ST and Rosenberger unite to develop high-speed contactless connector based on 60GHz wireless technology

STMicroelectronics and Rosenberger, a leading manufacturer of impedance-controlled and optical connectivity solutions, are to collaborate on a contactless connector for ultra-reliable, short-range, point-to-point full-duplex data exchanges in industrial and medical applications.

Rosenberger’s RoProxCon, leverages ST’s 60GHz RF transceiver, the ST60A2, to deliver high-speed data transmission while providing immunity to movement, vibration, rotation and contaminants such as moisture and dust, which can disrupt conventional pin-and-receptacle interconnects.

The STMicroelectronics ST60A2 offers reliable, point-to-point, high-data-rate transmission of up to 6.25 Gbps over distances of a few centimetres at low power. The new connector will suit applications in smart factories, medical technology, connected devices, office equipment, conveyer technology and renewable energies.

Operating over an extended temperature range of -40 to +105 degrees C, the chip ST60A2 is suited to industrial markets. With a 2.2 x 2.2 mm package footprint, the chip offers an ultra-low power consumption of 70mW for a reliable, completely contactless link.

“Pairing ST’s contactless connectivity technology with our interconnect expertise and antenna-design knowledge enabled us to create a first-of-its-kind module that transmits full duplex data at up to 6 Gbps with complete rotational freedom,” said Folke Michelmann, executive vice-president medical and industries at Rosenberger.

“In working with ST, we see limitless application possibilities for our connector, which provides high-reliability and high-throughput at low power.”

STMicroelectronics RF&Communications division general manager Laurent Malier said: “We developed the ST60A2 contactless transceiver to allow customers to create reliable, high data-rate, extremely power-efficient wireless links. Rosenberger’s expertise in interconnects combined with our RF chip is an outstanding example of the value of the technology.”

“Customers across the full range of electronics applications have expressed interest in this transceiver and several have shared their need for a module that includes the antenna.”

Rosenberger’s portfolio includes solutions in high-frequency, high-voltage, and fibre optic technology for mobile communication networks, data centres, test and measurement applications, automotive electronics as well as for high-voltage contact systems, medical electronics an aerospace engineering.

As independent device manufacturer, STMicroelectronics works with more than 100,000 customers and thousands of partners to design and build products, solutions and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world.

For more information go to http://www.rosenberger.com and http://www.st.com

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R&S FSPN offers dedicated phase noise analysis and VCO testing

For high speed, real-time phase noise measurements using sources that require high stability in demanding applications, the new R&S FSPN phase noise analyser and VCO from Rohde & Schwarz offers sensitivity, accuracy and reliability.

Rohde & Schwarz designed the new R&S FSPN phase noise analyser and VCO tester for production and design engineers who characterise sources such as synthesizers, VCOs, OCXOs, and DROs. Providing high sensitivity and measurement speed, the R&S FSPN suits demanding phase noise and VCO analysis in development and production.

The R&S FSPN comes in two models, one covers the frequency range from 1 MHz to 8 GHz and the other from1 MHz to 26.5 GHz, addressing radar and satellite applications in the C band, X band, Ku band, and the complete K band.

Catering to measurement challenges in these fields, the R&S FSPN expands the Rohde & Schwarz phase noise product portfolio which already contains the R&S FSWP phase noise spectrum and signal analyser.

The R&S FSPN shares R&S FSWP features such as low noise internal local oscillators coupled with real-time cross correlation engines for increased measurement sensitivity.

Cross-correlation sensitivity gains can be viewed in real-time in result traces, allowing users to adjust the trade-off between measurement speed and sensitivity to meet their application requirements.

Users in production need just a few correlations to measure high-quality oscillators, synthesizers or VCOs with high throughput. By increasing the number of correlations, users in research and development can characterise the most sensitive commercially available synthesisers and oscillators. Simultaneous device frequency and phase settling times can be measured with up to 8 GHz of real-time analysis bandwidth.

To investigate oscillator long-term frequency stability, the R&S FSPN calculates the Allan variance in the time domain at fixed intervals and uses phase noise measurements to apply cross-correlations and suppress spurs.

The analyser is also equipped with three ultra-low-noise DC sources to supply and sweep VCOs. The built-in VCO characterisation measurement mode analyses VCO characteristics such as frequency, sensitivity, RF power or current draw versus tuning voltage.

For more information go to https://www.rohde-schwarz.com/product/fspn

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OKW boosts enclosure range with larger sizes

OKW has added four sizes to its EasyTec range of fast-mount flanged enclosures. The new larger sizes suit more complex applications that require extra installation volume, such as IT network technology and smart factory sensor equipment.

These flanged enclosures are said to offer good stability. The flat base has a curved recess for secure pole mounting. Integrated mounting lugs feature apertures for cable ties and holes for panhead screws and there is a soft contoured top.

Internal screw pillars in the top and base enable EasyTec to accommodate two PCBs. Tamperproof stainless steel Torx assembly screws suit the housings to medical electronics.

EasyTec can be mounted quickly and easily on poles or flat surfaces in challenging industrial environments – either indoors or outdoors. Applications include IoT/IIoT, sensor systems, security and monitoring, stock control, environmental, medical and laboratory technology.

The enclosures come in four plan sizes, the original 80 and 100 and now 125 and150. Each plan size comes in two heights, giving a range of eight sizes from 101 x 50 x 22 mm to 172 x 93 x 46 mm. The enclosures are moulded from tough and UV-stable ASA+PC-FR (UL 94 V-0) in off-white (RAL 9002) as standard.

Prices start at £16. Accessories include IP 65 seals, 2.5 x 6 mm self-tapping screws (PZ1 and Torx T8) and a Torx T8 screwdriver.

Customising options include CNC machining, lacquering, printing/laser marking of legends and logos, EMC shielding, installation and assembly.

For more information go to https://www.okw.co.uk/en/Plastic-enclosures/Easytec.htm

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EasyPack 2B EDT2 power module for traction inverters up to 50 kW

Infineon Technologies has launched the automotive qualified EasyPack 2B EDT2, a flexible and scalable half-bridge power module. Depending on inverter conditions, this 750 V device can reach a maximum power of up to 50 kW and 230 A RMS. The module is optimised for inverter applications in hybrid and electric vehicles.

With the introduction of the EDT2 (electric drive train) technology in this package and full automotive qualification, Infineon is now expanding the application range of the module family to include traction inverters.

The key feature of the EDT2 technology is the higher efficiency at low-load conditions. An EDT2 chip helps ensure significantly lower losses than current products on the market, says Infineon, and outperforms Infineon’s previous chip generation by 20 per cent.

Plug-and-play simplifies integration and compared to the classic through-hole discrete packages, as well as the  HybridPack 1, there Is no longer a need to solder pins.

Infineon’s PressFIT contact technology enables a reduction in mounting time and the compact package size means three EasyPack 2Bs need 30 per cent less surface area than a HybridPack 1.

The EasyPack 2B EDT2 is fully qualified to the AQG324 standard.

Over the past 10 years, Infineon has sold more than 50 million EasyPack module with various chip sets for a range of industrial and automotive applications.

The new EasyPack 2B EDT2 module FF300R08W2P2_B11A will be available starting in this month.

For more information go to http://www.infineon.com/easyinverter

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