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Secure microcontroller harvest energy for biometric cards

Tue, Nov 30, 2021

Energy harvesting and biometric security technologies are integrated in the ST31N600, a secure microcontroller from STMicroelectronics. It is based on an Arm SecurCore processor and can be used in biometric system-on-card (BSoC) and dynamic card verification (dCVV) systems, says the company.

The microcontroller is launched at this week’s Trustech 2021 and is designed for security in contact and contactless payment cards, ID cards, and transport ticketing.

The ST31N600, based on ST’s 40nm eSTM technology, integrates circuitry for energy harvesting and additional connectivity used by biometric and dynamic card verification (dCVV) applications. It enables battery-free smartcards to provide enhanced user authentication in contactless and online transactions. Based on the latest-generation Arm SecurCore architecture for secure microcontrollers, the ST31N600 meets EMV ISO 7816, ISO 14443, and ISO 18092 standards for contact and contactless cards. Designers can use the microcontroller to securely connect various types of peripherals to introduce value-added card features.

At Trustech 2021, it will be used to demonstrate secure biometric payment based on STPay-Topaz-Bio and dCVV for safe online transactions.

STPay-Topaz-Bio is a payment system that combines the security of biometric cardholder authentication to the speed and convenience of contactless transactions. This BSoC is based on the ST31N600 with a low power STM32L4 microcontroller, both embedded in an EMV (Eurocard Mastercard Visa) module. The ST31N600 hosts payment applications, biometric-template matching and energy harvesting to power the system.

The ST31N600 is also suitable for ecommerce payment based on dCVV technology, which provides a dynamic code refresh on each EMV transaction without needing an external battery or clock timer.

ST is showing the BSoC based on Linxens’ EMV module and pre-laminated inlay combined with a FPC T-Shape 2 (T2) sensor module from Fingerprint Cards.

There is also the dCVV which has the Ellipse EVC All-in-One, the first EMV micromodule with an integrated screen to display a dynamic security code for eCommerce protection.

Samples of the ST31N600 are available now.

http://www.st.com

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Bluetooth Low Energy microcontroller sets record for power efficiency

Tue, Nov 30, 2021

Smart sensing is incorporated in the RSL15 wireless microcontroller. According to onsemi it provides the industry’s lowest power consumption. It has Bluetooth Low Energy wireless connectivity and is designed to address the growing demand of secure, connected industrial applications which do not sacrifice.

The RSL15 supports a number of new capabilities provided by the Bluetooth 5.2 specification, including longer range, higher data transmissions and localisation through angle of arrival (AoA) and angle of departure (AoD). onsemi has also developed an innovative smart sensing feature that allows the Arm Cortex-M33 processor to remain in a deep sleep mode while still monitoring sensor interfaces.

To validate energy efficiency, the RSL15 was certified by the Embedded Microprocessor Benchmark Consortium (EEMBC). The organisation’s ULPMark-CoreMark benchmark programme measures the energy efficiency of microcontrollers used in embedded systems while active. Onsemi reports that the RSL15 leads its class by attaining a score of 60.5. The ULPMark- CoreProfile benchmark calculates the deep sleep efficiency of microcontrollers and places onsemi’s RSL10 and RSL15 in the top two spots.

“From beacons for contact tracing to trackable asset tags, there are millions of connected devices globally operating off of small batteries,” said Patrick Moorhead, CEO, founder and chief analyst at Moor Insights & Strategy.

The RSL15 is designed with ArmTrustZone technology to establish device root of trust as well as Arm CryptoCell-312 technology to protect the authenticity, integrity and confidentiality of code and data. This PSA Level 1-certified design enhances the security measures which is already offered as part of the Bluetooth protocol, providing assurance at both the application and software levels.

“The ability to protect against cyber threats is an essential differentiator for manufacturers choosing a wireless microcontroller for industrial IoT applications,” said Michel De Mey, vice president of the industrial solutions division at onsemi.

Target applications for the RSL15 are integration in a variety of industrial automation applications including connected asset tracking, smart retail and IoT edge nodes.

The RSL15 is available now in a miniature 40-pin QFN package.

https://www.onsemi.com

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GNSS modules positions vehicles within 500mm

Tue, Nov 30, 2021

High accuracy vehicle positioning which positions them to within 500mm without correction data is the claims for the UMSZ6 series of GNSS module, developed by Alps Alpine and Furuno.

