PMIC complements RZ/G2L and V2L processors for AI

A power management integrated circuit (PMIC) optimised to complement Renesas’ RZ / V2L and RZ / G2L microprocessors, the RAA215300 has nine channels, a built-in charger and a real-time clock. Integrating the PMIC reduces design complexity and accelerates time-to-market, says Renesas.

The RAA215300 includes six buck regulators, three LDOs and a coin cell / supercap charger. It supports DDR4, DDR4L, DDR3 and DDR3L memory with dedicated VREF, VTT and VPP rails. It enables four-layer PCBs to reduce costs and the high level of integration also increases system reliability as fewer system components are needed on the board, said Renesas.

It has a built-in power sequencer and support for external DC/DC regulator on/off controls. It supports multiple DDR memories, multiple processors and SoCs, added Renesas. It also features spectrum spread to reduce EMI for RF applications.

Operating temperature range is -40 to +105 degrees C, suitable for industrial applications.

The RAA215300 pairs with the RZ / G2L, RZ / V2L and other Renesas devices, such as power controllers, a USB Power Delivery controller and a clock, for a scalable SMARC system on module with AI design as part of Renesas’ Winning Combinations collection of complementary analogue, power, timing devices and embedded processing to simplify the design process.

Sample shipments of the RAA215300 are available now, and mass production is scheduled to begin in Q1 2022.

https://www.renesas.com 

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COMs set bandwidth benchmark for IoT and edge computing

Claiming to set a new benchmark of up to 20 PCIe Gen 4.0 lanes, the conga-HPC/cTLH COM-HPC Client Size B modules (120 x 120mm) and conga-TS570 COM Express Basic Type 6 modules (125 x 95mm) will be available from congatec. They will be based on scalable 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors, with selected variants for extreme temperatures ranging from -40 to +85 degrees C.

The modules target the most demanding IoT gateway and edge computing applications, says congatec. They are built on Intel’s 10nm SuperFin technology in a two-package design with dedicated CPU and platform controller hub (PCH) to set the  new bandwidth benchmark of up to 20 PCIe Gen 4.0 lanes for massive connected real-time IIoT gateway and intelligent edge computing workloads.

To process enormous workloads, the modules have up to 128Gbyte DDR4 SO‑DIMM RAM, integrated AI accelerators and up to eight high performance CPU cores that achieve up to 65 per cent gain in multi-thread performance and up to 32 per cent gain in single-thread performance. Visualisation, auditory and graphics intensive workloads are boosted up to 70 per cent compared to predecessors, says congatec, to enhance immersive experiences. Coupled with support for 8K HDR videos for diagnostic, the modules can be used in surgery, medical imaging and e-health edge applications. Combined with the platform’s AI capabilities and the comprehensive Intel OpenVINO toolkit, doctors can gain easy access and insights into deep learning based diagnostic data, advised congatec.

The integrated Intel UHD graphics supports up to four 4K displays in parallel. It can process and analyse up to 40 HD 1080p/30 frames per second video streams in parallel for 360 degree views in all directions. AI infused massive vision capabilities will find applications in factory automation, machine vision for quality inspection in manufacturing, safe spaces and cities, as well as collaborative robotics and autonomous vehicles in logistics, agriculture, construction and public transport.

Both form factors support up to 128Gbyte DDR4 SO-DIMM memory with 3200 Mtransfers per second and optional error code correction (ECC). To connect peripherals with massive bandwidth the COM-HPC modules support 20 PCIe Gen 4 lanes (x16 and x4), and the COM Express versions support 16 PCIe lanes. Designers can leverage 20 PCIe Gen 3 lanes with COM-HPC, and eight PCIe Gen 3 lanes on COM Express.

To support ultra-fast NVMe SSD, the COM-HPC module provides 1x PCIe x4 interface to the carrier board. The COM Express board has NVMe SSD onboard to use all native Gen 4 lanes supported by the new processor. Storage media can be connected via 2x SATA Gen 3 on COM-HPC, and 4x SATA on COM Express.

The COM-HPC module offers latest 2x USB 4.0, 2x USB 3.2 Gen 2, and 8x USB 2.0 and the COM Express module offers 4x USB 3.2 Gen 2 and 8x USB 2.0 in compliance to the PICMG specification. For networking, the COM-HPC module offers two 2.5 GbE and the COM Express module executes one GbE.

Sound is provided via I2S and SoundWire in the COM-HPC version, and HDA on the COM Express modules.AI and deep learning inference algorithms can seamlessly run either massively parallel on the integrated GPU, or on the CPU with built-in Intel Deep Learning Boost that combines three instructions into one, accelerating inference processing and situational awareness.

