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SOM-5883 COM is engineered for graphics performance

Wed, Sep 01, 2021

Equipped with 11th Generation Intel Core processors, the SOM-5883 computer on module (COM) is designed by Advantech for high-performance edge computing applications.

It is a COM Express Basic Type6 Module and offers octa-core computing performance under thermal dynamic performance (TDP) 45W. It also has Intel Iris Xe graphics and an Edge AI Suite software toolkit, which make the COM suitable for medical imaging and AI applications.

To resolve the heavy workload of image processing applications, SOM-5883 has the capability to support up to 128Gbyte DDR4 3200 SODIMM, with high capacity and high frequency memory technology. The COM includes high speed I/O interfaces including PCIe Gen4 and USB3.2 Gen2 (10Gbits per second) and 2.5Gbase-T for enhanced system expansion. There is also optional NVMe SSD and TPM2.0 onboard design. Other features are -40 to +85 degrees C operating temperature and 8.5 to 20V power input. As a result, says Advantech, the SOM-5883 is reliable and secure for edge computing requirements.

The SOM-5883 offers a 1.7X computing performance growth and 1.5X 3D graphics upgrade. Advantech provides Edge AI Suite containing Intel Open VINO and more than a hundred AI models.

There are four independent displays up to 4K over three DisplayPort 1.4 / HDMI 2.1, optional eDP or LVDS, and VGAl, and the COM is configurable up to two ports 8K HDR outputs. Graphics-driven applications such as ultrasound can achieve much more accurate diagnosis with the combination of native graphics engine and external expansion for system configuration, said Advantech. At the same time, SOM-5883 supports multiple cutting-edge I/O technologies. It enables high speed data transmission with improved bandwidth of 2.5G LAN and an NVMe SSD onboard, with the capability to transfer huge data between AIoT applications. The 2.5G LAN equipped with time sensitive networking (TSN) is suitable for automation or edge applications requiring low-latency. This technology fulfils the demand of real-time traffic, prioritising critical data in the communication process, such as transferring command, actions or safety information on time, said the company. It also supplies extraordinary USB4, which can be configured as DisplayPort, Thunderbolt, USB 3.2, and USB 2.0 in a slim USB-Type-C connector. Advantech also offers USB4 reference design documents and SOM-MZ10 development board, to help partners accelerate the implementation of new I/O technology.

Advantech’s QFCS (Quadra flow cooling system) thermal technology enables the SOM-5883 to release 100 per cent CPU power. The technology is not only efficient in heat dissipation but also thin, quiet and light, sufficiently so to be integrated into a 1U height slim chassis, added Advantech.

The SOM-5883 features error code correction (ECC) memory, TPM2.0 chip onboard to prevent cyber-threats, and also supports BIOS storage protection, security boot, BIOS power-management, plus WISE-DeviceOn for remote hardware monitoring and over-the-air (OTA) software update to prevent system malfunction.

http://www.advantech.eu

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Single-chip GaN gate driver accelerates automation, says STMicroelectronics

Wed, Sep 01, 2021

STMicroelectronics’ STDRIVEG600 half-bridge gate driver has high current output and 45ns propagation delay, closely matched between high-side and low-side outputs, in order to handle high frequency switching of GaN enhancement-mode FETs.

The driver can also be used for driving N-channel silicon MOSFETs at up to 20V, and allows up to 6V gate source voltage (VGS) to be applied on GaN devices to ensure low Rds(on). The driver also has an integrated bootstrap circuit that helps minimise the bill of materials (BoM) and to simplify board layout, claims STMicro. The bootstrap circuit uses a synchronous MOSFET that lets the bootstrap voltage reach the logic supply voltage, VCC, allowing the driver to operate from a single supply without a low dropout regulator (LDO).

The STDRIVEG600 has dV/dt immunity of ±200V/ns for dependable gate control in challenging electrical environments. The logic inputs are CMOS / TTL -compatible down to 3.3V for easy interfacing with a host microcontroller or DSP. The high side section withstands up to 600V, allowing use in applications with a high voltage bus up to 500V.

In addition, the outputs have 5.5 / 6.0A sink / source capability and provide separated turn-on and turn-off pins. As a result, designers can choose the optimum way to control the gate. Both the high side and low side circuits support Kelvin connection to the power switch source for enhanced control. Dedicated ground and supply voltage connections for the low side driver ensure stable switching with the Kelvin connection and allow a shunt resistor to be used for current sensing without additional isolation or input filtering.

Built-in safety functions include under-voltage lockout (UVLO) on both the lower and upper driving sections to prevent the power switches from operating in low efficiency or dangerous conditions. There is also interlocking to avoid cross-conduction, as well as over-temperature protection. A dedicated pin for shutdown functionality is also available.

The STDRIVEG600 can be used in applications such as high voltage PFC, DC/DC, and DC/AC converters, switched mode power supplies, UPS systems, solar generators, and motor drivers for home appliances, factory automation and industrial drives.

The STDRIVEG600 is in full production and available as a 16-pin SO16 device.

