Video analytics software development kit supports AI models

Video decoding, pre-processing, artificial intelligence (AI) inference, tracking and post-processing are enabled with the latest Vitis Video Analytics software development kit (SDK), announced by Xilinx.

It is a complete software stack for intelligent video analytics applications on Xilinx platforms, deployed edge-to-cloud. The end-to-end video analytics supports widely used AI models such as YOLO, SSD, ResNet, Inception, RefindDet, ReID, FPN and OpenPose for real-time objection detection, classification and segmentation.

The software development kit provides the foundational layer for video analytic applications such as understanding vehicle and pedestrian traffic patterns in smart cities, health and safety monitoring in hospitals, self-checkout and analytics in retail, and detecting component defects at manufacturing facilities.

In provides a complete framework for developers to create generic infrastructure plugins, software acceleration libraries, and an interface to develop a custom acceleration library to control a custom hardware accelerator. The SDK builds on top of and abstracts the complex interfaces of Xilinx Run Time (XRT) and Vitis AI tools, making it easy for developers to build video analytics and transcoding pipelines without having to learn the complexities of XRT and Vitis AI tools.

To meet the evolving requirements and demands of video and vision applications such as smart cameras, industrial vision systems, automotive driver assistance and autonomous driving, smart retail and security, broadcast, professional AV and consumer products like TV and gaming applications, Xilinx says it has expanded its video and imaging IP portfolio for UltraScale+ and Versal devices.

The company enables 8K video capture and 8K display with what is believed to be the industry’s first HDMI 2.1 and DisplayPort (DP) 1.4 with UltraScale+ and Versal products. Combining HDMI 2.1 or DP 1.4 with the 8K scaler and mixer IP allows customers to build an end-to-end 8K video pipeline. For immersive gaming experiences, Xilinx’s video and imaging portfolio now includes high dynamic range (HDR), high frame rates and variable refresh rate formats and adaptive sync across the UltraScale+ and Versal families.

Xilinx has also added capabilities in the video IP, including 4k60 Warp with horizontal and vertical keystone correction, lens distortion correction, rotation and arbitrary warp for video walls, advanced conferencing cameras, projectors and applications in automotive.

There are also further Vitis Vision libraries for developers across automotive, industrial machine vision and smart camera applications, which includes image signal processing (ISP) with HDR and pre- and post-processing functions for machine learning (ML) neural networks with the OpenCV API.

The company has also announced the Vivado release 2021.2 will support 4:4:4 YUV colour space within the Xilinx Zynq UltraScale+ EV family. It is expected to be released by end of year.

http://www.xilinx.com

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Sondrel integrates Arm security in quad-core IP

A quad-core IP platform, the SFA 200, can be used for ASIC in remote gathering and processing of video and data at the edge. In addition it has secure onwards transmission of results, says Sondrel. The resulting, single channel ASICs can be arrayed to form scalable processing. Additional features can be added to meet specifications in smart metering, smart homes, smart factories, voice-controlled devices and infotainment.

Each ASIC is based on a CPU cluster for general purpose tasks and an AI cluster for neural network tasks with supporting memory and interfaces. The CPU cluster of nominally four Arm CPU cores, provides processing by using either an Arm A53 or A55 with 9 to 10 GMIPS at 1GHz nominal. The neural net cluster is based on either Arm’s Ethos cores or DSP-AI cores providing nominally 4TOPS performance. Alternatively, custom AI cores can be integrated if required.

The chip design has a composable network on chip (NoC) system fabric, multi-path, multi-width (64 to 512bit) data path at a nominal 800MHz. The system management subsystem (SMS) manages the configuration, start-up (boot) and operation modes of the SoC and there is active power management for low or battery powered applications.

The integral security subsystem uses either an Arm A53 or M33, as the application demands, to provide activity / intrusion monitoring, software signing and crypto, and authentication to resist hacking, which is enhanced by watchman behaviour tracking and deviation detection.

Customers can add their own or application-specific, off the shelf IP to create the final ASIC. This provides a low risk, faster time to market that can reduce design costs by up to 30 per cent, said Sondrel. To further reduce risk and time to market, Sondrel offers a full turnkey service that turns designs into fully tested, shipping silicon.

Founded in 2002, Sondrel acts a partner for customers, handling every stage of an IC’s creation. The define and design ASIC consulting capability offers turnkey services to transform designs into tested, volume-packaged silicon chips.

Headquartered in the UK, Sondrel supports customers around the world via its offices in China, India, Morocco and North America.

http://www.sondrel.com

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PICO-ITX board powers industrial AI and machine vision, says Aaeon

Equipped with the 11th generation Intel Core U processors, the PICO-TGU4 is the latest PICO-ITX board from Aaeon. It is intended for industrial artificial intelligence (AI) and machine vision applications.

