Magnachip expands OLED DDIC for automotive displays

Organic light-emitting diode (OLED) display driver integrated circuits (DDICs) from Magnachip now include models for automotive displays. 

The company has responded to an increase in demand for automotive semiconductors required for electric vehicles (EVs), autonomous driving and connected cars and their infotainment and safety systems. OLED panels offer image quality, high visibility and fast response times.

Magnachip is developing an OLED DDIC for automotive systems’ centre stack and instrument cluster displays, based on its 40nm process technology. The next-generation DDIC supports a wide range of resolutions including FHD (full high definition) and is suitable for both rigid and flexible OLED displays. The DDIC will integrate source drivers, gate drivers and timing controllers in a single chip. This feature will enable the production of cost-effective display panels consisting of fewer components, says Magnachip. 

Market research company, Omdia, expects the automotive display market to grow from $8.2 billion in 2021 to $9.7 billion in 2025. The revenue of global automotive OLED panel market reached $117 million in 2021 and it is expected to increase approximately 350 per cent to $524 million in 2025, says the company.

YJ Kim, CEO of Magnachip, believes: “Vehicles incorporating displays based on our next-generation OLED DDIC technology represents another step in improved safety, functionality and convenience for consumers.”  

The company plans to supply the new product to premium European car manufacturers in the first half of 2023.

Magnachip Semiconductor designs and manufactures analogue and mixed-signal semiconductors for communications, IoT, consumer, industrial and automotive applications. The company provides a broad range of standard products to customers worldwide. It has more than 40 years of operating history and a portfolio of approximately 1,200 registered patents and pending applications, together with extensive engineering, design and manufacturing process expertise. 

http://www.magnachip.com 

> Read More

Voice-activated medallion serves as a wireless virtual assistant 

Powered by Syntiant’s NDP101 low power edge AI processor, a medallion developed by Zinfanite Technologies acts as a virtual assistant. It provides hands-free functionality, wake word recognition and speech commands in a compact, waterproof device designed to be worn around the neck or attached to a shirt pocket or sleeve.

Used with Zinfanite’s companion smart phone application, the voice activated medallion (VAM) can be used as a wireless virtual assistant that allows users to call, send messages or listen to music with hands- and arms-free operation. The VAM also works as an Alexa-enabled device that provides access Alexa’s functions.

Jana Fernando, founder of Zinfanite Technologies, explains: “VAM easily connects via Bluetooth and gives users the flexibility of staying connected for whatever they are doing, whether it is exercising, taking a trip to the grocery store or just sitting at home relaxing listening to music. VAM also is equipped with Syntiant technology that allows for highly accurate deep learning processing with minimal drain on battery consumption, giving more time for consumers to enjoy their hands-free connectivity experiences.” 

The Syntiant® NDP101 Neural Decision pocessor enables always-on, cloud-free wake word identification and other voice commands for the Zinfanite VAM. Embedded with the Syntiant Core 1 neural network, the NDP101 microWatt-level processor achieves 100 times more efficiency and 10 times more throughput compared to traditional microcontroller-based designs, claims the company. The processor is custom built to run neural workloads and consumes less than 140 microW when running deep learning processing for voice and sensor applications.

The VAM has a range of up to 200 feet or 60 metres. It weighs one ounce or 28g and is available in a variety of styles and colours. It also has a programable tap-detection feature that allows users to control the medallion with additional commands, such as to play and pause music, as well as adjust volume levels.

It has two microphones with noise filtering technology and a built-in speaker. The Bluetooth 5.0 connected medallion allows for 16 hours of continuous talk / music listening and alerts can be customised to advise the status of battery percentage remaining, new emails or texts.

“Our voice activated medallion serves many lifestyles especially older adults, where recent studies have demonstrated the benefits of voice assistants among seniors,” adds Fernando. “One pilot study at a retirement community in California found that all survey participants reported that Alexa made their lives easier, and more than 70 percent noted that the Alexa-enabled device helped them stay connected to friends, family and the community.”

http://www.zinfanite.com

http://www.syntiant.com 

> Read More

Robotics development kit is compatible with ROS1 and ROS2

Increasing support for robotics development, TDK has introduced the RoboKit. The development kit includes a six-axis inertial measurement unit (IMU), pressure sensor, magnetometer, temperature sensor, embedded motor controller, ultrasonic time of flight (ToF) sensors and an industrial IMU sensor module.

Designed for quick prototyping and development the robotics hardware platform is accompanied by ROS1 and ROS2 -compliant drivers and software algorithms.

The RoboKit will be offered as a stand-alone development platform as well as a full robot reference design. The board will consist of the six-axis IMU (three-axis gyroscope, three-axis accelerometer), a capacitive barometric pressure sensor, four digital I²S microphones, a temperature sensor, embedded motor controller and magnetometer. There are also Bluetooth Low Energy (LE) -enabled Windows and Android apps for the sensors and algorithms evaluation and data collection.

Depending on the version, there will also be TDK’s industrial IMU sensor module via flex cables, a full robotic chassis and 3D printed casing, allowing end customers to develop a fully functional robotic reference design.