Being able to realise accurate positioning to within 50cm without correction data is a first for automotive applications, says Alps Alpine. Typical roads are approximately three metres wide which enables the module to reliably position vehicles within a lane for V2X applications and autonomous driving. Mass production is scheduled for 2023 and in the time leading up to the commercial availability, the partners say they will be making efforts to enhance the performance with evaluations and demonstration testing.

In the autonomous driving domain, a growing number of vehicles on the road have Level 2 automated driving capability, allowing them to autonomously follow the vehicle in front under certain conditions while staying in their lane. Cars capable of Level 3 automated driving, where the system carries out all driving tasks but under restricted conditions, such as during motorway or low speed driving, have also been developed and some are already on the market, says Alps Alpine. The spread of Level 3 autonomous vehicles and further advances in autonomous driving functionality will depend on the availability of vehicle positioning that is more user-friendly and even more accurate, believes the company.

The UMSZ6 Series GNSS Module realises high-accuracy vehicle positioning to within 500mm even without having to use position correction data through the use of a multi-frequency GNSS receiver chip based on Furuno’s Extended Carrier Aiding technology. Running costs associated with RTK4 base stations, correction data receiving and correction data use are no longer needed.

The jointly developed module uses Alps Alpine’s expertise in module creation for the compact dimensions of 17.8 x 18.0 x 3.11mm.

Furuno has developed and supplies the eRideOPUS 9 (model ePV9000B) multi-frequency GNSS receiver chip and algorithm. Alps Alpine is using the chip before anyone else to create and commercialise the UMSZ6 series GNSS module. It will carry out evaluations within a real-car environment to assess performance and interoperability with V2X and other communication modules.

Hideo Izumi, vice president, device business, Alps Alpine, commented: “Relative vehicle positioning accuracy is constantly improving as a result of mmWave radar, lidar and camera technology. Achieving absolute position accuracy down to the lane level is essential for both V2X applications and genuine Level 3 automated driving, but system-related costs associated with RTK technology have been an obstacle” He believes the combination of the multi-frequency GNSS receiver chip based on Furuno’s Extended Carrier Aiding technology, will be a breakthrough in V2X and advanced autonomous driving technology.

The GNSS module can be used for telematics control units and V2X onboard units.

http://www.alpsalpine.com

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HOB-P high bandwidth current sensor suits SiC MOSFET applications

Mon, Nov 29, 2021

For current sensing in some of the harshest environments, LEM has announced the high bandwidth (1MHz) open loop HOB-P series of sensors.

The addition to its range of sensors is claimed to offer the industry’s best performance across four nominal currents. The low power consumption HOB-P sensors were developed specifically to meet high bandwidth sensing requirements when using fast-switching silicon carbide (SiC) MOSFETs in high-voltage pulsed-power circuits where fast and flexible high-voltage pulses are essential.

They have a response time of less than 200 nanoseconds, compared to average response times of around three microseconds, says LEM. They are capable of measuring DC, AC or pulsed current up to 250A. A pick-up coil on LEM’s ASIC allows the sensors to react like a current transformer. They are suitable for wide bandgap power electronics use cases and applications that require enhanced immunity to SIC modules’ the dv/dt (acceleration) issues, delivering improved dv/dt behaviour and lower noise than other sensors on the market, claims the company.

The HOB-P operates across a wide temperature range of -40 to +105 degrees C. This means they can be specified for hand-held plasma cutters, welders and DC/DC converters. They are also suitable for uninterruptible power supplies, switched mode power supplies, AC variable speed and servo motor drives, and static converters for DC motor drives.

The HOB-P sensor is distinguished by its galvanic separation between the primary and secondary circuit, an integrated busbar and a compact design that enables space-saving through hole technology PCB mounting. LEM has introduced four models in the range, namely the HOB-P 50-P, HOB-P 75-P, HOB-P 100-P, HOB-P 130-P. All four models cover nominal currents of 50, 75, 100 and 130A RMS.

The HOB-P series of transducers is CE-marked and covered by LEM’s five-year warranty.

LEM employs 1,500 people in over 15 countries and working at the forefront of mega trends such as renewable energy, mobility, automation and digitization.

http://www.lem.com

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Secure microcontroller harvest energy for biometric cards

Bluetooth Low Energy microcontroller sets record for power efficiency

GNSS modules positions vehicles within 500mm

HOB-P high bandwidth current sensor suits SiC MOSFET applications

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