The COM-HPC Client and COM Express Type 6 platforms have integrated safety functions for the fail-safe operation of many mobile vehicles and robots and stationary machinery. Real-time support is provided by RTOSes such as Real Time Linux and Wind River VxWorks with native support from Real-Time Systems’ hypervisor technology, which is also officially supported by Intel.

Further real-time capabilities include Intel Time Coordinated Computing (Intel TCC) and Time Sensitive Networking (TSN) for real-time connected IIoT/industry 4.0 gateways and edge computing devices.

https://www.congatec.com

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1700V SiC Schottky barrier diodes protect data centres and building automation

Silicon carbide (SiC) diodes from Littelfuse have been increased to include 1,700V models. The LSIC2SD170Bxx series SiC Schottky diodes are available in the TO-247-2L package and with a choice of 10, 25 or 50A current ratings.

The SiC diodes offer power electronics system designers performance advantages, including close-to-zero reverse recovery current, high surge capability, and a maximum operating junction temperature of 175 degrees C, said Littelfuse.

They can be used where enhanced efficiency, reliability, and simplified thermal management are required and the fast and low loss switching makes them suitable for data centres, building automation and other high power electronics applications, said the company.

SiC Schottky barrier diodes are suitable for a wide range of AC/DC and DC/DC power converters used in industry, energy generation, and energy distribution / storage. Typical examples include industrial switch mode power supplies, uninterruptable power supplies, battery chargers, solar inverters, industrial motor drives and high speed rectifiers.

“SiC diodes in power designs instead of diodes based on legacy silicon-based technology . . . enable the design of faster switching power electronics in the converters which can then be made more compact at the same output power or pack more power in the same volume,” said Francois Perraud, product marketing manager, SiC Products at Littelfuse.

The LSIC2SD170Bxx SiC Schottky diodes offer positive temperature co-efficient of the forward voltage for safe operation and ease of paralleling, fast, temperature-independent switching and dramatically reduced switching losses compared to silicon bipolar diodes, summarised Littelfuse.

The LSIC2SD170Bxx SiC Schottky diodes are available in the TO-247-2L package. Sample requests can be placed through authorised Littelfuse distributors worldwide.

http://www.Littelfuse.com

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COM Express module is based on Intel Core, Xeon and Celeron 6000 processors

Claimed to be the first COM Express Type 6 module to support PCI Express Gen 4 x16, the Express-TL effectively doubles the bandwidth of previous COM Express modules, says Adlink.

The Express-TL module with 11th Generation Intel processors is designed rugged operating temperatures, across the -40 to +85 degrees C range in embedded and industrial applications. It can operate 24/7 in industrial settings with 10-year availability, adds the company.

In addition to Intel Core, Xeon W and Celeron 6000 processors and octa-core performance, the module has Intel UHD Graphics and Intel AVX-512 VNNI to provide artificial intelligence (AI) inferencing. The Express-TL can be used for demanding applications such as image processing and analysis, high speed video encoding and streaming, medical ultrasound and predictive traffic analysis.

The Intel UHD Graphics core supports four 4K independent displays, including high definition multimedia interface (HDMI), DisplayPort (DP), LVDS, embedded DisplayPort (eDP) and legacy VGA displays.

The Express-TL module provides 2.5Gbit Ethernet and four USB 3.2 Gen 2 ports, allowing transfer rates above 10Gbits per second.

Intel Time Coordinated Computing (TCC), combined with time-sensitive networking (TSN) Ethernet controller is used in industry 4.0 applications for intelligent, agile and increasingly autonomous operation.

Adlink reports an additional eight degrees C at 25W TDP with ECC memory feature and on-board NVMe storage make the Express-TL module suitable for space constrained applications

AI, machine learning and IoT devices increase demand for real-time processing from the edge to the cloud. The Express-TL module offers advanced tuning controls, immersive graphics, and connectivity for AI, workload consolidation, and other intensive computing demands, added the company.

The Express-TL COM Express Type 6 module helps shorten development cycles and reduce costs, with vibration resistance, wide operating temperature range and reliable system performance.

Adlink plays a role in developing open standards such as the COM Express specification. Adlink has held leadership positions in the PCI Industrial Computer Manufacturers Group (PICMG) which is responsible for many widely accepted standard form factors in the embedded industry.

Adlink Technology manufactures edge hardware and develops edge software for embedded, distributed and intelligent computing ranging from powering medical PCs in the intensive care unit to building the world’s first high-speed autonomous race car.

Adlink contributes to open source, robotics, autonomous, IoT and 5G standards initiatives across more than 24 consortia, driving innovation in manufacturing, telecommunications, healthcare, energy, defence, transportation and infotainment.

http://www.adlinktech.com

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