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i.MX 8XLite applications processor focus on secure V2X and industrial IoT applications

Fri, Oct 08, 2021

From NXP Semiconductors comes the release of the i.MX 8XLite applications processor focused on secure V2X and industrial Internet of Things (IoT) applications. The SoC features NXP’s integrated EdgeLock security and is targeted at meeting FIPS 140-3 while simultaneously executing complex cryptography and processing telematics data.

FIPS 140-3 is a US government security standard for cryptographic modules used in various applications, including V2X and critical infrastructure applications.

The applications processor offers carmakers the opportunity to expand V2X benefits to entry level vehicles. It enables fleet management for automated vehicles and, says NXP, reduces operational costs via enhanced traffic control, improved traffic flow and optimised path planning. Industrial IoT developers can leverage the SoC in secure wireless, Ethernet and control area networking applications such as industrial vehicle management, building control and safety systems, solar power generation, EV charging stations and access controllers.

The i.MX 8XLite SoC is a member of the i.MX 8 series of applications processors, purpose-built with a V2X accelerator, which can be leveraged as part of NXP’s RoadLink V2X solution or as a standalone accelerator. Its vehicle-to-infrastructure capability helps vehicles communicate with roads, bridges and roadside units to obtain information about road conditions ahead. Its car-to-car communication enables cars to communicate via wireless technologies such as IEEE® 802.11p, 5G and cellular, creating a network of similarly equipped vehicles to “see” further ahead.

“We believe road safety is for everyone, and it should scale across vehicles and devices,” said Dan Loop, general manager, automotive edge processing, NXP. “The i.MX 8XLite SoC offers the security and performance needed to expand the safety benefits of V2X into entry level vehicles and into exciting new realms of unmanned industrial delivery and drone applications.”

NXP Semiconductors is driving innovation in the automotive, industrial and IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has approximately 29,000 employees in more than 30 countries and posted revenue of $8.61 billion in 2020.

For more information go to http://nxp.com/iMX8XLite

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TDK offers miniaturised, highly sensitive MEMS pressure sensor element

Fri, Oct 08, 2021

Designed to measure a range of 0 to 100 mbar, TDK Corporation’s C35 type pressure sensor element combines high sensitivity with low dimensions of 2.05 x 2.05 x 1.2 mm, enabling compact pressure sensor designs.

The pressure sensor element with ordering code B58601E35 works according to the piezoresistive principle via a Wheatstone bridge and is certified for an operating voltage of up to 10 V.

Offering a high sensitivity of 110 mV/V/bar, C35 is suitable for applications with high demands of sensitivity, accuracy and long-term stability of 0.1% FSON.

Furthermore, C35 is designed for a wide temperature range from -40 degrees C to +150 degrees C and is suitable for pressure measurements of non-aggressive gases and liquids. The main uses are in applications that require high reliability and extremely precise pressure measurement, such as medical engineering and the industrial and automotive sectors.

TDK Corporation is a leader in electronic solutions for the smart society based in Tokyo, Japan. It was established in 1935 to market ferrite, a key material in electronic and magnetic products.

The company’s portfolio features passive components such as ceramic, aluminum electrolytic and film capacitors, as well as magnetics, high-frequency, and piezo and protection devices. The range of products also includes sensors and sensor systems such as temperature and pressure, magnetic and MEMS sensors.

In addition, TDK provides power supplies and energy devices and magnetic heads. These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda.

TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America.

In fiscal 2021, TDK posted total sales of $13.3 billion and employed about 129,000 people worldwide.

For more information go to

https://www.tdk-electronics.tdk.com/en/pressure_sensor_elements

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Microchip and Acacia link to support bandwith growth

Thu, Oct 07, 2021

Data Centre Interconnect (DCI) and metro optical transport network (OTN) platforms are transitioning from 100/200G to 400G pluggable coherent optical modules to support bandwidth growth driven by the expansion of data centres and 5G network buildouts. Microchip Technology and Acacia, part of Cisco, are supporting this transition by bringing to market interoperable solution sets consisting of Microchip’s DIGI-G5 OTN processor and META-DX1 terabit secured-Ethernet PHY and Acacia’s 400G pluggable coherent optics.

The aim of the collaboration is to establish an ecosystem to support 400G CFP2-DCO, QSFP-DD and OSFP modules for the 400ZR specification as well as the OpenZR+ and Open ROADM multi-source agreement (MSA) applications.

