuring advanced connectivity and scalability.

RF design for smart devices has become increasingly complex, and wireless solutions typically require multiple chips to add new features or frequent redesigns to support evolving industry standards. The PIC32-BZ6 MCU replaces these multi-chip solutions and reduces the redesign burden with a single, highly integrated chip that removes the complexity of multi-protocol wired and wireless connectivity. The MCU also includes analog peripherals to simplify motor control development, along with touch and graphics capabilities for advanced user interfaces and enhanced memory to support complex applications, heavy workloads and Over the Air (OTA) firmware updates.

The PIC32-BZ6 MCU platform streamlines development of products in the smart home and for automotive connectivity, industrial automation and wireless motor control use cases. Key features include:

• High memory and scalable package choices to support demanding applications and OTA updates: The high-performance MCU includes 2 MB Flash memory and 512 KB RAM and is available in 132-pin ICs and modules with additional pin and package variants planned.
• Multi-protocol wireless networking: Qualified against Bluetooth Core Specification 6.0, the device also supports 802.15.4-based protocols such as Thread and Matter plus proprietary smart-home mesh networking protocols.
• Design flexibility that extends product options and scaling opportunities: Versatile and comprehensive selection of on-chip peripherals goes beyond wireless connectivity and OTA updates to support:
o Wired connectivity: Multiple interfaces include two CAN-FD ports for automotive and industrial communication, a 10/100 Mbps Ethernet MAC for high-speed wired connectivity and a USB 2.0 full-speed transceiver for seamless data transfer and PC integration.
o Touch and graphics: Incorporates peripherals that enable advanced user interfaces including Capacitive Voltage Divider (CVD)-based touch capabilities with up to 18 channels.
o Motor control: Simplifies system development through advanced analog peripherals such as 12-bit ADCs, 7-bit DAC, analog comparators, PWMs and QEI for precise motor position and speed control.
• Security by design to protect applications and IP: Includes immutable secure boot in ROM and an advanced on-board hardware-based security engine supporting AES, SHA, ECC and TRNG encryption.
• Reliability in harsh environments: The device is qualified to AEC-Q100 Grade 1 (125 °C) specifications for automotive and industrial environments.

Development Tools
Microchip simplifies development and product certification for the PIC32-BZ6 MCU by offering proven chip-down reference designs and wireless design check services, helping to minimise design risk. To further ease regulatory compliance, pre-certified modules are available in multiple regions worldwide. The PIC32-BZ6 MCU family is supported by the PIC32-BZ6 Curiosity Board that enables testing of all MCU I/Os, connectivity and peripheral features. Developers also benefit from a comprehensive development environment through Microchip’s MPLAB® Integrated Development Environment (IDE) and the Zephyr® Real Time Operating System (RTOS).

microchip.com

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ST introduces new image sensors for automation, security and retail applications

ST has introduced a new family of 5MP CMOS image sensors: VD1943, VB1943, VD5943, and VB5943. These advanced ST BrightSense sensors are designed to accelerate the development of innovative vision applications across industries, including advanced industrial automation with enhanced machine and robotic vision, next-generation security including biometric identification and traffic management, and smart retail applications such as inventory management and automated checkout.

“Our new image sensors with hybrid global and rolling shutter modes allow our customers to optimise image capture, ensuring motion-artifact-free video capture and low-noise, high-detail imaging at the same time, making it ideal for high-speed automated manufacturing processes and object tracking. This architecture is unique on market today and provides unmatched flexibility, performance, and integration. We continue to broaden our portfolio of solutions for a wide range of industrial applications and want to bring the best of optical sensing technologies to both existing and new applications,” said Alexandre Balmefrezol, Executive Vice President and General Manager of STMicroelectronics’s Imaging Sub-Group.

The new sensors are ready for evaluation and sampling, with mass production scheduled to begin in February 2026.

The sensors provide hybrid global and rolling shutter modes, allowing developers to optimise image capture for specific application requirements. This functionality ensures motion-artifact-free video capture (global shutter) and low-noise, high-detail imaging (rolling shutter), making it ideal for high-speed object tracking and automated manufacturing processes.

Using 2.25 µm pixel technology and advanced 3D stacking, the sensors deliver high image quality in a smaller footprint. The die size is 5.76 mm by 4.46 mm, with a package size of 10.3 mm by 8.9 mm, and a 73%-pixel array-to-die surface ratio. This compact design enables integration into space-constrained embedded vision systems without compromising performance.

The RGB-IR variants of the sensors feature on-chip RGB-IR separation, eliminating the need for additional components and simplifying system design. This capability supports multiple output patterns, including 5MP RGB-NIR 4×4, 5MP RGB Bayer, 1.27MP NIR subsampling, and 5MP NIR smart upscale, with independent exposure times and instant output pattern switching. This integration reduces costs while maintaining full 5MP resolution for both colour and infrared imaging.

The sensors incorporate backside illumination (BSI) and capacitive deep trench isolation (CDTI) pixel technologies to enhance sensitivity and sharpness, particularly in low lighting conditions. Single-frame on-chip HDR improves detail visibility across bright and dark areas. These features enable high-quality imaging in challenging environments and support advanced machine vision and edge AI applications.

https://www.st.com

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Arduino UNO Q now available from from Mouser

The UNO Q features “dual brain” architecture, with a Linux Debian-capable Qualcomm Dragonwing QRB2210 microprocessor paired with a real-time STM32U585 microcontroller from STMicroelectronics. With integrated AI acceleration, efficient performance, and camera, display, and audio support, the QRB2210 microprocessor is built for next-gen robotics and IoT products. Containing the quad-core 2.0 GHz CPU, Adreno GPU, and 2x ISP, the UNO Q is a compact, cost-effective platform with advanced features like machine vision.

The ABX00162 UNO Q features 2 GB RAM and 16 GB onboard eMMC storage. The pre-loaded Arduino App Lab offers developers an open-source platform designed to rapidly ideate, prototype, and scale AI-powered solutions to production. Seamless integration of Arduino App Lab with the Edge Impulse platform also helps streamline and accelerate the process of building, fine-tuning, and optimising AI models using real-world data for a wide range of capabilities, such as object/human detection, anomaly detection, image classification, ambient sound recognition, and keyword spotting.

The UNO Q includes a pre-installed wireless module, providing dual-band Wi-Fi 5 (2.4/5 GHz) and Bluetooth 5.1 for wireless connectivity. Classic UNO headers, high-speed bottom headers, and a Qwiic I2C connector enable easy expansion. The SBC also features an onboard USB-Type C® connector with power delivery input and video output and an 8 × 13 LED matrix for visual creation and feedback.

www.mouser.com

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