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R&S FSPN offers dedicated phase noise analysis and VCO testing

Wed, Oct 06, 2021

For high speed, real-time phase noise measurements using sources that require high stability in demanding applications, the new R&S FSPN phase noise analyser and VCO from Rohde & Schwarz offers sensitivity, accuracy and reliability.

Rohde & Schwarz designed the new R&S FSPN phase noise analyser and VCO tester for production and design engineers who characterise sources such as synthesizers, VCOs, OCXOs, and DROs. Providing high sensitivity and measurement speed, the R&S FSPN suits demanding phase noise and VCO analysis in development and production.

The R&S FSPN comes in two models, one covers the frequency range from 1 MHz to 8 GHz and the other from1 MHz to 26.5 GHz, addressing radar and satellite applications in the C band, X band, Ku band, and the complete K band.

Catering to measurement challenges in these fields, the R&S FSPN expands the Rohde & Schwarz phase noise product portfolio which already contains the R&S FSWP phase noise spectrum and signal analyser.

The R&S FSPN shares R&S FSWP features such as low noise internal local oscillators coupled with real-time cross correlation engines for increased measurement sensitivity.

Cross-correlation sensitivity gains can be viewed in real-time in result traces, allowing users to adjust the trade-off between measurement speed and sensitivity to meet their application requirements.

Users in production need just a few correlations to measure high-quality oscillators, synthesizers or VCOs with high throughput. By increasing the number of correlations, users in research and development can characterise the most sensitive commercially available synthesisers and oscillators. Simultaneous device frequency and phase settling times can be measured with up to 8 GHz of real-time analysis bandwidth.

To investigate oscillator long-term frequency stability, the R&S FSPN calculates the Allan variance in the time domain at fixed intervals and uses phase noise measurements to apply cross-correlations and suppress spurs.

The analyser is also equipped with three ultra-low-noise DC sources to supply and sweep VCOs. The built-in VCO characterisation measurement mode analyses VCO characteristics such as frequency, sensitivity, RF power or current draw versus tuning voltage.

For more information go to https://www.rohde-schwarz.com/product/fspn

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OKW boosts enclosure range with larger sizes

Wed, Oct 06, 2021

OKW has added four sizes to its EasyTec range of fast-mount flanged enclosures. The new larger sizes suit more complex applications that require extra installation volume, such as IT network technology and smart factory sensor equipment.

These flanged enclosures are said to offer good stability. The flat base has a curved recess for secure pole mounting. Integrated mounting lugs feature apertures for cable ties and holes for panhead screws and there is a soft contoured top.

Internal screw pillars in the top and base enable EasyTec to accommodate two PCBs. Tamperproof stainless steel Torx assembly screws suit the housings to medical electronics.

EasyTec can be mounted quickly and easily on poles or flat surfaces in challenging industrial environments – either indoors or outdoors. Applications include IoT/IIoT, sensor systems, security and monitoring, stock control, environmental, medical and laboratory technology.

The enclosures come in four plan sizes, the original 80 and 100 and now 125 and150. Each plan size comes in two heights, giving a range of eight sizes from 101 x 50 x 22 mm to 172 x 93 x 46 mm. The enclosures are moulded from tough and UV-stable ASA+PC-FR (UL 94 V-0) in off-white (RAL 9002) as standard.

Prices start at £16. Accessories include IP 65 seals, 2.5 x 6 mm self-tapping screws (PZ1 and Torx T8) and a Torx T8 screwdriver.

Customising options include CNC machining, lacquering, printing/laser marking of legends and logos, EMC shielding, installation and assembly.

For more information go to https://www.okw.co.uk/en/Plastic-enclosures/Easytec.htm

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EasyPack 2B EDT2 power module for traction inverters up to 50 kW

Tue, Oct 05, 2021

Infineon Technologies has launched the automotive qualified EasyPack 2B EDT2, a flexible and scalable half-bridge power module. Depending on inverter conditions, this 750 V device can reach a maximum power of up to 50 kW and 230 A RMS. The module is optimised for inverter applications in hybrid and electric vehicles.

With the introduction of the EDT2 (electric drive train) technology in this package and full automotive qualification, Infineon is now expanding the application range of the module family to include traction inverters.

The key feature of the EDT2 technology is the higher efficiency at low-load conditions. An EDT2 chip helps ensure significantly lower losses than current products on the market, says Infineon, and outperforms Infineon’s previous chip generation by 20 per cent.

Plug-and-play simplifies integration and compared to the classic through-hole discrete packages, as well as the  HybridPack 1, there Is no longer a need to solder pins.

Infineon’s PressFIT contact technology enables a reduction in mounting time and the compact package size means three EasyPack 2Bs need 30 per cent less surface area than a HybridPack 1.

The EasyPack 2B EDT2 is fully qualified to the AQG324 standard.

Over the past 10 years, Infineon has sold more than 50 million EasyPack module with various chip sets for a range of industrial and automotive applications.

The new EasyPack 2B EDT2 module FF300R08W2P2_B11A will be available starting in this month.

For more information go to http://www.infineon.com/easyinverter

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Impulse Embedded supplies Vecow’s EAC-2000 AI series

Tue, Oct 05, 2021

Impulse Embedded is now supplying the EAC-2000 series from Vecow. These compact, high-performance Edge intelligence systems use the NVIDIA Jetson Xavier NX SOM chip.

The series offers power efficiency in a rugged enclosure with wide temperature and DC power input ranges suitable for AI Vision projects, as well as industrial applications including traffic vision, intelligent surveillance, auto optical inspection, Smart Factory, AMR or AGV.

The NVIDIA Jetson Xavier NX System on Module (SOM) is a 15W processing unit that is built around a 384 Core NVIDIA Volta GPU, with 48 Tensor cores and a Hexa-core NVIDIA Carmel ARM V8.2 64-bit CPU with 6MB of L2 cache.

Capable of offering 21 TOPs of GPU accelerated performance, the Xavier NX can decode up to four 4K30 HEVC video streams while running modern neural networks in parallel. The EAC-2000 series is ready to be deployed out of the box as the Jetson Xavier NX also ships complete with 8GB of LPDDR4x of system memory and 16GB of eMMC storage.

NVIDIA’s Jetpack software suite means the EAC-2100 can be deployed with any application that was developed on a Jetson development kit.

The EAC-2000 is targeted at Edge AI demands and is powered by the NVIDIA Jetson Xavier NX. Packed with I/O, the EAC-2000 comes with one HDMI display port, two Gigabit PoE+ ports with 25W per port, dual Gigabit Ethernet, four USB3.1 and two serial ports.

For wireless connectivity, there is an M.2 E-key for wi-fi and Bluetooth, and an M.2 3042/3052 B-key slot that can support up to 5G cellular comms along with SIM card support and six antenna breakouts. For storage, in addition to the onboard 16GB eMMC included, there is an M.2 2280 M-key, plus an external SD card slot offering a variety of options.

The EAC-2100 expands on the feature set provided by the EAC-2000 and focuses more on in-vehicle usage, with the addition of CANbus support, four Fakra-Z connections for GMSL automotive cameras, and two Gigabit PoE+ ports.

Both models come in a compact wall-mountable metal chassis with EN 50155 and EN 50121-3-2 certification for EMC, a wide -20 degrees C to +70 degrees C operating temperature and 9V to 50V DC power input to meet the demands of a range of industrial automation and Edge applications, as well as support for the rail and in-vehicle market.

For more information go to http://www.impulse-embedded.co.uk

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