For converged packet/OTN optical platforms, Microchip’s DIGI-G5 and Acacia’s 400G CFP2-DCO module are designed to enable terabit-class OTN switching line cards, muxponders, and switchponders. The DIGI-G5 interoperates with Acacia’s 400G CFP2-DCO module using a Flexible OTN (FlexO) or NxOTU4 interface to efficiently support OTN traffic, including Open ROADM MSA interface modes and 200G/400G ITU-T standards currently being drafted.

For compact modular optical systems, Microchip’s META-DX1 and Acacia’s 400ZR and OpenZR+ modules are designed to enable 400G flexible line rate muxponders/transponders with support for multiple client optics types including QSFP28, QSFP-DD, and OSFP modules, helping service providers to transition from 100 GbE to 400 GbE using the same hardware.

For data centre routing and switching platforms, Microchip’s META-DX1 and Acacia’s 400ZR and OpenZR+ modules are designed to enable dense 400 GbE or FlexE with per port MACsec encryption coherent line cards. This helps customers leverage IP routers/switches over DWDM (IPoDWDM) infrastructure in DCI deployments.

“DIGI-G5 and META-DX1 have enabled our optical transport, IP routing and Ethernet switching customers to implement a new class of multi-terabit OTN switching and high-density 100/400 GbE and FlexE line cards that deliver on stringent packet timing and integrated security capabilities for the build out of cloud and carrier 5G-ready optical networks,” said Babak Samimi, vice-president for Microchip’s communications business unit. “Our interoperability efforts with Acacia help to demonstrate that an ecosystem for volume deployment of these new line cards with pluggable 400G coherent optics exists.”

“With Acacia’s 400G coherent modules verified to interoperate with Microchip’s DIGI-G5 and META-DX1 devices, we see it as a robust solution designed to address network capacity growth and improved efficiency,” said Markus Weber, senior director DSP, product line management of Acacia, now part of Cisco. “The compact size and power efficiency of our 400G OpenZR+ CFP2-DCO modules were designed to help network operators deploy and scale capacity of high-bandwidth DWDM connectivity between data centres and in metro networks.”

For more information go to http://www.microchip.com and http://www.acacia-inc.com/products

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AR0821CS image sensor delivers in challenging light conditions

Thu, Oct 07, 2021

The AR0821CS image sensor from ONsemi provides high-quality images in challenging lighting conditions. These applications include scanners and/or readers, machine-vision cameras, high-end drones, dashboard cameras, and smart building surveillance/security systems.

The AR0821CS delivers 4K video with 8.3 MP resolution at 60 fps while consuming low power. The advanced sensor includes a 2.1 micro-Ohmn DR−Pix backside illuminated (BSI) pixel design exclusive to ONsemi, which enables high-quantum efficiency, as well as on-chip HDR (eHDR) technology that delivers dynamic range in excess of 140 dB.

A high-quality pixel design delivers detailed images even in bright daylight or low light conditions. With multiple subsampling modes, the AR0821CS optimises the amount of data transmitted to provide images at a faster rate as needed by the intended application.

The AR0821CS is supported by the AP1302 co-processor and by image signal processor (ISP) and system-on-chip (SoC) devices from ONsemi technology partners. The DevSuite software provides an integrated platform to develop AR0821CS-based camera systems. Within the DevSuite software, ONsemi provides custom firmware to enable system developers to complete their camera designs with minimal effort.

Alongside ONsemi development resources, the AR0821CS has been designed into Basler’s dart family of area scan camera modules. The dart camera series enables a wide range of image processing applications and offers the latest machine vision technology in a small format.

“The integration of the new AR0821CS sensor from ONsemi into our dart camera family is a significant step toward having a superior solution component for customer projects with HDR requirements. We have already noticed that the high-performance sensor is important for the successful implementation of new applications in light-sensitive conditions,” said Malene Fricke, head of module business at Basler.

The AR0821CS is now in production and is available through local ONsemi sales support and authorised distributors.

With a focus on automotive and industrial end-markets, ONsemi is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.

For more information go to https://www.onsemi.com

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i.MX 8XLite applications processor focus on secure V2X and industrial IoT applications

TDK offers miniaturised, highly sensitive MEMS pressure sensor element

Microchip and Acacia link to support bandwith growth

AR0821CS image sensor delivers in challenging light conditions

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