Two development boards are available. The first is the EVSTDRIVEG600DG which contains a 150mOhm 650V GaN HEMT in 5.0 x 6.0mm PowerFLAT package with Kelvin source. The second is the EVSTDRIVEG600DM which comes with a STL33N60DM2 MDmesh 115mOhm 600V silicon power MOSFET with fast recovery diode in 8.0 x 8.0mm PowerFLAT with Kelvin source or alternative DPAK package.

http://www.st.com/gandrivers

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Thermal imager has embedded image signal processing and lens option

Wed, Sep 01, 2021

Branching out from infra red detectors for aerospace, defence and commercial markets, Lynred has introduced its first thermal imager with embedded image signal processing. The ATI320 has a lens available as an option. It is intended to appeal to camera makers wishing to save time and effort in integrating thermal imaging during the development and manufacturing process.

Lynred claims that the ATI320 simplifies the calibration process during camera assembly, removing complex steps for integration.

Jean-Yves Dussaud, chief marketing officer at Lynred, commented: “This advanced thermal imager is the culmination of . . . know-how and dexterity in developing image processing solutions, electronics and software for our microbolometer technology, in which we have a 20-year legacy.”

The ATI320 is particularly suitable for camera makers in industrial, consumer equipment and safety across a range of activities. One example is in unmanned aerial vehicles (UAVs) for aerial thermal inspection, where thermal imaging is required to be compact, lightweight and with low power consumption. The ATI320 provides the calibration, the associated image processing algorithms and a lens, when required.

Measuring 16 x 16mm, the ATI320 is claimed to be the most compact QVGA (320 x 240 pixels) resolution thermal imager available. It is supplied in a ruggedised housing. There are two models: with a lens (ATI320L) and without (the ATI320S). the imager operates as a shutterless product to provide continuous image viewing. This is an important function for the leisure, firefighting and security-surveillance market applications, noted Lynred.

The ATI320 offers more flexibility in camera designs than competing alternatives, because manufacturers can choose and optimise where to place ATI320 within the camera.

The imager has a noise equivalent temperature difference of f/1, 300 K scene, 20 degrees C ambient for ATI320S version and operates at a temperature range of -40 to +85 degrees C.

It is fully digital, with power consumption up to 400mW, when an image signal processing is fully activated. It complies to Mil-Std-810/883. The ATI320S weighs less than 3g and the ATI320L version weighs less than 7g.

Lynred and its subsidiaries, Lynred USA and Lynred Asia-Pacific, design and manufacture infra red technologies for aerospace, defence and commercial markets. The company has a portfolio of infra red detectors that covers the entire electromagnetic spectrum from near to very far infra red. The Group’s products are at the centre of multiple military programs and applications. Its infra red detectors are used in commercial thermal imaging equipment sold across Europe, Asia and North America. The organisation is the leading European manufacturer for infra red detectors deployed in space.

http://www.lynred.com

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Anritsu upgrades Network Master Pro with 400GbE measurement

Wed, Sep 01, 2021

Simultaneous dual-port 400GbE and 200GbE measurement is supported by the portable 400G network tester MT1040A-020. The 400G dual / 100G quad channel option offers upgraded functions to Anritsu’s Network Master Pro.

Installing the MT1040A-020 option in the MT1040A supports simultaneous dual-port 400G Ethernet (400GbE) measurements using a combination of two 400G measurement modules. Data transmission and receiving (Tx and Rx) tests can be performed simultaneously making it possible to test networks and also measure the latency and execute quality tests of 400G equipment using a single MT1040A unit. Additionally, testing of 200GbE used in data centres is also supported.

The upgrade to support 400GbE is in response to customers’ requirements to deploy and operate high-speed networks.

The introduction of 5G services, increased cloud computing, as well as a rapid increase in teleworking, has driven requirements for increased network speeds and larger data capacities, explained Anritsu. 400GbE can reinforce these networks but to configure stable, high speed, large capacity networks, equipment must be assured beforehand. At the same time, reducing network costs, while increasing complexity of network functions and test items demands evaluation of network equipment.

The 400GbE Network Master Pro MT1040A is a portable tester for evaluating the communications quality of various network types operating at speeds ranging from 10Mbits per second to 400Gbits per second. The stackable measurement modules can be configured to support simultaneous dual-port 400GbE measurements using a combination of two 400G measurement modules, for quality tests (for example bit error rate or BER, throughput, frame loss/latency) of 400GbE equipment. The MT1040A also supports 200GbE, offering network operators a cost-effective, all-in-one quality tester, added Anritsu.

The unit has a useful, automatic, one-button test function for pass / fail evaluation of multiple test results.

Anritsu has provided innovative communications test and measurement solutions for 125 years. Anritsu’s philosophy engages customers as true partners to help develop wireless, optical, microwave / RF, and digital solutions for R&D, manufacturing, installation, and maintenance applications, as well as multi-dimensional service assurance solutions for network monitoring and optimisation.

Anritsu also provides precision microwave / RF components, optical devices, and high-speed electrical devices for communication products and systems.

The company develops advanced solutions for 5G, M2M, IoT, as well as other emerging and legacy wireline and wireless communication markets.

http://www.anritsu.com

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SOM-5883 COM is engineered for graphics performance

Single-chip GaN gate driver accelerates automation, says STMicroelectronics

Thermal imager has embedded image signal processing and lens option

Anritsu upgrades Network Master Pro with 400GbE measurement

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