The 11th generation Intel Core processors (formerly Tiger Lake) are based on Intel’s 10nm microarchitecture, delivering up to 15 to 20 per cent better performance than the previous generation processors. The PICO-TGU4 is available with Intel Core U i3 / i5 / i7 or Intel Celeron processors. All of these processors support data integrity, accuracy and security, including on-board TPM 2.0 and in-band memory error code correction (ECC) with selected models. There is also up to 32Gbyte of on-board LPDDR4x memory, making the PICO-TGU4 capable of deployment in a wide range of embedded and edge computing applications, said Aaeon.

The PICO-TGU4 has two expansion slots which can be used to add functionality to power AI edge applications. The M.2 2280 slot delivers PCIe 4.0 [x4] speeds, for AI accelerator cards such as the AI Core XM2280, as well as providing the throughput needed to support the next generation of AI accelerators. The full-sized Mini Card (mPCIe) slot has support for AI accelerators, wireless modules such as Wi-Fi or LTE, expanded storage with mSATA support and 30-bit digital I/O cards.

The PICO-TGU4 offers a broad I/O layout allowing the board to easily connect to a wide range of sensors and devices or integrate with projects. There are eight USB connections, made up of two USB3.2 Gen 2 type A ports, two USB3.2 Gen 1 headers and four USB2.0 headers. There are also two serial port headers and 8-bit GPIO and I2C/SMBUS connectors.

The PICO-TGU4 also features dual LAN ports, one Intel i225 2.5Gbits per second port for fast LAN connectivity and an Intel i219 port with support for Intel vPro, enabling remote system monitoring. Storage includes both SATA III (6.0Gbits per second) and support for Mini Card mSATA storage. Additionally, there are eDP and HDMI 2.0 ports for 4K 60Hz resolution.

The PICO-TGU4 is backed by Aaeon’s expertise in building compact, rugged solutions to operate in a wide range of industrial and other environments. Aaeon also offers a range of manufacturer and OEM/ODM services, from customising board layouts to helping developers create a board level solution that fits application requirements.

Established in 1992, Aaeon designs and manufactures industrial IoT and AI edge  computing platforms including industrial motherboards and systems, rugged tablets, embedded AI edge systems, uCPE network appliances, and LoRaWAN / WWAN.

The company is an Associate member of the Intel Internet of Things Solutions Alliance.

http://www.aaeon.com

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Sensor evaluation board accelerates IoT development, says Bosch Sensortec

R&D effort can be simplified to assist rapid prototyping and reduce time to market for the segmented IoT market, using the Application Board 3.0, says Bosch Sensortec. It offers Bluetooth connectivity and a small form factor for IoT applications and supports the full range of Bosch Sensortec sensors

The Application Board 3.0 simplifies the evaluation and prototyping of sensors for a wide range of applications, particularly in Industry 4.0, IoT, smart home systems, and wrist- and head-mounted wearables, explained Bosch-Sensortec.

Any Bosch Sensortec sensor mounted on a ‘shuttle board’ is simply plugged into the socket on the Application Board. All shuttle boards have an identical footprint, and Bosch Sensortec’s software automatically detects which sensor is plugged in at any given moment to launch the appropriate software. This enables the straightforward evaluation of a wide range of sensors and solutions, said Bosch Sensortec. Prototypes can be built to quickly test different use case configurations, added the company.

 The board measures just 47.0 x 37.0 x 7.0mm3, which is practical for evaluating sensors used in portable applications, observed Bosch Sensortec. The board can be powered using a 3.7V Li-ion battery or a standard 5V USB power supply.

“The Application Board 3.0 makes it quick and easy for developers to build their projects with any of our sensors on a single platform, meaning that they can now focus on creating unique use cases and differentiating their products,” says Dr. Stefan Finkbeiner, CEO at Bosch Sensortec. “Our customers also benefit from efficient support through regional field application engineers and Bosch offices,” he continued.

The integrated development environment (IDE) software provided with the board includes a simplified graphical user interface (GUI) to evaluate and tune sensor parameters, as well as to visualise and record sensor data. The software also saves time in troubleshooting sensor-related issues, claims Bosch Sensortec.

Application Board 3.0 is designed around the u-blox NINA-B302 Bluetooth Low Energy (BLE) module and is based on the nRF52840 chipset from Nordic Semiconductor, which includes an Arm Cortex-M4F CPU. It is certified and compliant with multiple directives for different international regions: CE, RoHS, China RoHS, FCC, IC, VCCI, SRRC and NCC.

The board is supplied with 256kbyte RAM, 1Mbyte of internal flash and 2Gbyte of external flash memory for data logging. It provides full-speed micro-USB 2.0 connectivity and BLE to connect to a host, such as a PC, for transferring the logged sensor data from the board.

The Application Board 3.0 is available now.

http://www.bosch-sensortec.com

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