The company claims the combination of hardware from multiple TDK group companies, with software stacks and algorithms that solve real robotics problems is “a first of its kind and will help fast track robotics at any point during the development process”.

The development kit is suitable for industrial and consumer robotics and drones. It is available to order now through distribution channels worldwide, with shipping targeted for mid Q1 2022.

TDK is based in Tokyo, Japan. It was established in 1935 to commercialise ferrite, a key material in electronic and magnetic products. Today, its portfolio features passive components such as ceramic, aluminium electrolytic and film capacitors, as well as magnetics, high-frequency and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic and MEMS sensors. In addition, TDK provides power supplies and energy devices and magnetic heads. These products are marketed under the product brands TDK, Epcos, InvenSense, Micronas, Tronics and TDK-Lambda. 

TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. 

InvenSense is a TDK Group company. Its solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, microphones, and ultrasonic 3D-sensing with proprietary algorithms and firmware that intelligently process, synthesise and calibrate the output of sensors. The company’s motion tracking, ultrasonic, audio, fingerprint, location platforms and services can be found in mobile, wearables, smart home, industrial, automotive, and IoT products. 

http://www.invensense.tdk.com

> Read More

Third generation NeuPro processor architecture is released by Ceva

Intended for AI and machine learning inference workloads in automotive, industrial, 5G networks and handsets, surveillance cameras and edge computing, the NeuPro-M is the latest generation processor architecture from Ceva.

The self-contained heterogeneous architecture is composed of multiple specialised co-processors and configurable hardware accelerators that seamlessly and simultaneously process diverse workloads of deep neural networks, boosting performance by a factor of five to 15, compared to its predecessor, reports the company. Claimed to be an industry first, NeuPro-M supports both SoC as well as heterogeneous SoC (HSoC) scalability to achieve up to 1,200 Terra operations per second (TOPS). It also offers optional robust secure boot and end-to-end data privacy.

The NeuPro–M compliant processors initially include the NPM11 and NPM18 pre-configured cores. The NPM11 is a single NeuPro-M engine, offering up to 20 TOPS at 1.25GHz and the NPM18 has eight NeuPro-M engines, delivering up to 160 TOPS at 1.25GHz. A single NPM11 core, when processing a ResNet50 convolutional neural network, achieves a five-fold performance increase and six-fold memory bandwidth reduction versus its predecessor, reports the company. This results in 24 TOPS per Watt efficiency.

NeuPro-M is capable of processing all known neural network architectures, as well as integrated native support for next-generation networks like transformers, 3D convolution, self-attention and all types of recurrent neural networks. NeuPro-M has been optimised to process more than 250 neural networks, more than 450 AI kernels and more than 50 algorithms. The embedded vector processing unit (VPU) ensures future proof software-based support of new neural network topologies and AI workloads, claims the company. The CDNN offline compression tool can increase the frames per second per Watt of the NeuPro-M by a factor of five to 10 for common benchmarks, with minimal impact on accuracy, says Ceva.

The NeuPro-M heterogenic architecture is composed of function-specific co-processors and load balancing mechanisms. By distributing control functions to local controllers and implementing local memory resources in a hierarchical manner, the NeuPro-M achieves data flow flexibility that result in more than 90 per cent utilisation and protects against data starvation of the different co-processors and accelerators at any given time. The optimal load balancing is obtained by practicing various data flow schemes that are adopted to the specific network, the desired bandwidth, the available memory and the target performance, by the CDNN framework.

Architecture highlights include a main grid array consisting of 4K multiply and accumulates (MACs) with mixed precision of two to 16 bits, a Winograd transform engine for weights and activations, halving convolution time and allowing 8-bit convolution processing with less than 0.5 per cent precision degradation. A sparsity engine avoids operations with zero-value weights or activations per layer, for performance gain up to a factor of four, while reducing memory bandwidth and power consumption. 

The programmable VPU handles unsupported neural network architectures with all data types, from 32-bit floating point down to 2-bit binary neural networks (BNN). The architecture also has configurable weight and data compression down to 2-bits while storing to memory, and real-time decompression upon reading, for reduced memory bandwidth.

The dynamically configured two level memory architecture is claimed to minimise power consumption attributed to data transfers to and from an external SDRAM.

Ran Snir, vice president and general manager of the Vision Business Unit at Ceva, observes: “The . . . processing requirements of edge AI and edge compute are growing at an incredible rate, as more and more data is generated and sensor-related software workloads continue to migrate to neural networks for better performance and efficiencies. With the power budget remaining the same for these devices, we need to find new and innovative methods of utilising AI at the edge. . . [NeuPro-M’s] distributed architecture and shared memory system controllers reduces bandwidth and latency to an absolute minimum . . .  With the ability to connect multiple NeuPro-M compliant cores in a SoC or Chiplet to address the most demanding AI workloads, our customers can take their smart edge processor designs to the next level.”

For the automotive market, NeuPro-M cores and Ceva’s CEVA Deep Neural Network (CDNN) deep learning compiler and software toolkit comply with ISO26262 ASIL-B functional safety standard and meet IATF16949 and A-Spice standards.

NeuPro-M is available for licensing to lead customers today and for general licensing in Q2 2022. 

http://www.ceva-dsp.com 

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration